SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t - - PowerPoint PPT Presentation

▶
sinkpad
SMART_READER_LITE
LIVE PREVIEW

SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t - - PowerPoint PPT Presentation

Jul 23, 2023 379 likes •656 views

Patent Pending Patent Pending SinkPAD TM SinkPAD TM Thermally Efficient PCB Technology for Th ll Effi i t PCB T h l f the LED Application Sinkpad Corporation R3 Users of SinkPAD TM technology are reminded that they bear the

slide-1
SLIDE 1

Patent Pending

SinkPAD SinkPADTM

TM

Th ll Effi i t PCB T h l f

Patent Pending

Thermally Efficient PCB Technology for the LED Application

Sinkpad Corporation

1

R3

Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes no warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.

slide-2
SLIDE 2

PRESENTATI ON OUTLI NE

 Thermal Challenges In The LED Applications  How it is Addressed? Metal Back PCB Technology  Is There a Better Way? SinkPADTM Technology y gy  What Would I Gain Using SinkPADTM?  Comparisons Of “Metal Back” & “SinkPADTM”  Comparisons Of Metal Back & SinkPADTM  Potential Applications  Test Data  Conclusion

2

R3

slide-3
SLIDE 3

THERMAL CHALLANGES

 Increasing Trend For LED Power  Increasing Trend For LED Power  Increasing Trend For Higher Brightness  Primary Thermal Path: Conduction Cooling  Higher Thermal Resistance  Power Density Increasing – more LEDs in a small area  Long Life Expectation  Long Life Expectation

3

R3

slide-4
SLIDE 4

How Heat I ssues Addressed Historically?

 Metal Back PCB Technology

Example: MCPCB, Aluminum PCB etc…type products

THERMALLY CONDUCTIVE DIELECTRICS  Arlon 92ML – 2.0W/m.k

Example: MCPCB, Aluminum PCB etc…type products

 Bergquist – 2.2-3.0W/m.k  Doosan – 2.0W/m.k  Denka Hit Plate – 2.0-8.0 W/m.k  DuPont CoolLam – Polyimide based – 0.80W/m.k  ITEQ- IT859 GTA – 2.0W/m.k  Laird Technology HKA 3 0W/m k

Thermally Conductive Dielectric

 Laird Technology HKA – 3.0W/m.k  Polytronics – 2.7W/m.k  Sekisui – 2.0W/m.k  Ventec - VT 4A1 – 1.6W/m.k

Thermally Conductive Dielectric (TC~ 1 to 4 W/m.k) Thermal Pad

Z-axis Heat

Thermal Pad

  • r Bond Pad

Metal Thermal Conductivity (TC)

Al ~ 135-180W/m.k

Z-axis Heat Transfer rate: Only 1-4 W/m.k

Cu ~ 385W/m.k

Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material

4

R3

slide-5
SLIDE 5

I s There a Better Way to Remove Heat?

YES

SinkPADTM Technology SinkPADTM Technology

5

R3

slide-6
SLIDE 6

What is SinkPAD?

SinkPADTM is a MCPCB Technology gy

Which Provides

Direct Thermal Path to Hot LED Direct Thermal Path to Hot LED

6

R3

slide-7
SLIDE 7

“SinkPAD SinkPADTM

TM” TECHNOLOGY

 Direct Heat Transfer

Patent Pending

To view & download this info “Register” below Register below. I f you already have Registered before; click on “login” below Or send an email request at

Z-axis Heat

q eng@sinkpad.com

Metal Thermal Conductivity (TC)

Al ~ 135-180W/m.k Cu ~ 385W/m.k

Transfer rate: 150-385 W/m.k

Cu 385W/m.k

Z-axis heat transfer is same as the TC of the base material used

7

R3

slide-8
SLIDE 8

What would I gain using SinkPAD? SinkPAD PCB will Lower LED Junction Temperature

Which means : 1) O ti t LED t l j ti t t 1) Option to run LED at lower junction temperature

 i.e Increase Life of the LED Fixture

2) Option to run LED at higher power / maintain temperature

 i.e. Get more lumens per LED

3) R d b f LED li h 3) Reduce number of LEDs to get same light

 i.e. Reduces Fixture Cost

4) Hi h D i C t B i ht Li ht F C t

8

R3

4) Higher Drive Currents, Brighter Light, Fewer Components

slide-9
SLIDE 9

“SinkPAD SinkPADTM

TM” TECHNOLOGY

 Top View of a SinkPAD SinkPADTM

TM PCB

Patent Pending

SinkP SinkPAD D

Circuit pad Circuit traces

9

R2

slide-10
SLIDE 10

SinkPAD SinkPADTM

TM Product Family

Patent Pending

SinkPAD P/ N Base Metal Base Metal thickness

SP-A530

ALUMINUM 5052 ~ 0.032” (~ 0.80mm)

SP-A540*

ALUMINUM 5052 ~ 0.040” (~ 1.0mm)

SP-A560*

ALUMINUM 5052 ~ 0.063” (~ 1.60mm)

SP-A630

ALUMINUM 6061 ~ 0.032” (~ 0.80mm)

SP-A640

ALUMINUM 6061 ~ 0.040” (~ 1.0mm)

SP A640

ALUMINUM 6061 0.040 ( 1.0mm)

SP-A660

ALUMINUM 6061 ~ 0.059” (~ 1.50mm)

SP-C40

COPPER ~ 0.040” (~ 1.0mm)

