V-Bond BO-7770V Pretreatment for Innerlayers R&D Center P CB - PDF document

2006.10.24. V-Bond BO-7770V Pretreatment for Innerlayers R&D Center

P CB Manufacturing Process １ ． I nnerlayer Patterning ０ ． Multilayer Board ２ ． Pretreatment for I nnerlayer ３ ． Laminate and Press ７ ． ４ ． ５ ． ６ ． Assembly Outer Layer Patterning Solder Mask Final Surface Finish Shipping 2 R&D Center 2006.10.24.

M ultilayer Board & Pretreatment for Innerlayer 3 pieces of I nnerlayer Boards Multilayer Board (8 layers) 4 pieces of Prepregs 2 pieces of Copper Foil I nnerlayer Boards Pretreatment for Innerlayer Pretreatment for Innerlayer To Enhance Adhesion � Black Oxide Treatment, Black Oxide Reduction Treatment � V-Bond Treatment 3 R&D Center 2006.10.24.

W hat is V-Bond ? V-Bond, which is a alternative to chemicals for black oxide treatment or black oxide reduction treatment, is available for a pretreatment for innerlayer. Unique surface topography produced by V-Bond can enhance adhesion of copper to resin. 4 R&D Center 2006.10.24.

V-Bond BO-7770V P rocess 1. CB-7612 10 times dilution 20-30º C, 10 - 40 S 1.Removal of rust and dirt on a panel Water Rinse 40-50 º C, 15 - 40 S 2. Alkaline Cleaner 4%Caustic Soda 2. Removal of residues of dry film Water Rinse 3. Help to obtain good surface 25º C, 30 - 60 S 3. Predip (BO-7770VP) finish in BO-7770V process. Avoid dragging-in of rinse water into Dip 4. BO-7770V BO-7770V tank. 25º C, 30 – 90 S Water Rinse 4. Roughen copper surface and produce organic copper film simultaneously resulting in producing copper surface having Dry superior adhesion 5 R&D Center 2006.10.24.

V-Bond BO-7770V F eatures 1 � Sulfuric Acid - Hydrogen Peroxide Microetching Solution V-Bond Black Oxide Treatment Needle-shaped Copper Oxide Peaks and Valleys ＋ Organic Copper Film ＝ Physical Bonding ＝ Chemical Bonding = Physical Bonding Resin Resin × 30,000 Cu Cu 6 R&D Center 2006.10.24.

V-Bond BO-7770V F eatures 2 Excellent Adhesion to High Tg ・ Halogen Free Pb(lead)Free （ High Heat Resistance ） Environment Halogen Free High Density Application High-frequency Digital Appliance （ PC ・ Mobile Phone ・ Digital Camera) Thinner&Lighter Amusement （ PSP ・ NDS ） Model Automobile （ Driving ・ Stopping ・ Turning ） High Heat Resistance High Heat Resistance High Tg Innerlayer Materials High-Frequency Prepreg Halogen Free Materials Halogen Free 7 R&D Center 2006.10.24.

V-Bond BO-7770V F eatures 3 Comparison with Oxide Treatment Peel Strength V-Bond vs. Black Oxide Treatment 1.4 Peel Strength (N/mm) 1.2 N/mm ） 1 Contribution to Contribution to 0.8 ピー ル 強 度 （ Enhance Reliability Enhance Reliability 0.6 of PCB of PCB 0.4 0.2 0 高 Tg 材 ハロ ゲンフリ ー材 FR-4 High Tg Halogen Free プリ プレグ材料 Prepreg Copper Foil :35 μ m ■ Black Oxide Treatment ■ V-Bond 黒化処理 V-Bond 8 R&D Center 2006.10.24.

V-Bond vs. Product M vs. Product B Comparison of Topography & Peel Strength R&D Center 2006.10.24.

V-Bond @ MEC Copper Foil : Mitsui Mining and Smelting 3EC- Ⅲ × 3,500 Stage Angle ： 45 ° 1.0 μ m Etched 1.5 μ m Etched 2.0 μ m Etched 10 R&D Center 2006.10.24.

Product M @ M Company Copper Foil : Mitsui Mining and Smelting 3EC- Ⅲ × 3,500 Stage Angle ： 45 ° 1.0 μ m Etched 1.5 μ m Etched 2.0 μ m Etched 11 R&D Center 2006.10.24.

Product B @ A Company Copper Foil : Mitsui Mining and Smelting 3EC- Ⅲ × 3,500 Stage Angle ： 45 ° 1.0 μ m Etched 1.5 μ m Etched 2.0 μ m Etched 12 R&D Center 2006.10.24.

