Towards Research 4.0 ENRIS2019, University of Twente Christian - - PowerPoint PPT Presentation

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Towards Research 4.0 ENRIS2019, University of Twente Christian - - PowerPoint PPT Presentation

Towards Research 4.0 ENRIS2019, University of Twente Christian Kjelde, Polyteknik AS www.polyteknik.com WWW.POLYTEKNIK.COM WHEN THIN FILM MATTERS 1 Outline Polyteknik AS Flextura PVD Platform Towards research 4.0


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www.polyteknik.com

WHEN THIN FILM MATTERS 1

WWW.POLYTEKNIK.COM

Towards Research 4.0

ENRIS2019, University of Twente

Christian Kjelde, Polyteknik AS

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  • Polyteknik AS
  • Flextura PVD Platform
  • Towards research 4.0 (Material science and research)
  • Research 4.0 as a term
  • Case: Flextura Cluster system for University of Oslo

Outline

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We are a local company working globally

  • Established in 1995 by Mr. Jens William Larsen
  • State-of-the-art 2000m2 facility located close to

Aalborg, in the northern part of Denmark

  • Class 1000 clean room
  • Material characterisation lab for thin film analysis
  • Highly qualified teams of scientists, process and

mechanical engineers (25-30 employee)

Denmark

Polyteknik AS

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Polyteknik AS Ferries to Norway Ferries to Sweden Aalborg - AAL airport to rest of world Copenhagen CPH Airport

We are a local company working globally

  • Established in 1995 by Mr. Jens William Larsen
  • State-of-the-art 2000m2 facility located close to

Aalborg, in the northern part of Denmark

  • Class 1000 clean room
  • Material characterisation lab for thin film analysis
  • Highly qualified teams of scientists, process and

mechanical engineers (25-30 employee)

More than 20 years of excellence

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Business Areas

Design, Manufacture, Software Process, Service & Maintenaince Consumables & spare parts Coating service for general industry Coating development & Proof-of-concept Supply chain sourcing Accellerators & Syncrotrons Fusion Energy

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Tornado Discovery Flextura Cluster

Our standard PVD system platforms

Flextura Module

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FLEXTURA PVD – THE MOST FLEXIBLE 200mm PLATFORM

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PROCESS COMBINATIONS OF THE FLEXTURA PVD PLATFORM

Sputtering processes

  • DC, pulsed DC, Bipolar, RF, HIPIMS
  • Metals, alloys, oxides, nitrides.
  • Epitaxial growth of thin films by sputtering

E-beam processes

  • Generic E-beam configuration
  • GLAD Glancing Angle Deposition – OAD Oblique Angle

Deposition

  • High Rate Si deposition with 1000 °C substrate temperature
  • Epitaxial growth of Si by E-beam deposition

Thermal processes

  • Heating of substrates up to 1000 °C under deposition or as thermal

pre- or post processing

  • Robotic handling of substrates with temperatures up to 500 °C

Organic deposition

  • Low temp Knudsen cell type

Analysis/characterization

  • RHEED
  • UPS/ARUPS
  • LEED
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WWW.POLYTEKNIK.COM Full-automatic single wafer processing via load lock Manual Loading Full-automatic processing cassette to casette

MODULARITY

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Our unique and user-friendly Cryosoft3 control software increases the quality, throughput and value

  • f your research or production by full data logging and

recipe based deposition developments. The system is based on a strong Beckhoff PLC.  System can run in fully automatic or manual mode.  Software can contain up to 100 recipes.  Multi-layer programming integrated in the software.  Push-button in software for manual start of deposition, after automatic pump down cycles.  High up-time and user-friendly also with multiple users.  Remote access for system observation and control (vacuum pressure, valves, mass flow control, pumps, gas control, shutters, RF and DC generators, etc.

Polyteknik software - Cryosoft3

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A RGA provides an essential and valuable picture of the global gas composition within the process chamber. Software integrated feedback loop in Cryosoft3 utilise these data for:

  • Base pressure quality control - Footprint
  • In-situ dynamic regulation of process for stable and

repeatable depositions in reactive processes.

  • Wide pressure working range up to 10-2 mbar range.

Used for process and quality control, fault detection.

RGA for process control

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Dynamic Plasma Emission Control

Dynamic reactive magnetron sputtering by integration

  • f feedback for control of gas flow and power into our

Cryosoft3 control software to give:

  • Stabile plasma composition
  • Stabile deposition rate
  • Stabile stoichiometry

EMICON MC system incl.

  • spectrometer channels (1 per target)
  • Spectral analysis software

Used for process and quality control, fault detection, plasma process diagnostics.

Precise controlled reactive sputtering with PEM

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System status, material consumption etc.

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Towards Research 4.0

Research 4.0

Open Science 4.0

Science 4.0

Research & Development 4.0

SMART RESEARCH!

Google: About 14.000.000 results Google: less than 200.000 results

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Towards Research 4.0

Ref: Prof. Dr. Dr. h.c. mult. August-Wilhelm Scheer, Scheer GmbH; AWS Institut für digitale Produkte und Prozesse, Saarbrücken

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Towards Research 4.0 (Material Science)

Source: Research and Development 4.0, PWC Strategy& analysis

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FLEXTURA PVD CLUSTER a research 4.0 enabler

University of Oslo – www.norfab.no Purpose: Epitaxial growth and analysis of semiconducting oxides First discussions started in 2016 Installed Q1 2019 Delivery time slightly above 1 year Specialities:

  • +1000 °C substrate temperatures
  • Thermal treatment with N2, O2, H2 and

”Metal” atmosphere

  • Remote Plasma Sputtering
  • DC,RF, HiPIMS (also with remote plasma)
  • In-system analysis
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Remote plasma sputtering DC, RF, HiPIMS Substrate: 1000 °C <E-8 mbar Sputtering with PEM DC, RF, HiPIMS Substrate: 1000 °C <E-8 mbar Load lock, custom cassette 10 pcs and GB (detachable) Thermal pre/post treatment Substrate: 1000 °C <E-8 mbar Analysis/characterisation LEED & UPS/ARUPS Upgradeable with XPS <E-9 mbar Central Transfer Chamber Brooks MAG7S robot E-8 mbar

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Process and transfer modules

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Analysis Module

10 pcs carriers or wafers with a size of 100mm Fully automated substrate handling – x, rot, tilt Two analysis positions - LEED & UPS Base pressure < E-9mbar

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WWW.POLYTEKNIK.COM WHEN THIN FILM MATTERS 21 As an example:

  • Load cassette of 10 or 25 samples in the load lock
  • Apply individual process recipes for each sample
  • The system is processing
  • The system is data-logging the process
  • The system is characterising
  • Pick samples including extensive process datalogs

and characterisation data. Outcome:

  • Increased R&D throughput, reliability, quality
  • Smarter and faster research & development
  • Fast process parameter scanning and tuning
  • More reliable and repeatable experiments
  • More time to plan, discuss, collaborate and interact

with colleagues and other research groups

  • Bridging process development to volume production

Why research 4.0? Why automating research?

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THANK YOU! QUESTIONS?