XPS measurements of sodium in Bridgman-grown CuInSe2+x
by Sunyoung Park, C. H. Champness and I. Shih Electrical and Computer Eng., Dept. McGill University
Sunyoung Park Ph.D. student
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XPS measurements of sodium in Bridgman-grown CuInSe 2+x by Sunyoung - - PowerPoint PPT Presentation
XPS measurements of sodium in Bridgman-grown CuInSe 2+x by Sunyoung Park, C. H. Champness and I. Shih Electrical and Computer Eng., Dept. McGill University Sunyoung Park Ph.D. student 1 J-V characteristics under simulated AM 1.5 conditions
by Sunyoung Park, C. H. Champness and I. Shih Electrical and Computer Eng., Dept. McGill University
Sunyoung Park Ph.D. student
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Glass substrate Earlier cell Mo p CuInSe2 n CdS ZnO i ZnO cond Metal grid evap. hν J-V characteristics under simulated AM 1.5 conditions of a Cu(In,Ga)Se and a CuInSe2 cell. The cells are AR-coated. Cell temperature is 25 °C (Hedstrom and Ohlsen, 1993) Glass substrate Later cell Mo p Cu(In,Ga)Se2 n CdS ZnO i ZnO cond hν Sputtered Solution grown (50 nm) 2 µm Sputtered
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Se In Cu Na
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CuInSe2+x n-type If [Na]>[Na]crit =2x+δ
10 20 30 40 50 60 50 100 150 Relative Percentage (%) Ar etching (s) Cu Se In
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5 10 15 20 25 30 35 40 45 20 40 60 80 100 Relative Percentage (%) Ar etching (s) Cu Se In
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500 1000 Counts/s Binding Energy (eV)
cylindrical surface of ingot interior of ingot Se3d Se3d Cu2p3 Cu2p3 In3d In3d Na1s O1s
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1060 1065 1070 1075 1080 Counts/s Binding Energy (eV) cylindrical surface of ingot interior of ingot
10 20 30 40 50 60 50 100 150 200 Atomic percentage (%) Ar ion etching time (s)
HMB56 (3 at. % Na) curved
Cu In Se Na
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5 10 15 20 25 30 20 40 60 80 100
elements Cu, In, Se) Na at. % (of 4 elements) at surface Bulk n-type Bulk p-type
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5 10 15 20 25 30 2 4 6
elements Cu, In, Se) Na at. % (of CuInSe2) in melt Bulk n-type Bulk p-type
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10 20 30 40 50 60 70 80 20 40 60 80 100
elements Cu, In, Se) Na at. % (of 4 elements) at surface Bulk n-type Bulk p-type
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nm from the ingot surface, even without Na addition.
the melt, the relative surface concentration of Cu is decreased and that of Se, in p-type (bulk) material, is increased.
none is detected by XPS in the bulk.
without added Na but is accentuated with up to 1 at. % of added Na in the melt.
abundant carbon present.
extra compounds CuSe2, Na2SeO4, and Na2SeO3, at least at the surface.
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CuInSe2
Cu(InGa)Se2 p Low Cu Ternary n CdS
hν
CdS interface Lower recombination interface Low Cu ternary/CuInSe2 n/p interface
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