Low Temperature Electronics for Space and Terrestrial Applications - - PowerPoint PPT Presentation

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Low Temperature Electronics for Space and Terrestrial Applications - - PowerPoint PPT Presentation

Low Temperature Electronics for Space and Terrestrial Applications Richard L. Patterson Ahmad Hammoud NASA Glenn Research Center QSS Group MS 309-2 NASA Glenn Research Center Cleveland, OH 44135 Cleveland, OH 44135


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SLIDE 1

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Low Temperature Electronics for Space and Terrestrial Applications

Richard L. Patterson Ahmad Hammoud

NASA Glenn Research Center QSS Group MS 309-2 NASA Glenn Research Center Cleveland, OH 44135 Cleveland, OH 44135 Richard.L.Patterson@grc.nasa.gov Ahmad.Hammoud@grc.nasa.gov

Scott S. Gerber Malik Elbuluk

ZIN Engineering University of Akron NASA Glenn Research Center Electrical & Computer Engineering Dept. Cleveland, OH 44135 Akron, OH 44325 Scott.S.Gerber@grc.nasa.gov melbuluk@uakron.edu

Eric Overton John Dickman

NASA Glenn Research Center NASA Glenn Research Center MS- 301-5 MS 302-2 Cleveland, OH 44135 Cleveland, OH 44135 Eric.Overton1@grc.nasa.gov John.Dickman@grc.nasa.gov

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SLIDE 2

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

OUTLINE

  • 1. Deep Space Temperature Requirements

And Applications

  • 2. Terrestrial Applications
  • 2. Low Temperature Electronics at NASA GRC
  • 3. Power Electronic Components, Circuits and Systems
  • 4. Selected Results
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SLIDE 3

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

44 K -229 °C Pluto 51 K -222 °C Neptune 64 K -209 °C Uranus 90 K -183 °C Saturn 122 K -151 °C Jupiter 226 K -47 °C Mars 279 K 6 °C Earth 328 K 55 °C Venus 448 K 175 °C Mercury

Spacecraft Temperature

(Sphere, Abs. = 1, Emiss. = 1 Internal Power = 0)

Distance from Sun

Temperature Data for Planetary Missions

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SLIDE 4

Glenn Research Center

_____________________________________________________________________________

Power and On-Board Propulsion Tech. Div. at Lewis Field

Deep Space Electronics Temperature Requirements

Requirements

  • Electronics Capable of Low Temperature Operation
  • High Reliability and Long Life Time
  • Improved Energy Density and System Efficiency

Benefits of Low Temperature Electronics

  • Survive Deep Space Hostile Cold Environments
  • Eliminate Radioisotope and Conventional Heating Units
  • Improve System Reliability by Simplified Thermal Management
  • Reduce Overall Spacecraft Mass Resulting in Lower Launch Costs
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SLIDE 5

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Low Temperature Electronics Program

Goals

  • Provide a technology base for the development of lightweight electronic

components and systems capable of low temperature operation with long lifetimes

  • Develop and characterize state-of-the-art components which operate at low

temperatures

  • Integrate advanced components into mission-specific low temperature circuits

and systems

  • Establish low temperature electronic database and transfer technology to mission

groups

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SLIDE 6

Glenn Research Center

_____________________________________________________________________________

Power and On-Board Propulsion Tech. Div. at Lewis Field

Space Applications of Low Temperature Electronics

  • Mars 2003 Lander/Rover
  • Mars Flyer
  • JWST (NGST)
  • Pluto Flyby
  • Jupiter Probe
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SLIDE 7

JAMES WEBB SPACE TELESCOPE (formerly NGST)

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 8

L2 Point – Location of JWST

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 9

Terrestrial Applications of Low Temperature Electronics

  • SMES
  • ICARUS
  • AMANDA / ICE BURG
  • Magnetic Levitation

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 10

SMES Superconducting Magnetic Energy Storage

  • An energy storage system, used by electric utilities,

to stabilize voltages on power grids

  • The energy storage device is about the size of

a small number of 55 gallon drums

  • Typical energy storage is about 1 MegaJoule
  • System is mobile and about the size of a truck trailer
  • Used by the Tennessee Valley Authority, PacifiCorp,

Wisconsin Public Service, Scotland’s Orkney Islands, and an aluminum foundry in Austria

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 11

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

ICARUS Imaging Cosmic and Rare Underground Signals

  • A neutrino detector (no charge and very little mass)
  • A large tank of liquid argon (-180 °C)
  • Needs some electronic components to operate at (-180 °C)
  • Located inside a mountain in northern Italy
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SLIDE 12

