SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t - - PowerPoint PPT Presentation

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SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t - - PowerPoint PPT Presentation

Sep 18, 2023 139 likes •409 views

Patent Pending Patent Pending SinkPAD TM SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t PCB T h l f the LED Application Sinkpad Corporation R5 Users of SinkPAD TM technology are reminded that they bear the

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SLIDE 1

Patent Pending

SinkPAD SinkPADTM

TM

Th ll Effi i t PCB T h l f

Patent Pending

Thermally Efficient PCB Technology for the LED Application

Sinkpad Corporation

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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes no warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.

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SLIDE 2

PRESENTATI ON OUTLI NE

 Thermal Challenges In The LED Applications  How it is Addressed? Metal Back PCB Technology  Is There a Better Way? SinkPADTM Technology y gy  What Would I Gain Using SinkPADTM?  Comparisons Of “Metal Back” & “SinkPADTM”  Comparisons Of Metal Back & SinkPADTM  Potential Applications  Test Data  Conclusion

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SLIDE 3

THERMAL CHALLANGES

 Increasing Trend For LED Power  Increasing Trend For LED Power  Increasing Trend For Higher Brightness  Primary Thermal Path: Conduction Cooling  Higher Thermal Resistance  Power Density Increasing – more LEDs in a small area  Long Life Expectation  Long Life Expectation

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SLIDE 4

How Heat I ssues Addressed Historically?

 Metal Back PCB Technology

Example: MCPCB, Aluminum PCB etc…type products

THERMALLY CONDUCTIVE DIELECTRICS  Arlon 92ML – 2.0W/m.k

Example: MCPCB, Aluminum PCB etc…type products

 Bergquist – 2.2-3.0W/m.k  Doosan – 2.0W/m.k  Denka Hit Plate – 2.0-8.0 W/m.k  DuPont CoolLam – Polyimide based – 0.80W/m.k  ITEQ- IT859 GTA – 2.0W/m.k  Laird Technology HKA 3 0W/m k

Thermally Conductive Dielectric

 Laird Technology HKA – 3.0W/m.k  Polytronics – 2.7W/m.k  Sekisui – 2.0W/m.k  Ventec - VT 4A1 – 1.6W/m.k

Thermally Conductive Dielectric (TC~ 1 to 4 W/m.k) Thermal Pad

Z-axis Heat

Thermal Pad

  • r Bond Pad

Metal Thermal Conductivity (TC)

Al ~ 135-180W/m.k

Z-axis Heat Transfer rate: Only 1-4 W/m.k

Cu ~ 385W/m.k

Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material

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SLIDE 5

I s There a Better Way to Remove Heat?

YES

SinkPADTM Technology SinkPADTM Technology

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SLIDE 6

What is SinkPAD?

SinkPADTM is a MCPCB Technology gy

Which Provides

Direct Thermal Path to Hot LED Direct Thermal Path to Hot LED

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SLIDE 7

“SinkPAD SinkPADTM

TM” TECHNOLOGY

 Direct Heat Transfer (NO dielectric barrier)

Patent Pending

Circuit Layer Standard Dielectric material

SinkP SinkPAD

Z-axis Heat

Metal Thermal Conductivity (TC)

Al ~ 135-180W/m.k Cu ~ 385W/m.k

Transfer rate: 150-385 W/m.k

Cu 385W/m.k

Z-axis heat transfer is same as the TC of the base material used

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SLIDE 8

“SinkPAD SinkPADTM

TM” TECHNOLOGY

 Top View of a SinkPAD SinkPADTM

TM PCB

Patent Pending

SinkP SinkPAD D

Circuit pad Circuit traces

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SLIDE 9

COMPARI SI ON OF “METAL BACK” & “SinkPAD SinkPAD”

“Metal Back PCB” “SinkP SinkPADTM

TM PCB

PCB”

Patent Pending

 Higher Thermal Resistance  Slow Heat Transfer Rate  Special Dielectric Required  Thick Base Metal Required  Direct Thermal Path  Fast Heat Transfer Rate  Standard Dielectric Used  Thinner Base Metal Options

q

 Limited to Epoxy dielectric only  Metal is Insulated Thermally From The

Component p

 Epoxy, Polyimide or any typical dielectric can be

used

 Metal is Connected Thermally to the Component

 “No” PCB Design Change Required  No PCB Design Change Required

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SLIDE 10

“SinkPAD SinkPADTM

TM” TECHNOLOGY

 Multilayer Examples

“ l k C ” “SinkP SinkPADTM

TM PCB

PCB”

Patent Pending PTH Pl t d Th h H l

Does not increase thermal resistance Substantial increase in thermal resistance

“Metal Back PCB” SinkP SinkPADTM

TM PCB

PCB

PTH = Plated Through Holes

Limitation: Components can be assembled only on one side of the PCB

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SLIDE 11

REQUI REMENT TO USE SinkPAD SinkPADTM

TM

Patent Pending

 “Thermal Path” should be electrically neutral or isolated from the Anode and Cathode within the LED package Example packages: Anode and Cathode within the LED package. Example packages:

