R ESIDUAL STRESS MEASUREMENT BY FIB A controlled removal of a small - - PowerPoint PPT Presentation

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R ESIDUAL STRESS MEASUREMENT BY FIB A controlled removal of a small - - PowerPoint PPT Presentation

F OCUSED I ON B EAM TECHNIQUES FOR RESIDUAL STRESS ANALYSIS AT THE MICRON - SCALE Marco Sebastiani University of Rome Roma TRE Engi nee ri ng Department Materials Science and Technology Group 7th Annual FIB SEM Workshop Thursday, February 27th,


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SLIDE 1

FOCUSED ION BEAM TECHNIQUES FOR

RESIDUAL STRESS ANALYSIS AT THE MICRON-SCALE

Marco Sebastiani University of Rome «Roma TRE» Engineering Department Materials Science and Technology Group

7th Annual FIB SEM Workshop Thursday, February 27th, 2014 Kossiakoff Center Johns Hopkins Applied Physics Laboratory Laurel, MD

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SLIDE 2

Marco Sebastiani FIB user group 2014

RESIDUAL STRESS ANALYSIS ON A MICRON-SCALE

Intra-grain stress analysis in polycristalline alloys and TBCs Thin coatings and MEMS

2

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SLIDE 3

Marco Sebastiani FIB user group 2014

GAP OF KNOWLEDGE

 Research needs  Many advanced materials and devices require

stress measurement with sub-micrometer 3D spatial resolution

 Existing high resolution methods (i.e. using

synchrotron XRD, EBSD) are very expensive, time consuming and not suitable for amorphous materials

 Production needs  New developed procedures should also be

dow ngradable to in-line quality control processes, or at least cost-saving with respect to traditional high resolution characterisation techniques.

 Innovative HR resolution should be standardised.

3

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SLIDE 4

Marco Sebastiani FIB user group 2014

RESIDUAL STRESS MEASUREMENT BY FIB

 A controlled removal of a

small material volume is performed by FI B at low ion current (10-100 pA);

 The attendant relaxation

strain is then measured, step-by-step, by Digital I m age Correlation ( DI C) techniques;

 The residual stress (in –plane

distribution and depth profile) is then calculated from the measured strain by using either analytical or Finite Elem ent m odelling

4

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SLIDE 5

Marco Sebastiani FIB user group 2014

I MPLEMENTATI ON OF FI B- DI C PROCEDURES

Focused I on Beam controlled material removal, by the ring-core milling geometry

  • Geometries
  • Surface patterning
  • FIB milling parameters
  • SEM imaging parameters

Digital I m age Correlation for strain measurement

  • 2D strain mapping;
  • Control of SEM noise
  • Best patterning for DIC
  • GUI

Residual stress calculation

  • FEM of influence functions for

several geometries

  • Models to correct for Elastic

anisotropy

  • FEM for through-thickness

stress gradient analysis;

5 5

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SLIDE 6

Marco Sebastiani FIB user E gF ro Uu G p 2014 3

FIB MILLING GEOMETRIES

Ring-core method Materials Letters 63 (2009) 1961–1963 Slot-milling method Thin Solid Films 443 (1-2), pp. 71-77 Hole drilling method Nanotechnology 17, Number 20 , 2006 H-bar Micro-cantilever method

Acta Materialia 57 (6), 2010

Surface & Coatings Technology

6

215 (2013) 247–252

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SLIDE 7

Marco Sebastiani FIB user group 2014

KEY-WORD FOR INDUSTRY: AUTOMATION

 The whole test sequence is

completed in ½ hour and multiple test positions can be set for overnight testing;

 DIC is performed live during

test

 Only preliminary alignment

and focus is required to the

  • perator

 E-beam Pt deposition of

surface features

 Automated

patterning/imaging/milling

 0° and 52° imaging after

each milling step

 Automated Correction of

ion/electron drift during the test;