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

ICARUS

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SLIDE 13

Amanda and Ice Cube Neutrino Detection System

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 14

ICE CUBE NEUTRINO SENSOR SYSTEM Ice Cube Sensor Configuration

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 15

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 16

AMANDA / ICE CUBE PHOTOMULTIPLIER SENSOR

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 17

AMANDA NEUTRINO DETECTION SYSTEM Inserting One Sensor into the Melted Hole

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 18

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field Low Temperature Electronics Program Facilities

  • Three environmental chambers
  • Programmable rate for thermal cycling and long term soaking
  • Simultaneous and automated operation
  • Temp range from –193 °C to +250C
  • Ultra-low temperature environmental chamber for electronic testing to 20K
  • Instrumentation to evaluate digital and analog circuits
  • Computer controlled CV/IV semiconductor device characterization
  • Inframetrix infrared camera system
  • Multiple high voltage, HIGH current source measure units
  • Two programmable precision RLC instruments
  • Surface and volume resistivity chamber, film dielectric and capacitance test fixture,

breakdown voltage test cell

  • Passive components high-power test circuitry
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SLIDE 19

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Facilities

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SLIDE 20

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Analog Input (V) Digital Output (V) @ 25 °C Digital Output (V) @ -100 °C Digital Output (V) @ -190 °C 0.007 0.010 0.010 0.5 0.505 0.498 0.508 1 1.004 1.006 1.004 2 2.000 2.002 1.993 5 4.994 4.994 5.001 7.25 7.241 7.228 7.226 10 9.983 9.963 9.963 10.1 10.000 10.000 10.000

Digital Outputs at Three Temperatures for Various Analog Inputs

Commercial Off-the-Shelf 12-Bit Serial CMOS Analog-to-Digital Converter (Rated for Operation Between –40 °C and +85 °C)

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SLIDE 21

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

FACILITIES Digital to Analog Test Setup

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SLIDE 22

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Low Temperature Electronics Program Products

  • Components

Magnetic Devices: Inductors & Transformers Capacitors Semiconductor Switches Batteries Transducers

  • Circuits

DC/DC Converters A/D Converters Oscillators PWM Control Circuits Other ICs

  • Systems

Energy Storage Power Conditioning Communication & Control

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SLIDE 23

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

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SLIDE 24

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

  • 200-180-160-140-120-100 -80 -60 -40 -20

20 40

Temperature ( C)

1 2 3 4 5 6 7 8 9 10

Output Voltage (V)

72Vin/0.5Aout 36Vin/0.5Aout 72Vin/4.0Aout 36Vin/4.0Aout

Output Voltage of a DC/DC Converter at Various Temperatures

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SLIDE 25

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

  • 200-180-160-140-120-100 -80 -60 -40 -20

20 40

Temperature ( C)

1 2 3 4

Output Voltage (V) 36Vin/0.5Aout 18Vin/0.5Aout 36Vin/2.5Aout 18Vin/2.5Aout

Output Voltage of Another DC/DC Converter At Various Low Temperatures

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SLIDE 26

Glenn Research Center

_____________________________________________________________________________

Power and On-Board Propulsion Tech. Div. at Lewis Field

EXPERIMENTAL SETUP & RESULTS

COMMERCIAL DC-DC CONVERTER MODULES

  • SPECIFICATIONS

Module Input Voltage (V) Output Voltage (V) Power (W) Operating Temp (°C) 1 9 –36 3.3 10

  • 40 to 60

2 36-72 3.3 10

  • 40 to 85

3 18-36 3.3 10

  • 40 to 70

4 18-36 3.3 13

  • 40 to 85

5 9-36 3.3 10

  • 40 to 85
  • TEST TEMPERATURE RANGE:

20°C to -190°C

  • TEST PARAMETERS:
  • INPUT VOLTAGE:

9-72V

  • LOAD CURRENT:

0 – 3.0 A

  • MEASURED PARAMETERS:
  • EFFICIENCY
  • OUTPUT VOLTAGE REGULATION
  • CURRENT RIPPLE CHARACTERISTICS
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SLIDE 27

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

EVALUATION SUMMARY OF SOME DC/DC CONVERTERS

Converter Specifications GRC Evaluations Mod # Input Voltage (V) Output Voltage (V) Power (W) Operating Temp. (°C) Observations & Comments Ceased Operation at (°C) 1 9 –36 3.3 10

  • 40 to 60

Vo dropped to 2.4 V at –140 °C; chip functioned down to –160 °C.

  • 160

2 36-72 3.3 10

  • 40 to 85

Vo lost regulation at –100 °C; converter still functioned to –196 °C.

  • 196

3 18-36 3.3 10

  • 40 to 70

Chip worked very well down to -120 °C. Input current oscillations occurred at all temperatures under heavy loading.

  • 120

4 18-36 3.3 13

  • 40 to 85

Oscillations in input current started at –80 °C.

  • 120

5 9-36 3.3 10

  • 40 to 85

Oscillations in input current observed at – 140 °C under heavy loading.