Neutral Thermal Path packages

  • Luxeon Rebel
  • Elec. Active Thermal Path packages
  • Osram - Golden Dragon
  • Cree – XP, XR, XTE. XBD, XML MT-G, MCE
  • Everlight– Shuen, Shwo, Yi, Tsan series
  • Luminus – PhlatLight SST-90, SSM80
  • Osram – OSLON SSL

g

  • Seoul - Z-Power
  • Avago Moonstone Emitter

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  • Osram OSLON SSL
  • Nichia - N219
  • Seoul Z5P, Z5M
  • Samsung 3535

 

Can not solder directly to the SinkPADTM surface

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SLIDE 12

SinkPAD SinkPADTM

TM Product Family

Patent Pending

SinkPAD P/ N Base Metal Base Metal thickness

SP-A530

ALUMINUM 5052 ~ 0.032” (~ 0.80mm)

SP-A540*

ALUMINUM 5052 ~ 0.040” (~ 1.0mm)

SP-A560*

ALUMINUM 5052 ~ 0.063” (~ 1.60mm)

SP-A630

ALUMINUM 6061 ~ 0.032” (~ 0.80mm)

SP-A640

ALUMINUM 6061 ~ 0.040” (~ 1.0mm)

SP A640

ALUMINUM 6061 0.040 ( 1.0mm)

SP-A660

ALUMINUM 6061 ~ 0.059” (~ 1.50mm)

SP-C40

COPPER ~ 0.040” (~ 1.0mm)

SP-C60

COPPER ~ 0.059” (~ 1.50mm) * Most running product 12

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SLIDE 13

POTENTI AL APPLI CATI ONS

 Commercial / I ndustrial lights

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SLIDE 14

POTENTI AL APPLI CATI ONS

 Street lights

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SLIDE 15

POTENTI AL APPLI CATI ONS

 Back lights

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SLIDE 16

POTENTI AL APPLI CATI ONS

 PAR38 bulbs

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SLIDE 17

POTENTI AL APPLI CATI ONS

 Residential down lights

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SLIDE 18

TEST DATA

 SinkPAD v/s MCPCB thermal data

th

SinkPAD Rth: 0.45 0C/W

th

MCPCB Rth : 1.75 0C/W deg C) deg C) Power (W) Power (W) dT * dT *

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SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp

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SLIDE 19

TEST DATA, Cree 1-XPG

 SinkPAD v/s Typical Aluminum back PCB thermal data

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SLIDE 20

TEST DATA, Cree 9-XPG

 SinkPAD v/s Conventional MCPCB thermal data (IR Camera)

MCPCB SinkPAD PCB

  • Cree XPG 9 LEDs
  • Current: 1 Amp.
  • Power: 3W each
  • PCB ~ 1”x1”

1410 C 1190 C

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SinkPADTM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPADTM pcb running ~220C cooler than on the conventional MCPCB

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SLIDE 21

TEST DATA, Luxeon Rebel at 700mA

 SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

  • Luxeon Rebel at 700mA

Luxeon Rebel at 700mA

MCPCB Type-1 MCPCB Type 1 MCPCB Type-24

MCPCB-1 MCPCB 1 MCPCB-2

Test was conducted by Quadica Developments Inc

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LED on a SinkPADTM PCB running ~290C cooler than on the MCPCB-1 and 100C cooler than the MCPCB-2

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SLIDE 22

TEST DATA, Luxeon Rebel at 1A

 SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

  • Luxeon Rebel at 1000mA

Luxeon Rebel at 1000mA

MCPCB Type-1 MCPCB Type-1 MCPCB Type-24

MCPCB-1 MCPCB-2

Test was conducted by Quadica Developments Inc

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LED on a SinkPADTM PCB running ~470C cooler than on the MCPCB-1 and 160C cooler than the MCPCB-2

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SLIDE 23

Other Available Test Data Nichia N219 Luxeon Rebel Luxeon Rebel Cree MTG Osram Oslon SSL Osram Oslon SSL Cree XML

Customize Your Test Customize Your Test

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SLIDE 24

Advantages of SinkPAD Lower LED Junction Temperature Lower LED Junction Temperature

As a result: 1) O ti t LED t l j ti t t 1) Option to run LED at lower junction temperature

 i.e Increase Life of the LED Fixture

2) Option to run LED at higher power / maintain temperature

 i.e. Get more lumens per LED

3) R d b f LED li h 3) Reduce number of LEDs to get same light

 i.e. Reduces Fixture Cost

Industry Experts say:

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“LED life doubles at every 10 “LED life doubles at every 10oC it runs cooler” C it runs cooler”

Industry Experts say:

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SLIDE 25

Highlights and Q&A

 Magnitude Higher Thermal Transfer Rate

  • Direct Thermal Path

Patent Pending

  • Direct Thermal Path
  • 135 to 385W/m.k vs. 1 to 4 W/m.k
  • LOWER JUNCTION TEMPERATURE

 High Tg (Up to 225oC)  Multilayer Possible Without Increase In Thermal Resistance  Weight Saving

  • Possibly thinner profile

 Di t R l t f MCPCB M t l B k PCB & Al i PCB  Direct Replacement for MCPCB, Metal Back PCB & Aluminum PCB  Most Economical Direct Thermal Path Solution  Q&A Q

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SLIDE 26

THANK YOU THANK YOU

For more information contact eng@sinkpad.com Visit us at www.sinkpad.com

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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes no warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.