Stress simulation on a round wheel W target S. Jin 1 , P. Sievers 2 - - PowerPoint PPT Presentation

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Stress simulation on a round wheel W target S. Jin 1 , P. Sievers 2 - - PowerPoint PPT Presentation

Oct 23, 2022 238 likes •636 views

Stress simulation on a round wheel W target S. Jin 1 , P. Sievers 2 , T. Omori 3 , J.Gao 1 1 IHEP; 2 CERN; 3 KEK; POSIPOL2017, BINP, Novosibirsk, Russia, Sept. 18-21, 2017 . 1 Outline Introduction Simulation results of full ring and

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Stress simulation on a round wheel W target

1

  • S. Jin1, P. Sievers2, T. Omori3, J.Gao1

1 IHEP; 2CERN; 3KEK;

POSIPOL2017, BINP, Novosibirsk, Russia, Sept. 18-21, 2017.

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SLIDE 2

Outline

  • Introduction
  • Simulation results of full ring and sliced ring
  • Summary

2

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SLIDE 3

Introduction

  • Main structure of the model

3

Tungsten for power deposition Tungsten Cooling water Cooper

 For model 1, there is no slots in tungsten part;  For model 2, the tungsten is sliced to 10 parts by the slot with a width of 0.2mm;  An intermetallic contact between the W and the Cu, like brazing, is assumed, with a thermal conductance of 2 W/(cm^2 ▪K)  The average power is deposited uniformly in time and space over the top part of the

  • W. In total about 35 Kw

 The water temperature is 50K.

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SLIDE 4

Model-1

4

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SLIDE 5

Model-1

  • Boundaries:
  • Water Temperature: 50C
  • Thermal Conductance for both of water-Cu and W –Cu surface:

0.02W/mm^2

  • Power is only deposited in the top part of the W with

0.0795W/mm^3

  • There is a Cu bar with diameter of 30mm in the center. We fixed it.

5

No slot for tungsten

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SLIDE 6

Results: Temperature distribution

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SLIDE 7

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path 10mm There will be a temperature jump at the interface. interface

Temperature

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SLIDE 8

path

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The temperature is obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Temperature

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SLIDE 9

Results: v. M. Stresses

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SLIDE 10

10

path 10mm

60 65 70 75 80 85 90 95 100 5 10 15 20 25 30 35

v.M.stress (Mpa) l(mm)

  • v. M.stress (MPa)

interface

  • v. M. stresses
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SLIDE 11

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path The v. M. stresses are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

40 50 60 70 80 90 100 110 120 130 140 5 10 15 20

  • v. M.stress(MPa)

l(mm)

Interface v.M.Stress at W Interface v.M.Stress at Cu

The v. M. stresses

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SLIDE 12

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path The stresses at radial direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

  • 50
  • 30
  • 10

10 30 50 70 90 110 130 150 5 10 15 20

Stress at radial direction(MPa) l(mm)

Interface sigma r(y) at W Interface sigma r(y) at Cu

Sigma r

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SLIDE 13

13

path

  • 150
  • 100
  • 50

50 100 150 200 5 10 15 20

Stress at phi direction (MPa) l(mm)

Interface sigma phi(x) at W Interface sigma phi(x) at Cu

The stresses at phi direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Sigma phi

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SLIDE 14

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path The stresses at axial direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

  • 20
  • 15
  • 10
  • 5

5 10 15 5 10 15 20

Stress at axial direction (MPa) l(mm)

Interface sigma z at W Interface sigma z at Cu

Sigma z

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SLIDE 15

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Stresses for Cu at interface. Stresses at the other side of Cu. The Stress here should be because the center bar is fixed as a boundary condition.

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SLIDE 16

Model-2: Sliced W-target with 10 gaps of 0.2mm

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SLIDE 17

Model-2: sliced W-target with 10 gaps of 0.2mm

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The gap is 0.2mm

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SLIDE 18

Results: Temperature distribution

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They are essentially the same as in the full ring, as expected.

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SLIDE 19

Results: Stresses

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SLIDE 20
  • v. M. stress in-plane of contact surface at W wheel
  • v. M. stress in-plane of contact surface at Cu wheel

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  • v. M. Stresses distribution at interface
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SLIDE 21

Stresses at center of the sector

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SLIDE 22

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path  The v. M. stresses are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.  There a binning problem. It should not be a real data.

The v. M. stresses

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SLIDE 23

23

path The stresses at radial direction (sigma x) are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Sigma r

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SLIDE 24

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path The stresses at phi direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Sigma phi

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SLIDE 25

25

path The stresses at axial direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Sigma z

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SLIDE 26

Stresses at end of the sector

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0.2mm gap Path for W is on the surface of W due to gaps

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SLIDE 27

k

path  The v. M. stresses are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.  Path for W is on the surface of W due to the gaps.  Discussion: the max. stress in this picture appearing at the point shown in the picture is about 164Mpa. However, the max. stress for whole model is about 208MPa. It appears at the similar point in one of connection positions between gaps and Cu cooler. Point which has

  • max. stress

The v. M. stresses

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SLIDE 28

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path The stresses at radial direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Sigma r

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SLIDE 29

29

path The stresses at phi direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Sigma phi

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SLIDE 30

30

path The stresses at axial direction are obtained at the surfaces which are both 0.1mm off the interface for Cu and W.

