V-Bond BO-7770V Pretreatment for Innerlayers R&D Center P CB - - PDF document

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V-Bond BO-7770V Pretreatment for Innerlayers R&D Center P CB - - PDF document

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2006.10.24. V-Bond BO-7770V Pretreatment for Innerlayers R&D Center P CB Manufacturing Process I nnerlayer Patterning Multilayer Board Pretreatment for I nnerlayer Laminate and Press

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SLIDE 1

2006.10.24.

R&D Center

Pretreatment for Innerlayers

V-Bond BO-7770V

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SLIDE 2

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R&D Center

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PCB Manufacturing Process

１ ． I nnerlayer Patterning ０ ． Multilayer Board ２ ． Pretreatment for I nnerlayer ３ ． Laminate and Press ７ ． Assembly ４ ． Outer Layer Patterning ５ ． Solder Mask ６ ． Final Surface Finish

Shipping

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Multilayer Board & Pretreatment for Innerlayer

3 pieces of I nnerlayer Boards 2 pieces of Copper Foil 4 pieces of Prepregs Multilayer Board (8 layers) I nnerlayer Boards

Pretreatment for Innerlayer Pretreatment for Innerlayer

To Enhance Adhesion

Black Oxide Treatment, Black Oxide Reduction Treatment

V-Bond Treatment

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What is V-Bond ?

V-Bond, which is a alternative to chemicals for black

  • xide treatment or black oxide reduction treatment, is

available for a pretreatment for innerlayer. Unique surface topography produced by V-Bond can enhance adhesion of copper to resin.

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SLIDE 5

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V-Bond BO-7770V Process

20-30º C, 10 - 40 S 40-50ºC, 15 - 40 S

Dip 25º C, 30 – 90 S

Water Rinse Water Rinse Water Rinse Dry

  • 2. Alkaline Cleaner 4%Caustic Soda
  • 3. Predip (BO-7770VP)
  • 4. BO-7770V
  • 1. CB-7612 10 times dilution
  • 3. Help to obtain good surface

finish in BO-7770V process. Avoid dragging-in of rinse water into BO-7770V tank.

  • 4. Roughen copper surface and

produce organic copper film simultaneously resulting in producing copper surface having superior adhesion

25ºC, 30 - 60 S

  • 2. Removal of residues of dry film

1.Removal of rust and dirt on a panel

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SLIDE 6

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V-Bond BO-7770V Features 1

Sulfuric Acid - Hydrogen Peroxide Microetching Solution

Black Oxide Treatment V-Bond

Needle-shaped Copper Oxide = Physical Bonding Peaks and Valleys ＝Physical Bonding Organic Copper Film ＝Chemical Bonding ＋

×30,000

Cu Cu Resin Resin

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V-Bond BO-7770V Features 2 Excellent Adhesion to High Tg・ Halogen Free

Pb(lead)Free （High Heat Resistance） Halogen Free

Application Digital Appliance

（PC・Mobile Phone・Digital Camera)

Amusement

（PSP・NDS）

Automobile

（Driving・Stopping・Turning）

High Density High-frequency Thinner&Lighter Model High Heat Resistance

Environment

High Heat Resistance High-Frequency Halogen Free Innerlayer Materials Prepreg High Tg Halogen Free Materials

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SLIDE 8

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V-Bond BO-7770V Features 3

Comparison with Oxide Treatment

Contribution to Enhance Reliability

  • f PCB

Contribution to Enhance Reliability

  • f PCB

0.2 0.4 0.6 0.8 1 1.2 1.4

ピー ル 強 度 （ N/mm）

FR-4 高Tg材 ハロ ゲンフリ ー材 プリ プレグ材料 黒化処理 V-Bond

Copper Foil :35μm

Peel Strength V-Bond vs. Black Oxide Treatment

Peel Strength (N/mm) High Tg Prepreg Halogen Free ■Black Oxide Treatment ■ V-Bond

