Th The DAMIC-M Ex M Experi riment Dan Baxter University of - - PowerPoint PPT Presentation

th the damic m ex m experi riment
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Th The DAMIC-M Ex M Experi riment Dan Baxter University of - - PowerPoint PPT Presentation

Th The DAMIC-M Ex M Experi riment Dan Baxter University of Chicago (on behalf of the DAMIC-M collaboration) June 5, 2019 J. Tiffenberg et al , Phys. Rev. Lett. 119 , 131802 (2017) [arXiv:1706.00028 ] Ch Charge-Coupled Device ces


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SLIDE 1

Th The DAMIC-M Ex M Experi riment

Dan Baxter University of Chicago (on behalf of the DAMIC-M collaboration) June 5, 2019

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SLIDE 2

Ch Charge-Coupled Device ces

  • J. Tiffenberg et al, Phys. Rev. Lett. 119, 131802 (2017) [arXiv:1706.00028 ]

Sub-electron readout noise! à single charge resolution

  • DAMIC@SNOLAB has already demonstrated

the capability of fully-depleted silicon CCDs to search for dark matter:

  • A. Aguilar-Arevalo et al, Phys. Rev. Lett. 118, 141803 (2017)

[arXiv:1607.07410]

  • new Skipper CCDs (shown above) allow

consecutive non-destructive readout of a single pixel à sub-electron readout noise

2

  • Non-destructive ionization readout of sub-

keV energy deposits in bulk silicon (675 microns thick)

  • Charges are drifted and collected in 15x15

micron pixels before being read out

  • Charges are moved from pixel-to-pixel until

readout with low charge transfer inefficiency

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SLIDE 3

De Detect ctio ion T Tech chniq ique

  • DAMIC at Modane

(DAMIC-M)

  • DAMIC-M will be

constructed from 50 low background Skipper CCDs (~1 kg)

  • Sub-electron resolution

allows for a 2-3e- threshold (~3 eV)

  • Continuous readout

minimizes leakage current and deadtime

  • Target background rate
  • f <0.1 dru

Preliminary design

3

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SLIDE 4

100 200 300 400 500 600 m) µ Depth ( 2 4 6 8 10 12 14 m) µ (

xy

s

Diffusion Model for Different Fits

  • 1
m µ , b=8.86e-04 2 m µ Gaussian Fit. A=2.16e+02
  • 1
m µ , b=8.57e-04 2 m µ Distribution Median. A=2.30e+02
  • 1
m µ , b=9.76e-04 2 m µ Landau Fit. A=1.83e+02
  • 1
m µ , b=8.80e-04 2 m µ Fixed A Value. A=2.20e+02

Ev Event Re Reconstruction

4 ~σx ~σy

Note: energy effects not shown

preliminary…

  • As charges diffuse across the

CCD, they drift apart

  • The dispersion of collected

charges (σ) carries information about the depth of an event

  • The distribution of

energy over the pixel array tells the event type

4 keV β 41 keV β 4323 keV α

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SLIDE 5

DA DAMIC-M M Se Sensitivity

Hidden Photon Sensitivity Nuclear Recoil Sensitivity

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SLIDE 6

DA DAMIC-M M Se Sensitivity (DM-elec electr tron n scatter ering ing)

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FDM = 1 FDM ∝ 1/q2

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SLIDE 7

Adv Advantages

  • A. Aguilar-Arevalo et al, JINST 10 (2015) P08014 [arXiv:1506.02562]
  • Dark current: demonstrated in

DAMIC@SNOLAB

  • < 10−3 e−pix−1day−1 at operating

temperature of ∼140K

  • Background Rejection: isolation of

certain radioisotopes by observation

  • f multiple decay chain processes
  • Example of a likely 32Si-32P coincidence

with half life of 14.3 days (below)

7

  • Energy Response: linear down

to very low energies (above)

  • Linear within 5% down to 40 eV,
  • r 10 electrons
  • K. Ramanathan et al, Phys. Rev. D 96, 042002 (2017) [arXiv:1706.06053]
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SLIDE 8

Rate (dru)

Ch Challenges s - Ba Backg kground Mo Modeling

  • DAMIC@SNOLAB acts as an

exceptional test-bed for understanding and mitigating background sources

  • We are well underway in

producing a complete background model for DAMIC@SNOLAB (stay tuned…)

  • Dominant backgrounds for

DAMIC-M expected to come from

  • 32Si (can be rejected through

coincidence with 32P)

  • Tritium from silicon

activation (can be mitigated through shielding during transport/storage)

8

DAMIC at SNOLAB

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SLIDE 9

Futur Future e Prospec pects ts

  • Design and CCD Manufacturing underway
  • Background controls and modeling

progressing

  • Construction at Modane begins 2020
  • Physics data in 2023
  • Goal: 1 kg-year at 0.1 dru background
  • Funded by ERC and NSF (2018 – 2023)

9

http://damic.uchicago.edu/

  • 1. Switching to electroformed

copper àeliminate 238U, 232Th, 210Pb contributions

  • 2. Careful handling procedures

à reduced 210Pb surface contributions

  • 3. Clean cabling

à reduced 238U, 232Th, and 40K contributions

  • 4. Shielding during

transport/manufacturing à Reduced 3H, 22Na, and Copper activation products … and more to achieve 0.1 dru