3D-MID Reliability and Profitability Nouhad Bachnak with Control of - - PowerPoint PPT Presentation

▶
3d mid reliability and profitability
SMART_READER_LITE
LIVE PREVIEW

3D-MID Reliability and Profitability Nouhad Bachnak with Control of - - PowerPoint PPT Presentation

Sep 10, 2022 130 likes •374 views

Pushing Performance HARTING AG Mitronics 3D-MID Reliability and Profitability Nouhad Bachnak with Control of Manufacturing Process g 3D MID Technology Technology People | Power | Partnership 2010-09-29 S. / 1 23 Outline Pushing

slide-1
SLIDE 1

Pushing Performance

HARTING AG Mitronics Nouhad Bachnak

3D-MID Reliability and Profitability

with Control of Manufacturing Process

3D MID Technology

g

Technology

People | Power | Partnership

23 2010-09-29

  • S. /

1

slide-2
SLIDE 2

Outline

Pushing Performance

HARTING Group

HARTING AG Mitronics

The 3D-MID Technology Barriers for the MID Technology

Nouhad Bachnak

Barriers for the MID Technology Historical View Manufacturing Processes

3D MID Technology

MID Process Optimisation

Technology

Conclusion MID Process Automation

People | Power | Partnership

23 2 2010-09-29

  • S. /
slide-3
SLIDE 3

HARTING Group – Production Facilities

Pushing Performance

DE/Espelkamp 3 DE/Espelkamp 4 DE/Espelkamp 2

HARTING AG Mitronics

DE/Espel- kamp 1 DE/Espel- kamp 5 p p p p

Nouhad Bachnak

kamp 1 kamp 5

3D MID Technology

RO/Sibiu GB/Northampton

Technology

p

People | Power | Partnership

US/Elgin

23

Inhalt

CN/Zhuhai CH/Biel

3 2010-09-29

  • S. /
slide-4
SLIDE 4

HARTING Groupe – Global Business Units

Pushing Performance

Connectivity & Networks Integrated Solutions

HARTING AG Mitronics

Connectivity & Networks Integrated Solutions

Nouhad Bachnak Connectors and Networks for power supply and data transfer. Telecommunication, Industry, Transportation … Design and production of customised Backplanes 3D MID Technology

Applied Technologies Mitronics

Technology Tooling design and manufacturing 3D MID Technology for diverse industrial applications

People | Power | Partnership

Automotive Systems

23

Mechatronics parts for steering and security applications Housing and Shop Systems

4 2010-09-29

  • S. /
slide-5
SLIDE 5

Pushing Performance

HARTING AG Mitronics Nouhad Bachnak

The 3D MID Technology

3D MID Technology

The 3D-MID-Technology

Technology

People | Power | Partnership

23 5 2010-09-29

  • S. /
slide-6
SLIDE 6

Barriers for the MID Technology

Pushing Performance

Extract from the appraised questionnaire of the 8. International

HARTING AG Mitronics

Congress MID 2008

Nouhad Bachnak 3D MID Technology Technology

People | Power | Partnership

23 6

Low Profitability Low Reliability

2010-09-29

  • S. /
slide-7
SLIDE 7

Historical View

Pushing Performance

First research works on MID-Technology at the beginning of the 80´s

HARTING AG Mitronics

gy g g

At this time the MID technology was not able to become accepted .