Sigma z

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SLIDE 31
  • Model: it is the same as model-2
  • The v. M. stresses at end-surface are calculation near the interface at

end of sector

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Path at interface: Path(x,y,z /mm)= (-0.1, 220, -20) to (-0.1, 240, -20) Z: to the inside of paper

Stresses check near the interface at end of the sector

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SLIDE 32

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W: (-0.2, 220, -20.1) to (-0.2, 240, -20.1) (-0.4, 220, -20.1) to (-0.4, 240, -20.1) (-0.6, 220, -20.1) to (-0.6, 240, -20.1) (-0.8, 220, -20.1) to (-0.8, 240, -20.1) (-1.0, 220, -20.1) to (-1.0, 240, -20.1) Cu (-0.2, 220, - 19.9) to (-0.2, 240, - 19.9) (-0.4, 220, - 19.9) to (-0.4, 240, - 19.9) (-0.6, 220, - 19.9) to (-0.6, 240, - 19.9) (-0.8, 220, - 19.9) to (-0.8, 240, - 19.9) (-1.0, 220, - 19.9) to (-1.0, 240, - 19.9) W: (-1.0, 220, -20.2) to (-1.0, 240, -20.2) (-1.0, 220, -20.4) to (-1.0, 240, -20.4) (-1.0, 220, -20.6) to (-1.0, 240, -20.6) (-1.0, 220, -20.8) to (-1.0, 240, -20.8) (-1.0, 220, -21) to (-1.0, 240, -21) Cu (-1.0, 220, - 19.8) to (-1.0, 240, - 19.8) (-1.0, 220, - 19.6) to (-1.0, 240, - 19.6) (-1.0, 220, - 19.4) to (-1.0, 240, - 19.4) (-1.0, 220, - 19.2) to (-1.0, 240, - 19.2) (-1.0, 220, - 18) to (-1.0, 240, - 18)

So, we check the paths as following:

Path at interface : Path at interface :

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SLIDE 33

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20 40 60 80 100 120 140 160 180 5 10 15 20

v.M.stress (MPa) l(mm)

x=-0.1 (W) x=-0.2 (W) x=-0.4 (W) x=-0.6 (W) x=-0.8 (W) x=-0.10 (W)

  • v. M. stress for W

W: (-0.2, 220, -20.1) to (-0.2, 240, -20.1) (-0.4, 220, -20.1) to (-0.4, 240, -20.1) (-0.6, 220, -20.1) to (-0.6, 240, -20.1) (-0.8, 220, -20.1) to (-0.8, 240, -20.1) (-1.0, 220, -20.1) to (-01.0, 240, -20.1) Along the interface at tungsten Path at interface :

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SLIDE 34

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  • v. M. stress for Cu

80 90 100 110 120 130 140 5 10 15 20

v.M.stress (MPa) l(mm)

x=-0.1 (Cu) x=-0.2 (Cu) x=-0.4 (Cu) x=-0.6 (Cu) x=-0.8 (Cu) x=-0.10 (Cu)

Cu (-0.2, 220, - 19.9) to (-0.2, 240, - 19.9) (-0.4, 220, - 19.9) to (-0.4, 240, - 19.9) (-0.6, 220, - 19.9) to (-0.6, 240, - 19.9) (-0.8, 220, - 20.1) to (-0.8, 240, - 19.9) (-1.0, 220, - 19.9) to (-1.0, 240, - 19.9) Along the interface at Cu Path at interface :

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  • v. M. stress for W

W: (-1.0, 220, -20.2) to (-1.0, 240, -20.2) (-1.0, 220, -20.4) to (-1.0, 240, -20.4) (-1.0, 220, -20.6) to (-1.0, 240, -20.6) (-1.0, 220, -20.8) to (-1.0, 240, -20.8) (-1.0, 220, -21) to (-1.0, 240, -21)

20 40 60 80 100 120 140 160 5 10 15 20

v.M.stress (MPa) l(mm)

z=-20.2 (W) z=-20.4 (W) z=-20.6 (W) z=-20.8 (W) z=-21 (W)

The path at interface is 1mm far from end section. Path at interface:

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SLIDE 36

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  • v. M. stress for Cu

Cu (-1.0, 220, - 19.8) to (-0.2, 240, - 19.8) (-1.0, 220, - 19.6) to (-0.4, 240, - 19.6) (-1.0, 220, - 19.4) to (-0.6, 240, - 19.4) (-1.0, 220, - 19.2) to (-0.8, 240, - 19.2) (-1.0, 220, - 18) to (-1.0, 240, - 18)

80 85 90 95 100 105 110 115 120 125 130 5 10 15 20

v.M.stress (MPa) l(mm)

z=-19.8 (Cu) z=-19.6 (Cu) z=-19.4 (Cu) z=-19.2 (Cu) z=-19.0 (Cu)

Path at interface:

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SLIDE 37

Comparison and Conclusion

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Peak tempature(℃) Peak v.M stress (MPa) Stresses at interface (Mpa) v.M.stress sigma r sigma phi sigma z Full ring interface for W 377 at W 251 at W 40 to 130 20 to 120

  • 50 to 150
  • 15 to 10

interface for Cu 65 to 125

  • 30 to 10
  • 140 to -50
  • 12 to 0

Sliced ring interface near center of section for W 380 at W 208 at interface 40 to 100 20 to 80 40 to 100

  • 3 to 7

interface near center of section for Cu 80 to 135

  • 10 to 25
  • 130 to -50
  • 2 to 13

interface near end surface of section for W 20 to 150

  • 90 to 10
  • 30 to 15
  • 45 to -4

interface near end surface of section for Cu 90 to 130

  • 90 to -30
  • 140 to -100
  • 5 to 1

Full ring Sliced ring

 Sliced ring suffer much less stress.  However, we need to pay attention to the

  • interface. This can lead to fatigue and thus to loss
  • f thermal contact.
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SLIDE 38

Thanks！

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