Technical Overview Thermal Polyimide MCPCB David Sutton Research - - PowerPoint PPT Presentation

DuPontTM CooLamTM Technical Overview Thermal Polyimide MCPCB

David Sutton Research Engineer DuPont Electronic Technologies October, 2006

DAVID.L.SUTTON-1@usa.dupont.com

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Patent Pending

Technical Review_CooLamTM

• Product Overview
• Material Characterization
• Reliability Performance

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Patent Pending

DuPont™ CooLam™ Constructions

Copper Thermally Conductive Polyimide Aluminum / Cu

· Copper Thickness: 35 to 140 µm · Copper Type: Roll Annealed · Polyimide Thickness: 17 µm · Aluminum Thickness: 1 to 3 mm · Aluminum Type: 5052 H-32

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Patent Pending

Key Properties

• Thermal Resistance
• Dielectric Strength
• Peel Strength

Thermal Conductivity Thickness Breakdown Voltage Filler Loading Metal Surface

Properties & Interaction

• thermal resistance
• dielectric strength
• thickness
• filler loading
• filler type
• dielectric strength
• thermal conductivity
• adhesion
• dielectric strength
• adhesion
• thermal resistance
• dielectric strength

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Patent Pending

(150 µm)dielectric 17 µm dielectric

4 oz. Cu 4 oz. Cu 4 oz. Cu 4 oz. Cu

Layer #1 Layer #2 Layer #1 Layer #2

CooLamTM Cross-Sectional View

Filled Epoxy CooLamtm

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Patent Pending

Technical Review_CooLamTM

• Product Overview
• Material Characterization
• Reliability Performance

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Patent Pending

Property Units Performance Thermal

Thermal Conductivity (70°C) W/m-K 0.8 (z axis) 1.2 (x-y axis) Thermal Impedance ºC-m2/watt 2.28 x 10-5

Electrical

Breakdown Voltage VAC (08070171000) 2400 Dielectric Constant (Dk) 1 MHz 5.3

Physical

Moisture Absorption % 1.0 MOT (UL 746) ºC 130 (≈ 175) Flammability UL94 meets V-O

Mechanical

Bond Strength (as-received) kg/cm 2.85

High Performance Materials Group

CooLamTM Property Characterization

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Patent Pending

Technical Review_CooLamTM

• Product Overview
• Material Characterization
• Reliability Performance

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Patent Pending

Environmental Stress Conditions

• 1000 hour exposure to 85°C/85%RH
• 1000 hour exposure at - 40°C
• 1000 hour exposure at +150°C
• 1000 thermal cycle, -40°C to +150°C

Performance and Reliability Testing

• Dielectric Strength
• per ASTM-D-149 (film)

film)

• Copper Adhesion
• per IPC-TM-650 2.4.9
• Thermal Conductivity
• per ASTM E1461 (film)

film)

CooLamTM Reliability Performance

High Temperature Thermal Aging

• 230, 250, 300 deg.C

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Breakdown Voltage (dielectric)

Breakdown Voltage

• ASTM-D149 (in air)
• 300 VAC/sec. ramp rate
• Dielectric film only

(-) Ground

Electrode (+) Dielectric film (17 um) VAC Power Supply Initial TCT 1000 cycle 85C/85%RH 1000 hr Aging 1000 hr Cryogenic 1000 hr BDV (VAC)

3240 3654 2800 3450 3392

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Patent Pending

Peel Strength (Cu/PI/AL)

2 mm Aluminum

70um (2 oz. Cu)

Dielectric film (17 um)

Peel Strength

• IPC 2.4.9, method B
• 5 cm/min peel rate_90° flat table
• 3 mm trace width (0.120 in.)

Initial TCT 1000 cycle 85C/85%RH 1000 hr Aging 1000 hr Cryogenic 1000 hr Peel Strength (lb/in) (N/mm)

13.6 2.39 12.9 2.27 12.2 2.14 12.9 2.25 12.2 2.13

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Patent Pending

Thermal Conductivity (dielectric)

Thermal Conductivity

• ASTM E1461
• Model LFA 447_Nano-Flash Method
• Sample size: 15mm x 250mm thick

15 mm test sample

DuPont TC dielectric film (14 layer x 17 um)

14 layers of 17 um dielectric laminated together Initial TCT 1000 cycle 85C/85%RH 1000 hr Aging 1000 hr Cryogenic 1000 hr Thermal Conductivity (W/m-K)

0.82 0.82 0.81 0.86 0.79

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Patent Pending

230 °C

As-Received 230 °C/5 Days 230 °C/10 Days W/m-K 0.781 0.796 0.786 % Change + 2% + 1%

250 °C

As-Received 250 °C/5 Days 250 °C/10 Days W/m-K 0.781 0.791 0.829 % Change + 1% + 6%

300 °C

As-Received 300 °C/5 Days 300 °C/10 Days W/m-K 0.781 0.786 0.840 % Change + 1% + 8%

Thermal Conductivity_High Temperature Aging

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Patent Pending

230 °C

As-Received 230 °C/5 Days 230 °C/10 Days VAC 3560 3610 3200 % Change 0 % + 1 %

• 10.1 %

250 °C

As-Received 250 °C/5 Days 250 °C/10 Days VAC 3560 3630 3570 % Change 0 % + 2.0 % + 0.3 %

300 °C

As-Received 300 °C/5 Days 300 °C/10 Days VAC 3560 3120 3160 % Change 0 %

• 12.4%
• 11.2 %

Breakdown Voltage_High Temperature Aging

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Patent Pending

230 °C

As-Received 230 °C/5 Days 230 °C/10 Days lbs/in 14.04 13.34 11.50 N/mm 2.46 2.34 2.01

Peel Strength-High Temperature Aging (per: IPC 2.4.9, method B)

250 °C

As-Received 250 °C/5 Days 250 °C/10 Days lbs/in 14.04 12.14 12.80 N/mm 2.46 2.13 2.24

300 °C

As-Received 300 °C/5 Days 300 °C/10 Days lbs/in 14.04 9.07 7.17 N/mm 2.46 1.56 1.26

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Patent Pending

CooLamTM - Thermal Performance Simulation

Material Additional Power Input* CooLam

• 17 µm thickness

>25% * Significant increase in power input to LED with no increase in junction temperature

• f LED!

Lower junction temperature with CooLamtm materials at the same power input! Material Junction Temp** MC PCB “A” (2.2 W/m-K) 120 oC CooLam

• 17 µm thickness

114 oC Based on a simulation of a specific LED package on a MC PCB. Ambient 85 oC

• Versus conventional filled epoxy thermal substrates (2.2 W/m-K).
• Based on a simulation of a specific LED package on a MC PCB.