SiPM Manufacture for Large Area Detection IP / Projects Manager Dr. - - PDF document

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SiPM Manufacture for Large Area Detection IP / Projects Manager Dr. - - PDF document

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SiPM Manufacture for Large Area Detection IP / Projects Manager Dr. John Murphy Oct. 2007 Core Competence Single Photon Counting (SPC) Silicon Photomultiplier (SPM) Photon Counting/Timing Imager (DigitalAPD) Identical Core Technology

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SiPM Manufacture for Large Area Detection

  • Dr. John Murphy

IP / Projects Manager

  • Oct. 2007
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Core Competence

Photon Counting/Timing Imager (DigitalAPD)

Silicon Photomultiplier (SPM)

Single Photon Counting (SPC)

Identical Core Technology Multiple Configurations

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SPM Product

SPM Module

  • SPMMicro
  • SPMMini
  • SPMScint

TOX SPM Packaged SPM 1mm2, 9mm2 Singulated Die SPM 100/150mm Wafer SPM Arrays

Multiple Configuration Options, see our Website!

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Large Area Detection

  • Advances in solid state sensor technology (SPM)

combined smart interconnect/ packaging solutions.

– Large Area >1” (PMT size) – 2D spatial imaging

  • Primary Applications

– Radiation Monitoring – Medical Imaging – High Energy Particle Detection – X Ray Detection – Flow Cytrometry – Confocal Microscopy – Microarray Scanning

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SPM Packaging - Terminology

SPM Pixel NxN SPM Submodule

MxM SPM Module Example Shown: N = 5; M =3

  • Scaled SPM array architecture
  • Submodules equivalent to 1.5” PMT sizes
  • 4-side buttable
  • Electronics integration
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SPM Key Properties

  • Sensitive to single photons
  • Excellent Photon Counting

(Resolvable Photoelectron Peaks)

  • 1mm2 and 9mm2 available
  • High Intrinsic Gain 106
  • High PDE

– 25-40% Green/Red – 40-60% Blue/UV

  • Good Dynamic Range/Linearity
  • Low Operating Voltage <40V
  • Insensitive to Magnetic Fields
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SensL Die Manufacturing

  • Manufacturability is KEY

Tyndall National Institute Commercial Foundry 100mm 150mm

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Geometrical efficiency

  • A35H - 60% Fill Factor
  • A50H – 70%

C20 A20L A20H 17% 34% 43%

  • PDE = effective QE x Fill Factor
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Tight distributions, across wafer, wafer to wafer, run to run. Breakdown voltage independent of diode structure, size

Example Breakdown Uniformities

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Large Area SPM

  • PMT area equivalents >0.5”
  • 3 Array Approaches Pursued

– Flex Arrays – Glass Arrays – Ceramic Arrays

  • Pixellated/Summed Outputs
  • Buttable Submodules (Pixellated)
  • Coupling Efficiency – Ideally butt coupled
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Flex Arrays

Source Block Emission Facet Detector Array (tiled NxN – example N =4) Individual SPM detectors Detection Facet with metal tracks & bondpad sites Transparent or perforated thin film sheet (polyimide flex) with metal tracks (tracks not shown) sandwiched between source & detector.

Detector Interconnection

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Flex Arrays

SPMArray

– NxN SPM individually addressed – Spatial detection

SPMPlus

– NxN array summed output – Large Area detection Flex Benefits

  • Low cost/Lightweight
  • Scalable
  • Simplified electrical

interconnections

  • Small Form Factor

British Patent Application No. 0621495.1, October 2006.

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Package Concepts

  • Fig. 2: Concept for full module assembly – 1x3 module shown.

(Drawings not to scale). Electronics - PCB. Intermediate layer grid – between detector and scintillator. Glass Substrate. SPM detectors. Ribbon electrical interconnect .

  • Fig. 1: 3x3 Module showing 9 submodules each with a 5x5

hybrid assembly of SPM detectors 3mm x 3mm SPM detectors Submodule of 25 SPM detectors

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Glass Arrays

  • SPM flip-chip on glass

4x4 SPM Pixellated Output “SPM Array” 4x4 SPM Summed Output “SPM Plus”

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Glass Manufacture

  • Shipping prototypes to customers
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IV Curves

10 15 20 25 30 35 1.0E-10 1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02

D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16

Bias Voltage(V) I(A)

10 15 20 25 30 35 1.0E-10 1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02

D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16

Bias Voltage(V) I(A)

10 15 20 25 30 35 1.0E-10 1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02

D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16

Bias Voltage(V) I(A)

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SPM Plus & SPM Array Schematic

SMA Connectors x 16 SMA Connectors x 1 Glass Module Standoffs Jack socket Board to board Connectors Motherboard Pre-amp circuit Wire to board

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Ceramic Arrays

Specification Value SPM submodule size Variable from 0.5” to 1.5” (present) Pixel to pixel spacing within submodule <200µm (target 100µm) N x N Submodule Fill Factor

  • Typ. 46.6%

Submodule to submodule spacing Minimum 1mm Submodule Substrate Ceramic with BGA Optical Encapsulant OPTOCAST, DYMAX and EPOTEK

  • In Assembly – due Nov. ’07
  • 4 side buttable solution
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Summary & Q’s

  • Cooling is key development
  • 3 approaches –

– Glass (now available) – Flex (true buttability, thinnnest working distance) – Ceramic (true buttability)

  • What is the total detector area required?
  • What wavelength region is of interest?
  • What are spatial resolution requirements?
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www.sensl.com

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Thank You! jmurphy@sensl.com John Murphy

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Q.E. curve of new device

Our blue-sensitive devices are currently in test, so it is fair to say that the 40-60% is a target value I think. The curve attached shows the predicted (modelled) values that we expect to achieve for our blue devices.