OP OPPOR ORTUNITIES FOR OR PICS ON ON IN INP OC OCT 29, 2019 - - PowerPoint PPT Presentation

OP OPPOR ORTUNITIES FOR OR PIC’S ON ON IN INP

OC OCT 29, 2019

AG AGENDA

§ What is Integrated Photonics? § Addressable markets § Introduction to SMART Photonics § Value chain and way of working § Some concrete applications § Conclusions

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CO CONVE VENTIONAL PHO HOTONICS CS

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Photonics Market size (2018): ± $ 650 Billion

BU BUILDI DING A CIRC RCUIT T WITH TH ONLY Y 3 BA BASIC ELEMENTS TS

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Photonic integration 3 basic elements

Waveguide Phase Amplitude

j A

SOA PHM PWD

Electronic integration 3 basic elements

Electronic chips InP Photonic Integrated Chips

PH PHOT OTON ONIC INTEGRATION ON RESEMBLE LES ELE LECTRON ONIC REVOLUT OLUTION ON

Ph Photonic integration will change the world d again!

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El Electronic integration ha has cha hanged the he world

IN INP IN INTEGRATIO ION P PLATFORM

§ Photonic integration needs active and passive components § Light sources and amplification can only be realized in Indium Phosphide (InP) § Monolithic integration of all functionalities! § Mature technology § Butt-joint integration: no compromise between active and passive components § Full on-wafer electrical testing § Enabler for low-cost integrated circuits!

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waveguides phase modulators gratings Amplifiers/ laser gain section

CO COMPARISON PHO HOTONIC C TECHN CHNOLOGIES

Integrated Photonics platform technologies Technique InP Si Photonics Hybrid Si. Schematic view Integrated full InP based chip Silicon based chip with connected InP laser Silicon based chip with InP based lasers bonded Maximum bandwidth1 > 1,000 Gb/s 100 Gb/s 400 Gb/s Integration level Full

• Limited

Passive components Active comp. Lasers Phase modulators Required production facilities InP Fab (eg eg SM SMART RT) InP Fab (eg eg SM SMART RT) Si Fab InP Fab (eg eg SM SMART RT) Si Fab InP/Si bonding Fab

Key: Poor performance High performance

Source:

1 At competitivesizeand cost

Silicon element InP element

IN INTEGRATED IN INP CH CHIPS MORE CO COST-EF EFFICIEN ENT THAN HYBRID SILICON

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A more efficient process flow and better scalability… Lower mask cost

Mask cost comparison (EUR’000) 1,500 InP ~EUR 20k Hybrid Silicon ~EUR 1,000k ~50x more

expensive

!

INDICATIVE

Process flow comparison

Si Waveguide litho and etch Epitaxial growth Epitaxial growth InP Waveguide litho and etch Assembly: die attach Back-end processing InP Waveguide litho and etch Back-end processing

Hybrid Silicon InP

Fully scalable wafer-scale process No continuous flow, individual dies per functional material: Limited scalability Not required Not required

IN INP P PLATFORM C CAPABIL ILIT ITIE IES

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KE KEY Y MARKE RKET T OPPORTU RTUNITI TIES IN COMMUNICATI TION AND D SENSING

10 Communication applications Sensing appications Aviation Big Data 5G Wireless Energy Healthcare Automotive High tech Packaging Chip Manufacturing design

§ Communication applications key trends: § Ongoing transition to higher network speed § Access networks are migrating from DSL towards Fiber (FttX ) § 5G § Ongoing rise in data traffic § Increasing cloud based storage capacity (datacenters) required § Transition towards advanced coherent optical to technology § PICs on InP create disruptive sensing solutions for many sectors: § Health & Medical § Automotive § Aerospace / Aviation § Machinery § Energy § Consumer Electronics

This leads to strongly improved and completely novel functionalities: § Smaller, faster, better performance and lower power § Photonic IC’s (PIC’s) can be used to address major problems in society

IN INTEGRATED PHOTONIC ICS WIL ILL HELP SOLVE MAJOR SOCIE IETAL IS ISSUES

Faster data rates and reduced power consumption Mobility: Autonomous driving Eye safe LIDAR systems IoT Medical diagnostics: portable and close to patient

With Integrated Photonics we use IC’s that operate on the basis of light instead

• f electronics.

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ST STRONG MARKET GROWTH, H, DRIVE VEN BY IN INP IN INTEGRATED PHOTONIC ICS

• 0.5

1.0 1.5 2.0 2.5 3.0 3.5 4.0 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

PIC market estimates 2024 (USD B)

Roland Berger Markets&Markets Stratistics MRC Knowledge Sourcing Intelligence LLP BCC Research $0 $2,000 $4,000 $6,000 $8,000 $10,000 $12,000 2017 2018 2019 2020 2021 2022 2023 2024

InP Photonics development 2017-2024 (USD M)

Telecom Datacom Sensing

Application value, driven by PIC PIC value itself

TH THE WORL RLD D IS PAYI YING ATTE TTENTI TION!

