PICS project Project at a Glance Future of integrated capacitors - - PowerPoint PPT Presentation
PICS project Project at a Glance Future of integrated capacitors New generation of high density 3D integrated capacitors Develop adequate industrial tools (batch ALD, etching) Funded by FP7-SME 2 years program 1M of EU
→ New generation of high density 3D integrated capacitors → Develop adequate industrial tools (batch ALD, etching)
→ 2 years program → 1M€ of EU contribution
→ 3 SMEs from France, Germany and Finland → 2 RTD from France and Germany
→ Target high-end markets like medical or aeronautics…
→ Higher density, higher voltage of use, long terms reliability
→ Develop the associated tools (batch, etching) to get an industrial solution
→ World record 500nF/mm² capacitors into silicon → High stability and reliability, low leakage → New dielectric deposited by ALD → ALD batch equipment to reduce cost-of-ownership → Leading edge technology for thick high-K materials
→ Develop adequate industrial tools (batch ALD, etching) → Reliability studies
Integration of the new dielectric into the IPDiA process with less changes as possible Deposition by ALD into 3D trench capacitors with the right thickness and composition Find suitable dielectric stacks to fulfill High Density and High Voltage requirements Start a qualification procedure to ensure long term reliability Cost effective batch ALD tool and high-k dielectric etching tool, compatible with 6’’ IPDiA process
→ Developments of suitable dielectric stacks and their integration into 3D trench capacitors → Miniaturization in medical domain : 500nF/mm² , Vbd > 12V → Miniaturization in harsh environment (industrial, automotive) : 150nF/mm² , Vbd > 25V
→ Better uniformity, step coverage, throughput, material properties ...
→ Nanopatterning, High-k-based Devices, Interconnects
Charlotte JENNEQUIN - IPDiA Phone: +33(0)2 31 535 400 2 rue de la girafe 1400 Caen France
The PICS project has received funding from the European Union's Seventh Framework Program managed by REA-Research Executive Agency http://ec.europa.eu/rea (FP7/2007- 2013) under grant agreement n° FP7-SME-2013-2-606149.