 All test are initially set

through a GUI

 Geometry  Size  SEM/FIB parameters 7

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SLIDE 8

Marco Sebastiani FIB user group 2014

8

NEW PATTERNING STRATEGIES FOR IMPROVED DIC

 Reduced influence of the

Pt-pad

 Full strain map over the

X-Y plan

 Best strain measurement

along the fast-scan direction

 More effective DIC

(resolution of 1/1000 pixel) Freeware DIC runnign

  • n Matlab (C. Eberl)
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SLIDE 9

Marco Sebastiani FIB user group 2014

RESIDUAL STRESS CALCULATION PROCEDURES

𝑪𝝉 = 𝜻 ⇒

  • 10
  • 20
  • 30
  • 11
  • 21
  • 31
  • 2

2

  • 3

2

  • 3

3

𝜏0 𝜏1 𝜏2 𝜏3

  • 1

=

  • 2
  • 3

=

  • r

= 𝜏

  • 1 ≤ ≤ ≤

3

=0

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SLIDE 10

 Regularisation algorithms for stress depth profile

calculation

9

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SLIDE 11

Marco Sebastiani FIB user group 2014

THE ISSUE OF DEPTH MEASUREMENT

 We need to develop accurate calibration

procedures for depth measurement.

 This is critical in view of an effective residual

stress depth profile.

10

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SLIDE 12

Marco Sebastiani FIB user group 2014

APPLICATION TO THIN FILMS FOR AVERAGE

STRESS AND STRESS GRADI ENT ANALYSIS IN THIN FILMS

  • M. Sebastiani, C. Eberl, E. Bemporad, G. M. Pharr

Materials Science and Engineering A, 2011

3 µm CAE-PVD CrN on steel AISI M2

11

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SLIDE 13

Marco Sebastiani FIB user group 2014

CRITICAL ISSUES FOR STRESS DEPTH PROFILING

 DIC is performed LIVE

during the test (e.g. during FIB milling after each SEM imaging step);

 Performing AT LEAST five

test in a reasonable amount of time (1/2 day)

 DEPTH MEASUREMENT is a

very critical issue in view of the full automation of the method!

12

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SLIDE 14

Marco Sebastiani FIB user group 2014

DEPTH PROFILING OF RESIDUAL STRESS: CrN

 Strategy for stress gradient calculation:  fitting with a polynomial expression of the strain data for h/d<0.3  Calculation of the residual stress DEPTH PROFILE by FEM analysis (Integral

Method)

 Significant gradient of

stress is observed from surface to interface on this CrN

13

coating

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SLIDE 15

Marco Sebastiani FIB user group 2014

LOCAL RESIDUAL STRESS FIELD IN THIN FILMS

The results consistently show a significant modification of the LOCAL residual stress field induced by the droplet

14

Surface and Coatings Technology, 2013

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SLIDE 16

Marco Sebastiani FIB user group 2014

LOCAL RESIDUAL STRESS FIELD IN THIN FILMS

How to explain the

  • bserved differences:

(i) an additional thermal stress factor given by the presence of a metallic droplet (ii) the induced coating re- nucleation process and modification of the growth mechanisms in correspondence of the defect

15

Surface and Coatings Technology, 2013

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SLIDE 17

Marco Sebastiani FIB user group 2014

APPLICATION ON SUSPENDED MICRO-BRIDGES (MEMS – RF SWITCHES)

Sebastiani, M., Bemporad, Korsunsky, A.M. (2010) AIP Conference Proceedings, 1300,

16

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SLIDE 18

APPLICATION ON SUSPENDED DOUBLE CLAMPED

MICRO-BRIDGES

del

  • 400 m-

ETD LIME Un1RomaTRE

Sebastiani, M., Bemporad, Korsunsky, A.M. (2010)

AlP Conference Proceedings, 1300,

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SLIDE 19

"0

100

T

!

'

  • '

APPLICATION ON SUSPENDED MICRO-BRIDGES

RF SWITCHES

500

......., 450

lU

Stress variation over the suspended membrane

Q.. 400

!.

350

(/) (/) (II

.t .....