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Source Photonics opens new InP laser fab

26 Feb 2019 - Facility in China will double production capacity of lasers and other photonic components

Source: Optics.org

Synopsys and SMART Photonics Expand InP-Based PIC Design Automation

Development of SMART Photonics PDK for Synopsys’ PIC Design Suite Enables a Complete and Seamless InP-Based Design Flow Source: Million Insights

“Silicon Photonics Market to Exhibit Huge Growth Based on Rising Usage of Photonic Technology and Increasing Demand for Optical Multiplexers Till 2025”

S

• u

r c e : B l

• m

b e r g

Cisco to acquire silicon photonics chip maker Luxtera for $660 million

Source: TechCrunch

SM SMART IS IS B BUIL ILDIN ING O ON > >30 Y YEARS T TECHNOLOGY H HERIT ITAGE

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2012 2013 >2022 Early 1980’s 1994

First Multi Project Wafer produced

2017

Achieve full control Scale up to serve global customers as state of the art photonics foundry

Origin Spin-off SMART Photonics Round New fab Onboarding TU/e First production NanoLab established

Established first shared facility for integrated Photonics prototyping

2002

Total investment in fundamental InP and Photonics research estimated at €300M

1991 Acquisition First commercialization components

POEC acquired by Uniphase for €1.2B

1998

Move to HTC and installation of tool set in HTC facility (50% of process)

First step in control 2020

OU OUR FACILI LITIES

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• SMART Photonics @High Tech Campus

– > 900m2 Production facility

• 570m2 3” Production cleanroom (Class 1000)

– Processing and epitaxy

• SMART Photonics @NanoLab cleanroom

Eindhoven – 850m2 Fully equipped R&D facility

SM SMART PH PHOT OTON ONICS BUS USINESS MOD ODEL

§ We are the first player offering production of In InP integrated photonic chips as a foundry § The foundry model is well established in the Semiconductor industry and currently accounts for mo more than 40% of the market § Our customers are predominantly OEMs and system companies § We use a generic process to support customers in a very broad set of application areas § We sell our IC’s to large global companies as well as rapidly growing start-ups § Market demand is presently exceeding our current capacity and is growing

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DESIGN PICs PACKAGING MODULE SYSTEM

DESIGN HOUSES OEMs SYSTEM COMPANIES (E.G. CISCO)

END USERS

GOOGLE, FACEBOOK, AIRBUS, PHILIPS HEALTHCARE

§ We are the first player offering production of In InP integrated photonic chips as a foundry § The foundry model is well established in the Semiconductor industry and currently accounts for mo more than 40% of the market § Our customers are predominantly OEMs and system companies § We use a generic process to support customers in a very broad set of application areas § We sell our IC’s to large global companies as well as rapidly growing start-ups § Market demand is presently exceeding our current capacity and is growing

VA VALUE CHA CHAIN FULLY EMBEDDED IN THE HE NETHE HERLANDS

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DESIGN PICs PACKAGING MODULE SYSTEM END USERS

DE DESIGN TO TOOLS

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Mask Generator Designer Design Kit Foundry Circuit Simulator Physical Simulations

LA LAYOU OUT-AW AWAR ARE SCHEMAT ATIC DESIGN FLOW

§ Functional design using parameterized building blocks § Fast and accurate modeling of large-scale PIC designs § Automatically sweep and optimize parameters § Orientations and connections are kept and passed to the mask generation software

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GE GENERIC PROC OCESS DEPLOY LOYED THROU OUGH GH DESIGN GN KIT (P (PDK)

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• Key Intellectual Property of the company

resides in the broadest set of building blocks for Integrated Photonics

• Releasing building blocks take extensive
• effort. PDK thus represents a strong unfair

competitive advantage for the long term

• Process Design Kits are available:

– Access via state of the art software tools – Design manual and Functional building block description – Full layout-aware design flow – Circuit simulation and Mask design Process Design Kit with our Building blocks is key IP ...and is offered via the design software of:

EX EXAMPLE: E: 2.5 GHZ MODE E LOCKED ED LASER SER

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• S. Tahvili and S. Latkowski, COBRA

1550.75 1551.00 1551.25 1551.50 1551.75

• 70
• 65
• 60
• 55
• 50
• 45
• 40
• 35
• 30

Power density (dBm/res) Wavelength (nm)

2 4 6 8 10 12 14

• 80
• 70
• 60
• 50
• 40
• 30
• 20

• 80
• 75
• 70
• 65
• 60
• 55
• 50
• 45

Spectral power (dBm/Hz) Frequency (GHz) ISOA=115mA, USA=-2.7V

• Frequency comb laser for gas sensing
• 30 mm cavity
• < 4mm2

EX EXAMPLE: E: COMB LASER SER FOR GAS S SEN SENSI SING

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OU OUTLOOK LOOK: : LI LIDAR THE EYES OF OF THE FUTURE

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Source: website Luminar

Advantages InP PIC technology

• Eye-safe wavelengths
• Robust and small
• Non-mechanical
• High sensitivity

4 4 PRODUCT CT CA CATEGORIES THA HAT FULFILL ALL CU CUSTOMER NEEDS

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Discrete components Discrete + components PICs MPW § Standardized industrial integration process § Design using generic building blocks to create integrated chips § PDK streamlines design process for generic PICs process § Combines several discrete components onto one chip, e.g: § Laser + Modulator § Laser Arrays § Laser + Spot Size Converter § Facilitates Si Photonics integration § Low threshold access to new technology § Combines multiple projects on single wafer § Generic building block approach § Single high-end components § Connected to passive photonic chips

SM SMART POSI SITIONED ED TO ACCEL ELER ERATE E INP PHOTONICS S INDUST STRY

Photonic Integrated Chips (PIC’s) based on Indium Phosphide (InP) will play a key role in the lives of many people as they enable new and improved functionalities, ultimately making our world better, greener and safer

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Extending technology leadership Foundry will continue to fuel innovation Accelerating scale-up process Developing full photonics ecosystem

Continuous reinforcement cycle

CO CONCL CLUSIONS

§ Integrated photonics has huge potential to have a very broad application range and to have strong societal impact § Dutch Integrated Photonics ecosystem built on years of investment in R&D, provides great

• pportunity for future economic strength in the Netherlands

§ SMART Photonics is playing a key role in the ecosystem, by supplying high performance InP integrated circuits through a foundry model § InP combines active and passive components in the best way

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