  • 180
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SLIDE 28

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Time (10 us/div) (a) Temperature = 25°C Time (10 us/div) (b) Temperature = -190°C

(1 V/div) Reference Voltage (1 V/div) Reference Voltage (1 V/div) CT Ramp Signal (5 V/div) Output Voltage (1 V/div) CT Ramp Voltage (5 V/div) Output Voltage

Output Waveforms of a Pulse Width Modulation Controller At Room Temperature and –190 °C

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SLIDE 29

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

CAPACITORS

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SLIDE 30

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

CAPACITORS (Continued)

LEAKAGE CURRENT (nA) Type Unaged (RT) Aged (RT) In LN2 Polypropylene 1 1.80 1.20 0.02 Polypropylene 2 8.30 2.45 1.20 Polypropylene 3 9.50 5.00 0.06 Polycarbonate 3.20 2.64 0.14 Mica 7.10 10.80 0.10 Solid Tantalum 27.50 22.60 0.08

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SLIDE 31

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

NASA Langley Laminated Flexible Printed Circuit Board

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SLIDE 32

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Control Computer

M M M M M M M

Temperature = 40 K Room Temperature Sun Shield

1 4

Motor Phase Drive Motor Select Motor Select Commands Parallel To Serial Serial To Parallel Power Supply

JAMES WEBB SPACE TELESCOPE MOTOR CONTROLLER

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SLIDE 33

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

  • 300
  • 200
  • 100
  • 250
  • 150
  • 50

50

Temperature (C)

0.1 0.2 0.3

Motor Power Supply Current (A)

Lin Engineering Stepper Motor Model 213-10-12 (Rated 0.3 Amps / phase) High Side Motor Selection Transistor Base Currents Approx 7 mA SGA9289 SiGe HBT, Vm=2.2V SGA9289 SiGE HBT, Vm=2.2V 2N1302 Ge npn bipolar, Vm=2.5V

STEPPER MOTOR CONTROLLER / SELECTOR SEMICONDUCTORS FOR USE AT ULTRALOW TEMPERATURES

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SLIDE 34

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

Switching Characteristics of a MOSFET Device At Various Temperatures Before Cycling

VGS = 4.0V VGS = 5.0V VGS = 7.0V VGS = 8.0V VGS = 12.0V VGS = 6.0V

0.0 0.5 1.0 1.5 2.0

VDS, Drain-to-source Voltage (V) (25 °C)

4 8 12 16 20

ID , Drain Current (A)

VGS = 5.0V VGS = 7.0V VGS = 8.0V VGS = 12.0V VGS = 6.0V

0.0 0.5 1.0 1.5 2.0

VDS, Drain-to-source Voltage (V) (-185 °C)

4 8 12 16 20

ID , Drain Current (A)

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SLIDE 35

Glenn Research Center

_____________________________________________________________________________

Power and On-Board Propulsion Tech. Div. at Lewis Field

Switching Characteristics of a MOSFET Device At Various Temperatures After Cycling

VGS = 4.0V VGS = 5.0V VGS = 7.0V VGS = 8.0V VGS = 12.0V VGS = 6.0V

0.0 0.5 1.0 1.5 2.0

VDS, Drain-to-source Voltage (V) (25 °C)

4 8 12 16 20

ID , Drain Current (A)

VGS = 5.0V VGS = 7.0V VGS = 8.0V VGS = 12.0V VGS = 6.0V

0.0 0.5 1.0 1.5 2.0

VDS, Drain-to-source Voltage (V) (-125 °C)

4 8 12 16 20

ID , Drain Current (A)

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SLIDE 36

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

CONCLUSIONS

  • LOW TEMPERATURE ELECTRONICS APPLICATIONS

DEEP SPACE MISSIONS SATELLITES CRYOGENIC INSTRUMENTATION

  • CAN COMPONENTS SURVIVE?

EXTREME TEMPERATURES HARSH ENVIRONMENTS

  • NEED TO SATISFY :

COMPACTNESS REDUCED WEIGHT RELIABILITY INCREASED EFFICIENCY

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SLIDE 37

Glenn Research Center

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Power and On-Board Propulsion Tech. Div. at Lewis Field

CONCLUSIONS (Continued)

  • COTS COMPONENTS, DEVICES, CIRCUITS AND SYSTEMS HAVE BEEN

CHARACTERIZED AT LOW TEMPERATURES NEED-BASED TECHNOLOGY-BASED TEMPERATURE RANGE BEYOND SPECIFICATIONS (-40OC OR -55 OC)

  • ADVANCED COMPONENTS ARE INTEGRATED INTO MISSION-SPECIFIC LOW

TEMPERATURE CIRCUITS AND SYSTEMS

  • MODIFY EXISTING
  • DEVELOP NEW TECHNOLOGIES