Stretchable and Flexible Stretchable and Flexible Silicon Silicon-
- based Solar Cell Arrays
based Solar Cell Arrays
- Y. Huang
- Depts. of Civil and Environmental Eng. and Mechanical Eng.
Stretchable and Flexible Stretchable and Flexible Silicon Silicon- - - PowerPoint PPT Presentation
Stretchable and Flexible Stretchable and Flexible Silicon Silicon- -based Solar Cell Arrays based Solar Cell Arrays Y. Huang Depts. of Civil and Environmental Eng. and Mechanical Eng. Northwestern University Collaborator: J.A. Rogers
90% of solar cells are made of Si 90% of solar cells are made of Si. Si has good efficiency and reliability. Si is brittle, and fractures at 1% strain.
Si panel can only be placed at roof top, …
Make Si stretchable Investigate the mechanics issues Seek innovative applications (e g e-eye camera Seek innovative applications (e.g., e eye camera,
News agencies: United Press I t ti l International,
…
Display at the p y Tech Museum
Silicon Valley, California
pre =
mother wafer: Si
Fabricate thin ribbon Si device elements Bond elements to prestrained elastomeric substrate PDMS Peel back PDMS; flip over
pre
Si device elements elastomeric substrate PDMS flip over
Flat Si ribbon becomes buckled due to prestrained PDMS
Periodic wavy structures
1
pre
h A ε
% 9 . =
pre
ε Khang, Jiang, Huang, Rogers, Science, 2006
Si
h π λ = 1 − =
c pre Si
h A ε
1 0 1.5 e (μm) % 9 .
pre
ε
independent of pre strain
c
ε λ =
0.5 1.0 Amplitude
3 2
3 1 ⎟ ⎟ ⎞ ⎜ ⎜ ⎛
PDMS
E ε
iti l t i f
1 − =
pre
h A ε
0.0 A 60
μm)
4 ⎟ ⎟ ⎠ ⎜ ⎜ ⎝ =
Si PDMS c
E ε
buckling
1 − =
c Si
h A ε
20 40 elength (μ
h
200 400 20 Wave
c Si
h ε π λ =
Si thickness (nm)
Excellent agreement with experiments
Stretchable Silicon at The Tech San Jose CA Stretchable Silicon at The Tech, San Jose, CA
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NSF Press Release
compressed interconnect ~1 cm compressed interconnect ~1 cm form hemispherical PDMS transfer element ~1 cm adhesive adhesive radially stretch PDMS form Si focal plane array and release from underlying wafer substrate cure adhesive; flop over substrate cure adhesive; flop over substrate integrate optics & interconnect to control electronics to complete the device integrate optics & interconnect to control electronics to complete the device compressible interconnect transfer focal plane array onto PDMS hemispherical focal plane array hemispherical focal plane array Si device island (photodetector & pn diode)
Ko et al., Nature 454, 2008
The interconnects buckle to form “big wave” structure.
Ko et al., Nature 454, 2008
8
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8
yy
8 6 4
yy
8 6 4
yy
2 3 max 2
island bridge bridge island pre
2
xx
2
xx
island island bridge
20 μm
y
20 μm
y
17.5 μm
x
17.5 μm
x
10 μm 10 μm
The island remains almost flat and experiences small strains. The shape of interconnects agrees well with experiments.
Twistability
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long lifetime, bidirectional emission, inexpensive.
li i
bl h l h i
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and diagnostics, biomedical imaging devices, ...
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1 cm 75μm 25μm
unwrapped unwrapped 2.8μm unwrapped 7.0μm 2.8μm unwrapped wrapped wrapped 0.3 cm 75μm wrapped
Health monitoring and human- electronics i t ti interaction
JMPS (2008, 2009, 2010)
Nano Letters (2007, 2008, 2009a,b, 2010) Nature (2008) Nature (2008) Nature Materials (2006, 2008, 2010) Nature Nanotechnology (2006) PNAS (2007, 2008, 2009)
PRL (2010) Science (2006 2008 2009 2010) Science (2006, 2008, 2009, 2010) Science Translational Medicine (2010)
Global buckling happens when the substrate is relatively thin and long; otherwise, local buckling happens.
At a certain thickness of the thin film, for the same length and width of plate, local buckling occurs when the substrate is relatively thicker.
SiO2 single crystal Si
single crystal Si etch SiO single crystal Si etch SiO2 mother wafer: single mother wafer: single l Si crystal Si crystal Si three layers are strongly bonded silicon ribbons sitting on the mother wafer
Khang, Jiang, Huang, Rogers, Science, 2006
100 150 m
2)
0% stretch/compr. Al Al
50 100 ity (mA/cm
0% 3.03% 7.58% 15.56% 22.73% p n stretch/compr. dark
50 rent Dens
22.73% model 50 μm light
1
Curr Bias Voltage (V) g ( )