Technical Overview Thermal Polyimide MCPCB David Sutton Research - PowerPoint PPT Presentation

DuPont TM CooLam TM Technical Overview Thermal Polyimide MCPCB David Sutton Research Engineer DuPont Electronic Technologies October, 2006 DAVID.L.SUTTON-1@usa.dupont.com

2 Technical Review_CooLam TM • Product Overview • Material Characterization • Reliability Performance 10/11/2006 Patent Pending

3 DuPont™ CooLam™ Constructions Copper Thermally Conductive Polyimide Aluminum / Cu 35 to 140 µ m · Copper Thickness: · Copper Type: Roll Annealed 17 µ m · Polyimide Thickness: · Aluminum Thickness: 1 to 3 mm · Aluminum Type: 5052 H-32 10/11/2006 Patent Pending

4 Properties & Interaction Thermal Thickness Conductivity • thermal resistance • thermal resistance • dielectric strength • dielectric strength Key Properties • Thermal Resistance • Dielectric Strength Breakdown Metal Surface Voltage • Peel Strength • dielectric strength • thickness • adhesion • filler loading • filler type Filler Loading • dielectric strength • thermal conductivity • adhesion 10/11/2006 Patent Pending

5 CooLam TM Cross-Sectional View Filled Epoxy CooLam tm 4 oz. Cu 4 oz. Cu Layer #1 Layer #1 Layer #2 4 oz. Cu 4 oz. Cu Layer #2 (150 µm)dielectric 17 µm dielectric 10/11/2006 Patent Pending

6 Technical Review_CooLam TM • Product Overview • Material Characterization • Reliability Performance 10/11/2006 Patent Pending

High Performance Materials Group 7 CooLam TM Property Characterization Property Units Performance Thermal Thermal Conductivity (70 ° C) 0.8 (z axis) W/m-K 1.2 (x-y axis) Thermal Impedance ºC-m 2 /watt 2.28 x 10 -5 Electrical Breakdown Voltage VAC (08070171000) 2400 Dielectric Constant (Dk) 1 MHz 5.3 Physical Moisture Absorption % 1.0 MOT (UL 746) 130 ( ≈ 175) ºC Flammability UL94 meets V-O Mechanical Bond Strength (as-received) kg/cm 2.85 10/11/2006 Patent Pending

8 Technical Review_CooLam TM • Product Overview • Material Characterization • Reliability Performance 10/11/2006 Patent Pending

9 CooLam TM Reliability Performance Performance and Reliability Testing • Dielectric Strength - per ASTM-D-149 ( film) film) • Copper Adhesion - per IPC-TM-650 2.4.9 • Thermal Conductivity - per ASTM E1461 ( film) film) Environmental Stress Conditions • 1000 hour exposure to 85°C/85%RH • 1000 hour exposure at - 40°C • 1000 hour exposure at +150°C • 1000 thermal cycle, -40°C to +150°C High Temperature Thermal Aging • 230, 250, 300 deg.C 10/11/2006 Patent Pending

10 Breakdown Voltage (dielectric) Breakdown Voltage Initial TCT 85C/85%RH Aging Cryogenic • ASTM-D149 (in air) 1000 cycle 1000 hr 1000 hr 1000 hr • 300 VAC/sec. ramp rate • Dielectric film only BDV 3240 3654 2800 3450 3392 (VAC) Electrode (+) VAC Dielectric film ( 17 um) Power (-) Ground Supply 10/11/2006 Patent Pending

11 Peel Strength (Cu/PI/AL) Peel Strength Initial TCT 85C/85%RH Aging Cryogenic • IPC 2.4.9, method B 1000 cycle 1000 hr 1000 hr 1000 hr • 5 cm/min peel rate_90° flat table Peel Strength • 3 mm trace width (0.120 in.) 13.6 12.9 12.2 12.9 12.2 (lb/in) 2.39 2.27 2.14 2.25 2.13 (N/mm) 70um (2 oz. Cu) Dielectric film ( 17 um) 2 mm Aluminum 10/11/2006 Patent Pending

12 Thermal Conductivity (dielectric) Thermal Conductivity Initial TCT 85C/85%RH Aging Cryogenic • ASTM E1461 1000 cycle 1000 hr 1000 hr 1000 hr • Model LFA 447_Nano-Flash Method Thermal Conductivity • Sample size: 15mm x 250mm thick 0.82 0.82 0.81 0.86 0.79 (W/m-K) 15 mm test sample DuPont TC dielectric film (14 layer x 17 um) 14 layers of 17 um dielectric laminated together 10/11/2006 Patent Pending

13 Thermal Conductivity_High Temperature Aging 230 ° C 230 ° C/5 Days 230 ° C/10 Days As-Received W/m-K 0.781 0.796 0.786 % Change 0 + 2% + 1% 250 ° C 250 ° C/5 Days 250 ° C/10 Days As-Received W/m-K 0.781 0.791 0.829 % Change 0 + 1% + 6% 300 ° C 300 ° C/5 Days 300 ° C/10 Days As-Received W/m-K 0.781 0.786 0.840 % Change 0 + 1% + 8% 10/11/2006 Patent Pending

14 Breakdown Voltage_High Temperature Aging 230 ° C 230 ° C/5 Days 230 ° C/10 Days As-Received VAC 3560 3610 3200 % Change 0 % + 1 % -10.1 % 250 ° C As-Received 250 ° C/5 Days 250 ° C/10 Days VAC 3560 3630 3570 % Change 0 % + 2.0 % + 0.3 % 300 ° C As-Received 300 ° C/5 Days 300 ° C/10 Days VAC 3560 3120 3160 % Change 0 % - 12.4% - 11.2 % 10/11/2006 Patent Pending

15 Peel Strength-High Temperature Aging (per: IPC 2.4.9, method B) 230 ° C 230 ° C/5 Days 230 ° C/10 Days As-Received lbs/in 14.04 13.34 11.50 N/mm 2.46 2.34 2.01 250 ° C As-Received 250 ° C/5 Days 250 ° C/10 Days lbs/in 14.04 12.14 12.80 N/mm 2.46 2.13 2.24 300 ° C As-Received 300 ° C/5 Days 300 ° C/10 Days lbs/in 14.04 9.07 7.17 N/mm 2.46 1.56 1.26 10/11/2006 Patent Pending

16 CooLam TM - Thermal Performance Simulation • Versus conventional filled epoxy thermal substrates (2.2 W/m-K). • Based on a simulation of a specific LED package on a MC PCB. Material Additional Power Input* CooLam - 17 µm thickness >25% * Significant increase in power input to LED with no increase in junction temperature of LED! Lower junction temperature with CooLam tm materials at the same power input! Material Junction Temp** MC PCB “A” (2.2 W/m-K) 120 o C CooLam - 17 µm thickness 114 o C Based on a simulation of a specific LED package on a MC PCB. Ambient 85 o C 10/11/2006 Patent Pending