Reasons: absence of qualified materials, manufacturing processes and MID specific kno ho

Nouhad Bachnak

specific know how

Revival from 1996

1996: first high volume production of 2S product (2 shot moulding )

3D MID Technology

g p p

( g )

1997: development of the LDS process (Laser Direct Structuring) 1997-2004: development of new materials for the LDS process

Technology

p p 2002: high volume production of MID Antennas (2S) 2005: serial production of LDS products

People | Power | Partnership

2005: serial production of LDS products 2008 und 2009: jump of MID products in the market

23 7 2010-09-29

  • S. /
slide-8
SLIDE 8

Historical View- Comparison with PCB

Pushing Performance

250

Estimated MID-Turnover in Mio. €

HARTING AG Mitronics

200

Nouhad Bachnak

100 150

3D MID Technology

50

Technology

1982 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 2010 2012 2014 2016 2018 2020

Research Phase Development Phase Growth Phase Year

MID

People | Power | Partnership

Research Phase Development Phase Growth Phase

atent- ation PCB m s bly es sided PCB 23 PCB Pa registra First Serial-P Dry film process Assemb mashin Double PCB 8 2010-09-29

  • S. /
slide-9
SLIDE 9

Manufacturing Process: LDS

(Laser Direct Structuring)

Pushing Performance

Si l h t i j ti ld d d

( g)

HARTING AG Mitronics

Single shot injection mould doped with metal-complex

Nouhad Bachnak

Laser activation

3D MID Technology

Cleaning C l ti

Technology

Cu plating Ni P l ti

People | Power | Partnership

Ni-P plating Au plating

23 9

Au plating

2010-09-29

  • S. /
slide-10
SLIDE 10

Manufacturing Process: LDS

(Laser Direct Strukturing)

Pushing Performance

( g)

Laser Activation Cleaning 1s Moulding

HARTING AG Mitronics

Laser Activation Cleaning 1s-Moulding

Nouhad Bachnak 3D MID Technology Technology

Metallisation Electro Optical Test Electronic Assembly

People | Power | Partnership

23 10 2010-09-29

  • S. /
slide-11
SLIDE 11

Manufacturing Process: 2S 2 Sh t M ldi MID

Pushing Performance

2 Shot-Moulding MID

HARTING AG Mitronics

Composite of two plastics

Nouhad Bachnak

  • 1. Component: plateable

3D MID Technology

  • 2. Component: not plateable

Technology

Chemical activation

People | Power | Partnership

Metallisation (similar to LDS)

23 11

( )

2010-09-29

  • S. /
slide-12
SLIDE 12

Manufacturing Process: 2S 2 Sh t M ldi MID

Pushing Performance

1 Component 1 + 2 Component 2S Moulding

2 Shot-Moulding MID

HARTING AG Mitronics

  • 1. Component
  • 1. + 2. Component

2S-Moulding

Nouhad Bachnak 3D MID Technology Technology

Metallisation Electro Optical Test Electronic Assembly

People | Power | Partnership

23 12 2010-09-29

  • S. /
slide-13
SLIDE 13

Pushing Performance

HARTING AG Mitronics Nouhad Bachnak

MID Process Optimisation and Automation

3D MID Technology

Optimisation and Automation

Technology

People | Power | Partnership

23 13 2010-09-29

  • S. /
slide-14
SLIDE 14

MID Process: Overview and Dependency

Pushing Performance

HARTING AG Mitronics

Electr. Assembly

Laser & Cleaning Moulding Metallisation Design Nouhad Bachnak

Assembly

Cleaning 3D MID Technology Technology Glob Top Wire Bonding Curing Chip Gluing

Electr. Assembly

People | Power | Partnership

Chip Positioning Dispensing Soldering

Assembly

23 14 2010-09-29

  • S. /
slide-15
SLIDE 15

MID Process: Overview and Dependency

Pushing Performance

HARTING AG Mitronics

Electr. Assembly

Laser & Cleaning Moulding Metallisation Design Nouhad Bachnak

Assembly

Cleaning 3D MID Technology Technology Glob Top Wire Bonding Soldering Chip Gluing

Electr. Assembly

People | Power | Partnership

Chip Positioning Dispensing Soldering

Assembly

23 15 2010-09-29

  • S. /
slide-16
SLIDE 16

MID Process: Overview and Dependency

Pushing Performance

High Temperature Resistance HARTING AG Mitronics Stiffness of the Adhesives Covering of the Wire Bond Nouhad Bachnak Adhesives Wire Bond 3D MID Technology Glob Top Wire Bonding Soldering Chip Gluing

