NDIP Conference j o J , 17.Jul.2008 / See, - PowerPoint PPT Presentation

NDIP Conference ✆ � j o ✄ ☎ J ✝ ✞ , 17.Jul.2008 ✠ / See, http://ndip.in2p3.fr/ for slides

NDIP Conference ❏ Beaune XX • • 96 3 • ❏ Aix-Les-Bains • 1998 FIFA World Cup • ❏ 200 • • 58 Talks, 80 Posters • CCD, SiPM, X-ray, Astro, APD.... • 1 / 3 SiPM Talk ❏ SiPM

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SiPM Talk

SiPM Talk ❏ • Optical Crosstalk (3 Talks) • Radiation Damage (2 Talks) • ADC (1 Talks) ❏ • SiMPL (SOI@MPI) • CPTA / Photonique • SiPM Array ❏ Position Sensitive • SPAD (Singel Photon Avalanche Diode, 3 Talks) • Avalanche CCD ❏ Application • PET ( timing resolution , 4 Talks) T2K / Calice (3 Talks) • • ASIC (1 Talk)

Radiation Damage Noise Rate 10 8 Noise Rate (Hz) ❏ 2 Talks 100 µ m ( ∆ V=0.9V) 50 µ m ( ∆ V=1.4V) 10 7 • 82 MeV Proton (Y. Musienko) • Neutron ( ) 10 6 ❏ 10 5 • Noise, current 9 10 • log 10 (neutron) PDE Y.Musienko’s Summary N/N ref 1.5 1 0.5 0.75 1 1.25 1.5 1.75 ∆ V (V)

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TOF (Timing Resolution) by R. Vinke ❏ TOF PET • ∆ x = 0 . 5 c ∆ t contrast • • LYSO or LaBr3 + SiPM ⋄ 3 × 3 × 10 mm 2 × 16 ❏ Timing Resolution Measurement MPPC • by C.L. Kim photon / 511 keV • • Best Result 250 ps FWHM • 1p.e. σ = 100ps (LASER) Setup

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ADC (F. Reti` ere) Afterpulse ❏ MPPC ADC ❏ • Afterpulse Rate ( ) • Crosstalk Rate

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Optical Corsstalk ❏ GAPD spectrum spectrum A.Ingargiola R. Mirzoyan several × 10 − 5 photon / e ❏

Optical Corsstalk 1 / R 2 ❏ Crosstalk Rate • Simulation Study (A. Nepomuk Otte) 10–20% ( dominant ) • ( ) • • di ff usion ❏ Tranch A. Ingargiola

Optical Corsstalk (R. Mirzoyan) ❏ Optical Crosstalk OC SiPM ( MEPhi) • Optical Seperator (Trench) • 2nd pn junction ❏ Afterpulse • Recovery ( ∼ 1 µ sec) 100 ns • τ AP 100 p.e. 101 p.e.

SPAD (S. Tudisco, F. Guerrieri, A. Ingargiola) ❏ Single Photon Avalanche Diode 10 × 10 SPAD Array • INFN / ST-Microelectronics • Politecnico di Milano ❏ Active Quenching ❏ pixel ❏ Row(Anode) × Column(Cathod)

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SiMPl (J. Ninkovic) SiMPI ? ❏ Polysilicon • • Polysilicon ❏ thinning ( ∼ 70 µ m)

SiMPl (J. Ninkovic) ❏ ( ) • FF • • Hopefully Radhard ? ❏ • • Handle Wafer Bonding ❏ MPI • 30 × 30 or 10 × 10 array

Avalanche CCD (G. Lutz) ❏ pnCCD avalanche • Jet Chamber? Analogy ❏ • 51 × 51 µ m unit pixel • 264 × (256 + 256) pixels 18 × 30 mm 2 • 132 × (60 + 60) pixels 9 × 9 mm 2

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SiPM Array ❏ PET ❏ 3 × 3mm 2 – 4 × 4mm 2 Rad. Monitering Devices FBK-irst 1.5mm × 1.5mm × 4 Photonique 1mm × 1mm × 16 2.1mm × 2.1mm × 4 (D. McNally) CPTA • (C.J. Staples) • Trench ( ) (N. Dinu) • Back-thinned CMOS • p + p n • Italy • back illu.

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SiPM ASIC (C. de La Taille / Orsay) ❏ Silicon Pm Integrated ReadOut Chip • Developped for ILC Calorimeter • 36ch input • Energy Measurement ⋄ 2 gain × 12 bit Wilkinson ADC ⋄ Variable Shaping 50ns–100ns ⋄ 10 bit gain adjustable preamps • Timing Measurement ⋄ 12 bit TDC 50 ns ⋄ 4bit threshold adjustment • 16 deep analog memory • pulsed power mode ❏ MAROC / HARDROC ❏ available ❏ http://omega.in2p3.fr/

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Axial PET (E. Bolle) ❏ PET detector Geometry Crystal ( φ ) • Z • φ WLS ( Z ) • r ( ) segment ❏ Advantage error • channel • Geometry

Axial PET (E. Bolle) Demonstrator ❏ Demo • LYSO ⋄ Saint-Gobain PreLude 420 ⋄ 3 × 3 × 100 mm 3 • WLS ⋄ Eljin Technology ⋄ 0 . 9 × 3 × 40 mm 3 • Photodetector ⋄ HPK MPPC Test ⋄ 3 × 3 mm 2 for LYSO ⋄ 1 . 19 × 3 . 22 mm 2 for WLS ❏ Test • LYSO 12%(FWHM) Resolution • WLS 73 p.e. ❏ Demo 2

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Color Sensitive CMOS Detector (G. Langfelder) ❏ ❏ TFD (Transverse Field Detector) ❏ Foveon ❏ 3 or 4 ❏ 5–6 µ m Pixel size ❏ V 0 , V 1 , V 2 = 1.0, 2.1, 2.3 V ❏ upto 60% fill factor in future

Color Sensitive CMOS Detector (G. Langfelder)