SP-C60

COPPER ~ 0.059” (~ 1.50mm) * Most running product 10

R3

slide-11
SLIDE 11

COMPARI SI ON OF “METAL BACK” & “SinkPAD SinkPAD”

“Metal Back PCB” “SinkP SinkPADTM

TM PCB

PCB”

Patent Pending

To view & download this info To view & download this info “Register” below. I f you already have Registered before; click on “login” below Or send an email request at eng@sinkpad.com  Higher Thermal Resistance  Slow Heat Transfer Rate  Special Dielectric Required  Thick Base Metal Required  Direct Thermal Path  Fast Heat Transfer Rate  Standard Dielectric Used  Thinner Base Metal Options

q

 Limited to Epoxy dielectric only  Metal is Insulated Thermally From The

Component p

 Epoxy, Polyimide or any typical dielectric can be

used

 Metal is Connected Thermally to the Component

 “No” PCB Design Change Required  No PCB Design Change Required

9

R5

slide-12
SLIDE 12

“SinkPAD SinkPADTM

TM” TECHNOLOGY

 Multilayer Examples

“ l k C ” “SinkP SinkPADTM

TM PCB

PCB”

Patent Pending

Does not increase thermal resistance Substantial increase in thermal resistance

“Metal Back PCB” SinkP SinkPADTM

TM PCB

PCB

To view & download this info “Register” below. I f you already have Registered before; click on “login” below Or send an email request at eng@sinkpad com eng@sinkpad.com

Limitation: Components can be assembled only on one side of the PCB

12

R3

slide-13
SLIDE 13

REQUI REMENT TO USE SinkPAD SinkPADTM

TM

T i & d l d thi i f To view & download this info “Register” below. I f you already have Registered before; click on “login” below Or send an email request at eng@sinkpad.com

13

slide-14
SLIDE 14

POTENTI AL APPLI CATI ONS

 Commercial / I ndustrial lights

14

R3

slide-15
SLIDE 15

POTENTI AL APPLI CATI ONS

 Street lights

15

R3

slide-16
SLIDE 16

POTENTI AL APPLI CATI ONS

 Back lights

16

R3

slide-17
SLIDE 17

POTENTI AL APPLI CATI ONS

 PAR38 bulbs

17

R3

slide-18
SLIDE 18

POTENTI AL APPLI CATI ONS

 Residential down lights

18

R3

slide-19
SLIDE 19

POTENTI AL APPLI CATI ONS

 LED Packaging Substrate

19

R3

slide-20
SLIDE 20

TEST DATA

 SinkPAD v/s MCPCB thermal data

th

SinkPAD Rth: 0.45 0C/W

th

MCPCB Rth : 1.75 0C/W deg C) deg C) Power (W) Power (W) dT * dT *

20

R5

SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp

slide-21
SLIDE 21

TEST DATA, Cree 1-XPG

 SinkPAD v/s Typical Aluminum back PCB thermal data

21

R5

slide-22
SLIDE 22

TEST DATA, Cree XP-G

 SinkPAD v/s Conventional MCPCB thermal data (IR Camera)

MCPCB SinkPAD PCB

  • Cree XPG 9 LEDs
  • Current: 1 Amp.
  • Power: 3W each
  • PCB ~ 1”x1”

To view & download this info To view & download this info “Register” below. I f you already have Registered before; click on “login” below

1410 C 1190 C

Or send an email request at eng@sinkpad.com

22

R3

SinkPADTM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPADTM pcb running ~220C cooler than on the conventional MCPCB

slide-23
SLIDE 23

TEST DATA, Luxeon Rebel at 700mA

 SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

  • Luxeon Rebel at 700mA

Luxeon Rebel at 700mA

MCPCB Type-1 MCPCB Type 1 MCPCB Type-24

MCPCB-1 MCPCB 1 MCPCB-2

Test was conducted by Quadica Developments Inc

23

R5

LED on a SinkPADTM PCB running ~290C cooler than on the MCPCB-1 and 100C cooler than the MCPCB-2

slide-24
SLIDE 24

TEST DATA, Luxeon Rebel at 1A

 SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

  • Luxeon Rebel at 1000mA

Luxeon Rebel at 1000mA

MCPCB Type-1 MCPCB Type-1 MCPCB Type-24

MCPCB-1 MCPCB-2

Test was conducted by Quadica Developments Inc

24

R5

LED on a SinkPADTM PCB running ~470C cooler than on the MCPCB-1 and 160C cooler than the MCPCB-2

slide-25
SLIDE 25

Other Available Test Data Nichia N219 Luxeon Rebel Luxeon Rebel Cree MTG Osram Oslon SSL Osram Oslon SSL Cree XML

Customize Your Test Customize Your Test

25

R5

slide-26
SLIDE 26

Highlights and Q&A

 Magnitude Higher Thermal Transfer Rate

  • Direct Thermal Path

Patent Pending

  • Direct Thermal Path
  • 135 to 385W/m.k vs. 1 to 4 W/m.k
  • LOWER JUNCTION TEMPERATURE

 High Tg (Up to 225oC)  Multilayer Possible Without Increase In Thermal Resistance  Weight Saving

  • Possibly thinner profile

 Di t R l t f MCPCB M t l B k PCB & Al i PCB  Direct Replacement for MCPCB, Metal Back PCB & Aluminum PCB  Most Economical Direct Thermal Path Solution  Any Questions….. Contact us y Q

26

R5

slide-27
SLIDE 27

THANK YOU THANK YOU

For more information contact eng@sinkpad.com Visit us at www.sinkpad.com 714-660-2944

27

R3

Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes no warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.