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SLIDE 9

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V-Bond vs. Product M vs. Product B

Comparison of Topography & Peel Strength

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V-Bond @ MEC

Copper Foil : Mitsui Mining and Smelting 3EC-Ⅲ

×3,500 Stage Angle ： 45°

1.0μm Etched 2.0μm Etched 1.5μm Etched

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Product M @ M Company

1.0μm Etched 2.0μm Etched 1.5μm Etched

Copper Foil : Mitsui Mining and Smelting 3EC-Ⅲ

×3,500 Stage Angle ： 45°

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Product B @ A Company

1.0μm Etched 2.0μm Etched 1.5μm Etched

Copper Foil : Mitsui Mining and Smelting 3EC-Ⅲ

×3,500 Stage Angle ： 45°

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R&D Center

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Topography and Roughness

Etching Amount : 1.5μm

Product B Product M V-Bond

×3,500 ×10,000 Ra Rz 0.36 3.90 0.33 2.98 0.34 4.04 Each product provides unique topography. Topography is roughen in order of Product M, V-Bond & Product B.

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Peel Strength GEA-67N (Hitachi Chemical)

. 2 . 4 . 6 . 8 1 1 . 2

ピ ール強度（ N / m m ） O x i d e T r e a t m e n t V

  • B
  • n

d . 8 6 . 9 4 1 . 4 P r

  • d

u c t M . 4 8 . 5 3 . 6 3 P r

  • d

u c t B . 5 7 . 6 7 . 9 1 1 . u m 1 . 5 u m 2 . u m

Peel Strength (N/mm)

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SLIDE 15

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Peel Strength GEA-679N (Hitachi Chemical)

. 1 . 2 . 3 . 4 . 5 . 6 . 7

ピ ール強度（ N / m m ） O x i d e T r e a t m e n t . 1 3 V

  • B
  • n

d . 3 9 . 5 . 6 1 P r

  • d

u c t M . 1 4 . 2 1 . 2 9 P r

  • d

u c t B . 3 3 . 4 . 4 5 1 . u m 1 . 5 u m 2 . u m

Peel Strength (N/mm)

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Peel Strength GEA-679F (Hitachi Chemical)

. 1 . 2 . 3 . 4 . 5 . 6 . 7

ピ ール強度（ N / m m ） O x i d e T r e a t m e n t . 4 8 V

  • B
  • n

d . 4 6 . 5 8 . 6 3 P r

  • d

u c t M . 2 1 . 2 5 . 3 3 P r

  • d

u c t B . 3 6 . 5 . 6 2 1 . u m 1 . 5 u m 2 . u m

Peel Strength (N/mm)

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Peel Strength GEA-67BE(G) (Hitachi Chemical)

. 2 . 4 . 6 . 8 1

ピ ール強度（ N / m m ） O x i d e T r e a t m e n t . 9 1 V

  • B
  • n

d . 5 . 6 3 . 7 5 P r

  • d

u c t M . 2 1 . 2 8 . 3 9 P r

  • d

u c t B . 2 7 . 4 2 . 4 1 1 . u m 1 . 5 u m 2 . u m

Peel Strength (N/mm)

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V-Bond BO-7770V Features 4

With V-Bond Less Dirt Generated in the Treatment Tank Compared to Others. V-Bond Product M

Dirt on the solution surface

Less More

Frequency of replacement of whole working solution

Once three to six months At least Once a month

Frequency of replacement of filter

When whole working solution is replaced.

Once a month

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V-Bond BO-7770V Features 5

Simple Control According to Panel Counter

Chemical Type Control Method

CB-7612 Caustic Soda BO-7770VP BO-7770V

Copper concentration control can be automatic + Panel counter replenishment. Solution level compensation + Panel counter replenishment

All chemicals employed in MEIKO ELECTRONICS (Wuhan) are replenished by panel counter.