T opography and Roughness Etching Amount : 1.5 μ m V-Bond Product M Product B × 3,500 × 10,000 Ra 0.36 0.33 0.34 Rz 3.90 2.98 4.04 � Each product provides unique topography. � Topography is roughen in order of Product M, V-Bond & Product B. 13 R&D Center 2006.10.24.

P eel Strength GEA-67N (Hitachi Chemical) 1 . 2 1 Peel Strength (N/mm) ） m 0 . 8 m / N ール強度（ 0 . 6 0 . 4 ピ 0 . 2 0 1 . 0 u m 1 . 5 u m 2 . 0 u m O x i d e T r e a t m e n t 0 . 8 6 0 . 9 4 1 . 0 4 V - B o n d 0 . 4 8 0 . 5 3 0 . 6 3 P r o d u c t M 0 . 5 7 0 . 6 7 0 . 9 1 P r o d u c t B 14 R&D Center 2006.10.24.

P eel Strength GEA-679N (Hitachi Chemical) 0 . 7 0 . 6 Peel Strength (N/mm) ） 0 . 5 m m / 0 . 4 N ール強度（ 0 . 3 0 . 2 ピ 0 . 1 0 1 . 0 u m 1 . 5 u m 2 . 0 u m 0 . 1 3 O x i d e T r e a t m e n t 0 . 3 9 0 . 5 0 . 6 1 V - B o n d 0 . 1 4 0 . 2 1 0 . 2 9 P r o d u c t M 0 . 3 3 0 . 4 0 . 4 5 P r o d u c t B 15 R&D Center 2006.10.24.

P eel Strength GEA-679F (Hitachi Chemical) 0 . 7 0 . 6 Peel Strength (N/mm) 0 . 5 ） m m 0 . 4 / N ール強度（ 0 . 3 0 . 2 0 . 1 ピ 0 1 . 0 u m 1 . 5 u m 2 . 0 u m 0 . 4 8 O x i d e T r e a t m e n t 0 . 4 6 0 . 5 8 0 . 6 3 V - B o n d 0 . 2 1 0 . 2 5 0 . 3 3 P r o d u c t M 0 . 3 6 0 . 5 0 . 6 2 P r o d u c t B 16 R&D Center 2006.10.24.

P eel Strength GEA-67BE(G) (Hitachi Chemical) 1 0 . 8 Peel Strength (N/mm) ） m m 0 . 6 / N ール強度（ 0 . 4 0 . 2 ピ 0 1 . 0 u m 1 . 5 u m 2 . 0 u m 0 . 9 1 O x i d e T r e a t m e n t 0 . 5 0 . 6 3 0 . 7 5 V - B o n d 0 . 2 1 0 . 2 8 0 . 3 9 P r o d u c t M 0 . 2 7 0 . 4 2 0 . 4 1 P r o d u c t B 17 R&D Center 2006.10.24.

V-Bond BO-7770V F eatures 4 With V-Bond Less Dirt Generated in the Treatment Tank Compared to Others. V-Bond Product M Less More Dirt on the solution surface Once three to six At least Frequency of replacement of whole working solution months Once a month When whole working Frequency of replacement of Once a month filter solution is replaced. 18 R&D Center 2006.10.24.

V-Bond BO-7770V F eatures 5 Simple Control According to Panel Counter Chemical Type Control Method CB-7612 Caustic Soda Solution level compensation + Panel counter replenishment BO-7770VP Copper concentration control can be automatic + BO-7770V Panel counter replenishment. All chemicals employed in MEIKO ELECTRONICS (Wuhan) are replenished by panel counter. 19 R&D Center 2006.10.24.

V-Bond BO-7770V F eatures 6 An automatic feed and bleed system Automatic Analysis Device accurately controls working solution （ Appearance ） Analysis result can be printed for records. Measured Time & Date Cu Concentration H 2 O 2 Concentration H 2 SO 4 Concentration Replenished amount of the fresh solution & Operated time Holding Cu concentration (45 ± 1 g/L) constant makes it possible to use the solution Analysis under stable conditions, and consequently it leads to a reliable quality. Cell 20 R&D Center 2006.10.24.

V-Bond BO-7770V F eatures 7 Color of V-Bond treated copper surface can be qualified by L-values for process control. 【 Daily Control Method of BO-7770V 】 Check a status of BO-7770V Concentrations of individual elements (Sulfuric Acid, working solution. Hydrogen Peroxide and Copper) in BO-7770V + + Measurement of Etching Rate Information from a board Measurement of L-value* treated with the solution A degree of copper roughened topography and a status of organic copper film can be observed Highly Reliable Control according to L-value*. A balance of an effective element in BO-7770V can be seen according to L-value*. 21 R&D Center 2006.10.24.