Ace Tech Circuit Presentation (ZIP)429-912 1254-8, Jeongwang-Dong, - - PowerPoint PPT Presentation

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Ace Tech Circuit Presentation (ZIP)429-912 1254-8, Jeongwang-Dong, - - PowerPoint PPT Presentation

Feb 29, 2024 288 likes •565 views

Ace Tech Circuit Presentation (ZIP)429-912 1254-8, Jeongwang-Dong, Siheung-si , GyeongGi-Do, Korea (New Address : 32 (#509-1Na Dong), 79 Beon-Gil, Gong Dan 1 Daero, (Jeong Wang Dong ShiWha Industrial CPLX ) Shi-Heung City, Kyoung-Ki Do, S.

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  • Rev. 5 (2013.08.08)

(ZIP)429-912 1254-8, Jeongwang-Dong, Siheung-si , GyeongGi-Do, Korea (New Address : 32 (#509-1Na Dong), 79 Beon-Gil, Gong Dan 1 Daero, (Jeong Wang Dong ShiWha Industrial CPLX ) Shi-Heung City, Kyoung-Ki Do, S. Korea ) TEL : +82-31-500-6700 (REP) FAX : +82-31-500-6699 www.atc-kr.com/eng

The motto of ATC is to make differences in providing a technical quality services. The company is carrying out and [Open Book Management, Operational Accountability, and Value Based Management], which are the corporate philosophy of

  • ATC. ATC is doing its very best efforts to gain high level of trust from its clients.

Ace Tech Circuit Presentation

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  • Rev. 5 (2013.08.08)

Ace Tech Circuit

1998 year

  • 04. Ace Tech Circuit (ATC) was

established.

  • 07. Developed Multilayer

technology up to 24 Layers.

2001 year

  • 09. Developed Multilayer up to

40Layers.

  • 11. Acquired “ISO 9001” from

Authorized Institute.

  • 12. Expanded Production Line

Capacity (MLB : 30,000㎡/month)

2003 year

  • 06. Started exporting products

to USA

2000 year

02 Incorporated from private company to public company.

2002 year

  • 02. Acquired “UL” Certification

(E225596)

  • 11. Registered as Prospective

Enterprise to Kookmin bank

2004 year

  • 05. Recognized from

Administration of Korea as “High Technical Venture Company”

  • 06. Recognized from Korea

Technology Credit Fund as “Super Technology Company”

◈ Brief Company History 1998 2000 2001 2002 2003 2004 2005

2005 year

  • 04. Moved to new factory and

increased its production capacity.

  • 04. Authorized from Government for

“R & D Institution”

  • 07. Selected as a technological

innovation Business ( Inno – Biz)

  • 10. Gained “Best Venture Grand Gold

Metal” among all Korean venture company

  • 11. Acquired “ISO14001” from

Authorized Institute.

  • 11. Gained "One million Dollar Export

Golden Tower" from Government

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Ace Tech Circuit

◈ Brief Company History

2007 year

  • 09. Gained " Promising Small &

Medium Enterprise" from Gyeong Gi local government.

  • 10. Commended by Gyeong Gi

Provincial governor as Venture Business.

2006 year

  • 11. Gained "Three Million

Dollar Export Golden Tower" from Government

2008 year 2011 year

  • 11. Gained “Five Million

Dollar Export Golden Tower" from Government

  • 12. 2011. Korea Technology

Awards Have gained award from Knowledge and Economy Minister

  • 01. Newly equipped with

Reverse Pulse Plating LINE

2009 year

  • 05. Newly equipped with Image

LINE & PSR LINE (Starting to set-up LDI Machine)

  • 06. Additional establishment
  • f Reverse Pulse Plating LINE

2010 year

  • 12. Pending Patent for

OSCILLATION AND SHOCKING APPARATUS

  • f PCB

2006 2007 2008 2009 2010 2011 2013

2013 year

  • 06. Selected “The Best Firm for

working” (Small and medium Business Corporation)

  • 06. Selected “Promising Export

Firm” (kyeonggi Regional Small Medium Business Administration)

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  • Rev. 5 (2013.08.08)

Ace Tech Circuit

Emphasize Quality

Emphasize Quality

We understand and conform to our customer’s quality requirements in PCB business and We deliver error-free products and services on time delivery. (Please see our quality systems’ page) Overall Manufacturing Process in House

Overall Manufacturing process in house

Every each process of manufacturing is done in house all without any other

  • utsourcing, so it is possible to not only shorten the lead time, but also

reduce the cost.

