Readout Electronics Upgrades
- f the ATLAS Liquid Argon Calorimeter
Christopher Anelli
- n behalf of the ATLAS experiment
University of Victoria
Pisa Meeting on Advanced Detectors, June 2, 2018
Readout Electronics Upgrades of the ATLAS Liquid Argon Calorimeter - - PowerPoint PPT Presentation
Readout Electronics Upgrades of the ATLAS Liquid Argon Calorimeter Christopher Anelli on behalf of the ATLAS experiment Pisa Meeting on Advanced Detectors, June 2, 2018 University of Victoria High Luminosity LHC Phase-II Upgrade and HL-LHC:
Christopher Anelli
University of Victoria
Pisa Meeting on Advanced Detectors, June 2, 2018
Christopher Ryan Anelli Pisa Meeting 2018
2
Phase-II Upgrade and HL-LHC:
(over ~12 years)
per bunch crossing
Christopher Ryan Anelli Pisa Meeting 2018
different granularities.
middle layer. (EM Calo)
incident particle’s direction.
Sampling Calorimeters
3
Christopher Ryan Anelli Pisa Meeting 2018
4
readout electrode absorber lead glue kapton
inner copper layer stainless steel HV HV
liquid argon gap liquid argon gap (~2 mm)
calorimeter, ionizing the LAr.
between grounded absorbers.
electron drift time of 450 ns (for EM Calo)
proportional to deposited energy.
programmable shaping time. (baseline 13 ns)
For more details checkout the LAr Calorimeter Performance talk by Stefanie Morgenstern
Christopher Ryan Anelli Pisa Meeting 2018
5
Technical Motivations:
Preserving physics reach (ie Higgs) for higher data taking rates requires updated triggers:
triggers require higher trigger rate (1MHz), longer latency, and higher granularity calorimeter information.
end of the HL-LHC.
Performance Example:
Simulation shows upgraded ATLAS detector can maintain sensitivity to golden, H-> γγ channel. Optimistic scenario: increased statistics reduce global constant term to design value, 0.7%. Pessimistic scenario: term remains same as 2015, 1% barrel and 1.4% endcap .
σE E = a
√
E
⊕ b
E ⊕ c
Christopher Ryan Anelli Pisa Meeting 2018
6
LAr Calorimeter Cells
ADC x2 ADC x2 ADC x2 LAr Digital Processing System (LDPS) TTC Control LAr Signal Processor (LASP) L0/L1 Accept Logic Energy sums & Data reduction Clock & Control...
FEX MUX/Serializer OTx Array OTx Array OTx Array Clock & Control Calibration Board DAC FELIXExisting readout electronics will be completely replaced: Front-End
total noise.
cell is digitized and sent to the backend.
Off Detector
Processor (LASP) board to process digitized inputs and
timing information.
from the LASP to new, L0 Triggers.
Christopher Ryan Anelli Pisa Meeting 2018
7
The Front-end board has separate ASICs for the Preamp/Shaper, Digitization, Serialization, and Optical Transmission:
Christopher Ryan Anelli Pisa Meeting 2018
The Preamplifier and Shaping will be implemented on a single ASIC.
R vo
vi = -vo/N
C C·(N-1) ii
130 nm
up to 7 mA.
65 nm
up to 10 mA. Both designs will be merged into one 130nm chip.
8
Christopher Ryan Anelli Pisa Meeting 2018
9
The LAr cell’s electronic noise must be less than MIP signal. Requiring ADC’s least significant bit (LSB) value to be less than electronic noise leads to a dynamic range 16 bits wide.
electrons from Z→ee (used for energy scale calibration.)
Christopher Ryan Anelli Pisa Meeting 2018
Digitization handled by 40 MHz,14 bit, radiation hard, ADC. ASIC consists of:
MSPS.
pulses by the ADC.
may be available for purchase.
10
Christopher Ryan Anelli Pisa Meeting 2018
In the back-end, Phase-II Upgrade introduces new LAr Signal Processor (LASP) based on FPGA technology:
energy summing
L0A/ L1A
input stage configurable remapping pulse processing precision data buffer controller TTC GlobalEvent front-end FELIX / DAQ FEXes fragment builder raw data buffer
gain sel.
energy summing data reduction FEX data buffer L0 data buffer
11
Christopher Ryan Anelli Pisa Meeting 2018
Main FPGA DCDC Ethernet Switch
DDR3 Flash 48-link MPO Base Connector RTM Connector Base ConnectorIPMC
LASP Main Blade LASP RTM
QSFP
48-link MPO 48-link MPO 48-link MPOProcessing FPGA
DDR3 Clock Flash
DCDC
LASP Unit
12 Tx 11G 4 Tx 25G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Tx 11G 12 Tx 11G
48-link MPO 48-link MPO 48-link MPOProcessing FPGA
DDR3 Clock Flash
DCDC
LASP Unit
12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Tx 11G 12 Tx 11G 12 Rx 11G
MMC MMC12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Rx 11G 12 Tx 11G 4 Tx 25G
12-link MPOEach LASP module contains two LASP units each with it’s own processing FPGA:
(ACTA)
12
Desire reliability: so LASP processors will not need to be replaced over 10+ years
Stratix 10 Development Kit
Christopher Ryan Anelli Pisa Meeting 2018
= µ , O F C = 2 µ ,
20O F C = 8 µ ,
80O F C = 1 4 µ ,
140O F C = 2 µ ,
200O F C
500 1000 1500 2000 2500 Total Noise [MeV] ATLAS Simulation Internal
OF WFFC
filtering coefficients (OFC), to extract each cell’s energy and timing information.