Electr. A bl

Technology Chip Positioning Dispensing Soldering

Assembly

People | Power | Partnership

23 16 2010-09-29

  • S. /
slide-17
SLIDE 17

Dependency between different Processes E l El t i A bl P

Pushing Performance

Example: Electronic Assembly Process

HARTING AG Mitronics

  • Planarity
  • Metall. for

Bonding Nouhad Bachnak

  • Roughness and Porosity
  • Planarity
  • Moulding Flow

Direction (CTE Anisotr.)

  • etc.
  • Rouphness of Tracks

Bonding

  • Chip Dimensions
  • SMD-Pad-Dim.
  • High Temperature

Resistance

  • CTE Compensation

3D MID Technology

  • Cleanness of the Surface
  • Thickness of Ni
  • CTE-Compensation

Technology

Electr. Assembly

Laser & Cleaning Moulding Metallisation Design

People | Power | Partnership

23 17 2010-09-29

  • S. /
slide-18
SLIDE 18

MID Process Optimisation

Pushing Performance

Project Definition P j t Ch t

HARTING AG Mitronics

Project Charter CTQ

Parameter Q-Characteristic Prozess- Stepp Nouhad Bachnak Stepp Q-Characteristic 3D MID Technology

C + E

  • zess-

rameter Technology Pro par

FMEA

People | Power | Partnership

CTQ: Critical to Quality

DOE

23 18

CTQ: Critical to Quality C+E: Cause and Effects DOE: Design of Experiment

Design Rules Definition Implementation Process Window Definition Implementation

2010-09-29

  • S. /
slide-19
SLIDE 19

Output of the Optimisation Process

Pushing Performance

D i R l D fi iti P Wi d D fi iti

HARTING AG Mitronics

Design Rules Definition Process Window Definition

Nouhad Bachnak 3D MID Technology Technology

People | Power | Partnership

23 19 2010-09-29

  • S. /
slide-20
SLIDE 20

Process Automation: Moulding, Laser & Cleaning

Pushing Performance

Moulding:

Moulding

HARTING AG Mitronics

g

  • Automated Handling
  • Process Control (Temperature, Pressure)

Moulding

Nouhad Bachnak 3D MID Technology

Laser & Cleaning

Technology

Laser & Cleaning:

Laser & Cleaning

People | Power | Partnership

  • Automated Robot Cell
  • Continuous Process Control

23 20 2010-09-29

  • S. /
slide-21
SLIDE 21

Process Automation: Metallisation, Electronic Assembly

Pushing Performance

Assembly

HARTING AG Mitronics

Metallisation:

  • Semi automated Batch Handling

Metallisation

Nouhad Bachnak

Semi automated Batch Handling

  • Automated Bath Control

3D MID Technology Technology

Electronic Assembly:

  • Inline Manufacturing

C ti T ki f P P t Electronic Assembly

People | Power | Partnership

  • Continuous Tracking of Process Parameter

23 21 2010-09-29

  • S. /
slide-22
SLIDE 22

Conclusion

Pushing Performance

HARTING AG Mitronics

Increasing product quality and Higher Production Output

Nouhad Bachnak

increasing yield due to process

  • ptimisation and process control

due to Automation

3D MID Technology

Increasing technolog

kno ho and increasing a tomation allo

Technology

Increasing technology know how and increasing automation allow

an economical manufacturing of high reliable 3D-MID Products

People | Power | Partnership

23 22 2010-09-29

  • S. /
slide-23
SLIDE 23

Pushing Performance

Thank You Thank You For Your Attention For Your Attention

HARTING AG Mitronics

For Your Attention For Your Attention

Nouhad Bachnak 3D MID Technology Technology

People | Power | Partnership

23 23 2010-09-29

  • S. /