Measure Performance Measure Performance

We manage by timely feedback – Quality, Delivery and Customer inputs for inquiries as well as orders

Development Programs

Development Programs

We analysis the defect data to generate Process Improvement actions and develop new technologies continuously.

◈ Company Philosophy

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Ace Tech Circuit

President

Executive Director Produce Sector Support Sector Institute of technology Managing Director Production Team

Production Management

Quality Team Domestic Sales Team Overseas Sales Team

Engineering /Cam Team Production &Technique Human Resources &manager Team laminating PART Imaging PART Gold Plating PART PSR PART Quality Assurance PART Quality Control PART Engineering PART CAM PART Facilities manageme nt PART

Human Resources/ Accounts PART

Manager PART

◈ Organization

Production Management PART Sales Management PART Production& Technique PART

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Ace Tech Circuit

◈ ATC’s Main Customers

Industrial Business Microelectronics Business Overseas Business End User

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  • Rev. 5 (2013.08.08)

Ace Tech Circuit CAM

Applying to the PCB manufacturing with designs for the productions by accuracy, speedy and stored specifications in computers. Equipments : Orbotech-Genesis

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit IMAGE

The conductive patterns are formed by etching process of Dry Films. The Imaged Dry Films with the patterns, are contacted to the Copper Foils closely. (Utilize 100% Laser Direct Imaging on UV (light Exposure)

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit AOI

During the manufacturing the PCB, the all patterns are inspected by optical equipments with Halogen lamp. Equipments :Orbotech , GIGAVIS

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit HOT PRESS

Each layer's Copper foil & Prepreg are laid up by heat and press. The lay up should be performed a controlled environment room for best result. Equipments : MEIKI, FUSEI MENIX

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit DRILLING

Drills for making holes are performed for plating holes to be electrical connecting between the top and bottom, and component's mounting on the boards. Equipments : HITACHI

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit CU PLATING

The hole's plating process is one of the most important process for PCB manufacturing, and its process is requiring special analysis for checking plating's situations in technical specialized plating

  • shop. We have a reverse pulse type plating for a

reliability.

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 12/26

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Ace Tech Circuit PSR

The specification of significant parameters of solder paste are important to repeatable high quality results. It should be sufficient to meet process variable and products requirements. Legend is worked by using Inkjet Marking machine.

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit SURFACE FINISHING

We do surface finishing with Gold plating, Tin plating, Silver plating and HASL Hard Gold Plating : 50 µ” Flash Gold Plating : 2~20µ”

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit ROUTER

The boards are cut as customer's required specifications.

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit B.B.T

The all boards are tested with the checking of all patterns and holes by electrical testing. Equipments : MicroCraft(EMMA), ATG, MANIA

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit FINAL INSPECTION

For final board's inspection would be effected by the checking the board's specifications with customer's requirements and the general things, including the its shipping packages.

◈ Facilities & Process

CAM AOI HOT PRESS DRILLING CU PLATING OUTER LAYER IMAGE PSR SURFACE FINISHING ROUTER B.B.T FINAL INSPECTION INNER LAYER IMAGE

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Ace Tech Circuit

Probe Cards/Boards Burn-in Boards Hi-fix Boards Load Boards / SOC Boards

◈ Product Types

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Ace Tech Circuit Typical ATC Controlled Impedance Boards ◈ Probe Cards/Boards (Controlled Impedance Boards)

Specification Units mm inch

Layers 14~52 14~52 Base material FR-4 FR-4 High Tg FR-4 FR-4 High Tg Thickness 4.8~6.5 0.19~0.26 Conductor width 0.075 0.003 Conductor space 0.1 0.004

  • Min. Hole diameter

ø 0.30 ø 0.012 Surface treatment

(Electro Hard / Electroless Au Plating)

1.3µm 50µ” etc. HPL

Applications :

  • Semiconductor wafer probing & IC testing
  • High-speed signal processing units
  • High frequency communication equipment
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  • Rev. 5 (2013.08.08)

Ace Tech Circuit Typical ATC Burn-in Boards

◈ Burn-In Boards

Specification Units mm inch

Layers 4~22 4~22 Base material FR-4, polyimide, FR-4 High Tg, BT-Resin FR-4, polyimide, FR-4 High Tg, BT-Resin Thickness 0.3~2.4 0.012~0.096 Conductor width 0.075 0.003 Conductor space 0.075 0.003

  • Min. Hole diameter

ø 0.15 ø 0.006 Surface treatment

(Electro Hard / Electroless Au Plating)

1.3µm 50µ” Pitch 0.4 0.016

Applications :

  • Semiconductor IC burn-in testing
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TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 20/26