300 1 250

(/)

jij 200

:J 150

"Cii

f

(II

et::

50

y ' ' ' ' ' '

100

200 300 400 : 500 600 700 800 Di s ' nce from one ' e of the ' e (urn)

ta

:sid

'

membran

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SLIDE 20

Marco Sebastiani FIB user group 2014

APPLICATION ON AMORPHOUS PLASMA SPRAYED

SINGLE-SPLATS (APPLICATION IN TBCS)

Sebastiani, M., Bolelli, G., Lusvarghi, L., Bandyopadhyay, P.P., Bemporad, E. Surface and Coatings Technology, 206 (23), pp. 4872- 4880

19

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SLIDE 21

Marco Sebastiani FIB user group 2014

APPLICATION TO AMORPHOUS MATERIALS

Al2O3

 Single splats

  • btained by

plasm a spraying

Surface and Coatings Technology, 206 (23), pp. 4872-4880

20

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SLIDE 22

·n;

..

2.SE-03

Al203 splats: Relaxation strain from ring-core incremental

milling

  • Test-1

·c

n : ;

....

Ul

c: ....

,

> <

q; 2.0E-03 l.SE-03

l.OE-03

  • _-

.{ .

..

  • - --
  • Test-2
  • Test-3

......

  • Test-4
  • Test-1on small splat

without cracking

  • Test-2
  • n small splat

without cracking

  • ---- Polynomial fitting

S.OE-04

  • ::::<:0
  • ---6

O.OE +OO :.::....._.u...

  • ---"'

200 400 600

Millin

g depth from surface ( nm )

  • Small splats (no cracks)
  • Interpolated strain at 400 nm: +0.38·1o-3 ± 0.20·1o-3
  • Average residual stress: -105.3 ± 55.4
  • Elastic modulus by nanoindentation
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SLIDE 23

Marco Sebastiani FIB user group 2014

CONCLUSIONS – FIB/DIC METHOD 1/2

 A TOOL for micron-scale 3D residual stress

analysis on a micron scale has developed and

  • ptimized.

 Good results  The adopted geometry gives high depth resolution

(≈ 1 00 nm ) and lateral spatial resolution (≈ 1 µm )

 The developed milling strategies have improved the

repeatability and robustness of DIC procedures

 LIVE strain depth profiling during FIBing and semi-

automated procedure

 Calculation of the through thickness stress profile;

22

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SLIDE 24

Marco Sebastiani FIB user group 2014

CONCLUSIONS – FIB/DIC METHOD 2/2

 Critical issues to be solved  Full automation of the procedure.  Does the FIB induces additional stresses??  Microstructure/anisotropy/plasticity effects??  Careful analysis of elastic properties for stress

calculation.

 Cross validation with other high-resolution methods

(synchrotron-XRD, EBSD, µ-Raman).

 Ongoing work: establishm ent of a

standardization activity through a European large project

23

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SLIDE 25

Marco Sebastiani FIB user group 2014

ISTRESS EUROPEAN PROJECT

 EU project “I STRESS” has started on Jan 1 st 2 0 1 4  Pre-standardization of incremental FIB micro-milling for intrinsic

stress evaluation at the sub-micron scale

 A new VAMAS TW A and project liaisons with CEN TCs are going to

be established

24

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SLIDE 26

Marco Sebastiani FIB user group 2014

ISTRESS PROJECT

 Som e info at this w ebpage:  http://www.stm.uniroma3.it/iSTRESS  MANY OPEN POSITIONS WITHIN THIS PROJECT: W E ARE LOOKI NG

FOR FI B EXPERTS TO W ORK I N THE CONSORTI UM!

 http://www.stm.uniroma3.it/iSTRESS/Pages/Careers.aspx  WE ARE LOOKING for associated partners to be involved in the

ROUND-ROBIN activities.

seba@stm.uniroma3.it

The STM group at Roma TRE:

  • prof. Edoardo Bemporad prof.

Fabio Carassiti Daniele De Felicis Marco Renzelli Federico Massimi Riccardo Moscatelli

25

Dragana Nikolic