Wiener Filter, may better suppress the pileup
OFC
13
*Only 4 samples used since Run-2
Christopher Ryan Anelli Pisa Meeting 2018
LAr Calorimeter interfaces with the L0 (L1) triggers:
the trigger.
cells are normally transmitted.
particles or noise bursts can cause individual FPGAs to transmit a significantly greater fraction of cells.
to transmit 30% of cells, ~153.
bits) reflecting which cells are above threshold.
14
Christopher Ryan Anelli Pisa Meeting 2018
15
The LAr Calorimeter will remain critical to ATLAS physics during the HL-LHC. In preparation for the full-replacement of the LAr Readout Electronics:
prepared.
performance.
Christopher Ryan Anelli Pisa Meeting 2018
| η | 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Total Noise [MeV] 10
2
10
3
10
4
10
FCal1 FCal2 FCal3 HEC1 HEC2 HEC3 HEC4
PS EM1 EM2 EM3 Tile1 Tile2 Tile3 Gap
ATLAS Internal Simulation 25 ns bunch spacing = 200 µ = 14 TeV, s
Total Noise in the LAr readout electronics combines electronic noise and as well pileup (in-time and
The noise varies by subdetector, |η|, and layer.
For the L0 global trigger, there is proposed energy threshold on the calorimeter cells, of twice the cell’s total noise, 2σ.
Christopher Ryan Anelli Pisa Meeting 2018
Assuming 25.78 Gbps links, mapping of front-end boards to the LASP:
448 and 512 calorimeter cells.
18
LASP ID
Links per LASP Cells LASPs Input Output Bidirectional per LASP FEB2 Global FEX FEB2 FELIX Event TTC DAQ/TTC EMB 1 448 64 80 4 8 2 EMB 2 504 64 88 4 8 2 EMB 3 512 64 88 4 8 2 EMB 4 496 32 88 4 8 2 EMEC 1,2 512 64 88 4 8 2 EMEC 3 480 32 84 4 10 2 EMEC spec 1 448 8 80 4 27 8 2 EMEC spec 2,4 512 12 88 4 8 2 EMEC spec 3 512 8 88 4 10 2 HEC 2 512 8 88 4 27 8 3 HEC-EMEC 1 480 8 80 4 27 8 3 FCal 1,2 504 4 88 4 23 8 3 FCal 3 500 2 88 4 23 8 3 FCal 4 256 2 48 2 12 4 2 Total 372 31 912 1 484 810 3 048 766
Christopher Ryan Anelli Pisa Meeting 2018
19
= 0 µ , OFC = 20 µ ,
20OFC = 80 µ ,
80OFC = 140 µ ,
140OFC = 200 µ ,
200OFC
Total Noise [MeV] 20 40 60 80 100 120
5 OFCs 40 MHz, 10 OFCs 80 MHz,
ATLAS Simulation Internal = 0.5 η EMB Middle Layer at
(a)
=0 µ , OFC =20 µ ,
20OFC =80 µ ,
80OFC =140 µ ,
140OFC =200 µ ,
200OFC
200 400 600 800 1000 Total Noise [MeV] ATLAS Simulation Internal
5 OFCs 40 MHz, 10 OFCs 80 MHz,
(b)
Increasing the sampling rate results in a 5-10% reduction in noise, but this was deemed insufficient to justify the additional costs. Comparison of total noise as a function of pileup for 40 vs 80 MHz sampling: EMB HEC
Christopher Ryan Anelli Pisa Meeting 2018
20
pulse shape scales with energy.
an optimal filtering coefficient, ai.
filter sets the coefficients to minimize the uncertainty on U, Var(U).
Becomes a minimization problem with 2 Lagrange multipliers.
U = X
i
aiSi
X
i
aigi = 1 X
i
aig0
i = 0
V ar[U] = X
ij
aiajRij
Rij
Total Autocorrelation Function (Combined electronic and pu)
Christopher Ryan Anelli Pisa Meeting 2018
21
autocorrelation function.
autocorrelation functions, that depends on the variance of the pileup energy distribution.
ai = R1~ g + R1~ g0
Q1 = ~ gT R−1~ g
Q2 = ~ g0T R1~ g0 Q3 = ~ g0T R1~ g
∆ = Q1Q2 − Q2
3
λ = Q2 ∆ κ = −Q3 ∆
Rij = Re
ij + µ (σMB)2+(µMB)2 f 2
sampl(σe)2
P
k gk−igk−j
1 + (σMB)2+(µMB)2
f 2
sampl(σe)2
P
k g2 k
Christopher Ryan Anelli Pisa Meeting 2018
22 22