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V-Bond BO-7770V Features 6

An automatic feed and bleed system accurately controls working solution

Automatic Analysis Device （ Appearance）

Cu Concentration Measured Time & Date H2O2 Concentration H2SO4 Concentration Replenished amount

  • f the fresh solution &

Operated time

Holding Cu concentration (45 ± 1 g/L) constant makes it possible to use the solution under stable conditions, and consequently it leads to a reliable quality.

Analysis result can be printed for records. Analysis Cell

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V-Bond BO-7770V Features 7

Color of V-Bond treated copper surface can be qualified by L-values for process control. Highly Reliable Control

Measurement of Etching Rate Measurement of L-value* Concentrations of individual elements (Sulfuric Acid, Hydrogen Peroxide and Copper) in BO-7770V

+

Information from a board treated with the solution Check a status of BO-7770V working solution.

+

【

Daily Control Method of BO-7770V】

A degree of copper roughened topography and a status of organic copper film can be observed according to L-value*. A balance of an effective element in BO-7770V can be seen according to L-value*.

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Actual Achievement of V-Bond

There are thirteen companies employing V-Bond as of Oct. 2006. Production Volume : About 50,000 m2 / mon. in Japan, About 40,000m2 / mon. overseas

The table shows customers whose production amount is 5,000㎡/M or larger Customers Date Throughput （ ㎡/mon.） Application A C

  • m

p a n y S i n c e J u n . , 2 2 1 , （ F u l l I n t r

  • d

u c t i

  • n

） C

  • m

m u n i c a t i

  • n

・ A m u s e m e n t C C

  • m

p a n y S i n c e A p r . , 2 3 5 , （ F u l l I n t r

  • d

u c t i

  • n

・ T h r

  • u

g h p u t w i l l b e s t i l l i n c r e a s i n g ） A u t

  • m
  • b

i l e B C

  • m

p a n y S i n c e N

  • v

. , 2 2 4 , ( V e r t i c a l L i n e ・ F u l l I n t r

  • d

u c t i

  • n

） S h i e l d B

  • a

r d D C

  • m

p a n y S i n c e N

  • v

, 2 3 1 5 , （ F u l l I n t r

  • d

u c t i

  • n

） A u t

  • m
  • b

i l e ・ A m u s e m e n t E C

  • m

p a n y S i n c e J u n . , 2 6 5 , （ C

  • m

b i n e d U s e

  • f

B l a c k O x i d e ） C

  • m

m u n i c a t i

  • n

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  • m

p a n y S i n c e A p r . , 2 6 3 （ S m a l l P r

  • d

u c t i

  • n

, P r

  • s

p e c t f

  • r

M a s s P r

  • d

u c t i

  • n

f r

  • m

S p r i n g i n 2 7 ) C a r N a v i g a t i

  • n

・ E l e c t r

  • n

i c C

  • n

t r

  • l

U n i t G C

  • m

p a n y S i n c e A p r . , 2 6 7 , （ C

  • m

b i n a t i

  • n

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  • f

B l a c k O x i d e ) H

  • m

e E l e c t r

  • n

i c A p p l i a n c e ・ A u t

  • m
  • b

i l e HC

  • m

p a n y （ T h e J a p a n e s e C

  • m

p a n y i n C h i n a . ) S i n c e A u g . , 2 6 4 , （ F r

  • m

O c t . 2 6 ） （ S e c

  • n

d l i n e w a s s e t u p i n N

  • v

. 2 6 ) F l a t P a n e l D i s p l a y

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Support System

×10,000 銅 銅 樹脂 樹脂

Cu Cu L L 3. 3.0 µm µm

Observation of Surface Topography by SEM Elemental Analysis of Copper Surface（ EPMA) Analysis of Effective Element in Working Solution（ HPLC）

Observation of Cross-section View

Observation Cross-section Surface by FE-SEM & Elemental Analysis

C K C K 3. 3.0 µ 0 µm

MEC will try the best to examine problems using all analytical techniques when troubles arise

MEC MEC