  • Rev. 5 (2013.08.08)

Ace Tech Circuit Typical ATC Hi-Fix Boards

◈ Hi-Fix Boards

Specification Units mm inch

Layers 12~68 12~68 Base material FR-4 N4000-13SI FR-4 High Tg FR-4 N4000-13SI FR-4 High Tg Thickness 1.6-6.5 0.063-0.256 Conductor width 0.06 0.0024 Conductor space 0.075 0.003

  • Min. Hole diameter

Φ 0.125 Φ 0.005 Surface treatment

(Electro Hard / Electroless Au Plating)

1.3µm 50µ” Pitch 0.35 0.014 etc. HPL, Back Drill

Applications :

  • This is for evaluation of Electrical function and characteristic.
  • This can be installed to multi type of Tester and Handler
  • 68 Layers
  • 6.5T
  • IVH
  • 0.4 Pitch
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  • Rev. 5 (2013.08.08)

Ace Tech Circuit Typical ATC Load Boards

◈ Load Boards / SOC Boards

Specification Units mm inch

  • Max. Number of Layers

62 62 Base material FR-4 FR-4 High Tg FR-4 FR-4 High Tg Thickness 1.6~6.35 0.063~0.250 Conductor width 0.06 0.0024 Conductor space 0.075 0.003

  • Min. Hole diameter

Φ 0.15 Φ 0.006 Surface treatment

(Electroless Au Plating)

0.07µm 2.8µ” Pitch 0.4 0.016 etc. HPL, BUILD-UP

Applications :

  • This is for evaluation of Electrical function and characteristic.
  • Used for evaluation of device function as from one to many quantity.
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  • Rev. 5 (2013.08.08)

Ace Tech Circuit

◈ Product Types Ⅱ

 Build-Up Boards  DUT Boards  etc.

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Ace Tech Circuit No. Model Manufacturer Purpose 1 CITS500S Polar Instruments Measuring Impedance 2 DSA8200 Tektronix Measuring Impedance 3 CMI900 Oxford Instruments Measuring thickness of gold plating 4 CMI700 Oxford Instruments Measuring thickness of copper plating 5 Premium-800C INTEK IMS Measuring in 3 Dimensions 6

Video Microscope IT System

Sometech

Measuring in 2 Dimensions (inner/outer Trace width)

7 PMG3 OLYMPUS

Microscope (Cross Section , thickness of , Surface)

8 QM-HEIGHT 350 Mitutoyo Bow & Twist Test 9 U3B DAESUNG TECH Copper Peeling Test 10 Solder Pot

YuYu measuring instrument

Soldering Test & Thermal Stress Test 11 Labopol-5 Struers Grinding & Polishing

◈ Measuring instrument

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  • Rev. 5 (2013.08.08)

Ace Tech Circuit

General ATC Capabilities Overview

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  • Rev. 5 (2013.08.08)

Ace Tech Circuit

◈ General ATC PCB Capabilities

Division Standard Advanced mm inch mm inch

Impedance Control 10% 8% Pattern Width Inner Layer 0.075 0.003 0.06 0.0024 Outer Layer 0.090 0.0036 0.07 0.0028 BGA pitch 0.5 0.02 0.3 0.012 Immersion Gold 0.03µm 1.2µ” 0.5µm 20µ” Electrolytic Hard Gold 0.5µm 20µ” 1.5µm 60µ”

  • Max. Number of Layers

48 70

  • Min. Hole Size

0.20 0.008 0.1 0.004

  • Max. Panel size

610 × 660 24.0 × 26.0 620 × 780 24.4 × 30.7

  • Max. Board Thickness

4.8 0.189 7.2 0.288

  • Max. Aspect Ratio on

0.248" thickness 12 : 1 26 : 1

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  • Rev. 5 (2013.08.08)

Ace Tech Circuit

 Possibility of Operating Throwing Power for High Aspect Ratio  It is able to be handle 0.05~0.5um Gold thickness by using ENIG  Minimize deviation of the rate of contraction by unused Exposure Film  The Realization of an Accurate Pattern  Get high reliability by Hole plugging automation  Operate Marking Process without a Plate-Marking Net  Print out a Minute Typography, Be excellent in Location of its Typography/Marking  For special process <Reverse Pulse Plating> <LDI> <Inkjet Marking> <Flash Gold facility> <Plugging M/C> <Half Etching facility >

ATC leads technique markets of PCB testing semiconductor by using modern facilities Such as Reverse Pulse Copper plating, LDI, Inkjet Marking machines.

◈ General ATC PCB Capabilities