- Prof. Jörg Henkel, Low Power Design, SS2014 ces.itec.kit.edu
Low Power Design
- Prof. Dr. J. Henkel
CES - Chair for Embedded Systems KIT, Germany
- I. Introduction and Energy/Power Sources
Low Power Design Prof. Dr. J. Henkel CES - Chair for Embedded - - PowerPoint PPT Presentation
Low Power Design Prof. Dr. J. Henkel CES - Chair for Embedded Systems KIT, Germany I. Introduction and Energy/Power Sources Prof. Jrg Henkel, Low Power Design, SS2014 ces.itec.kit.edu 2 Overview Reason
CES - Chair for Embedded Systems KIT, Germany
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Reason for Low Power Design: motivation Specific need for low power in embedded systems: examples Battery issues (re-chargeable batteries) Power/energy sources
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Why design for low power/energy?
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Portable Systems
ä
Notebooks, smartphones, tablets, cameras, etc.
l32% of PC market, and growing ä
Battery-driven - long battery life crucial
ä
System cost, weight limited by batteries
l40W, 10 hrs @ 20-35 W- hr/pound = 7-20 pounds
lSlow growth in battery technology n
Must reduce energy drain from batteries
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Thermal Considerations
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10 oC increase in operating temperature => component failure rate doubles
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Packaging: ceramic vs. plastic
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Cooling requirements
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Increasing levels of integration / clock frequencies make the problem worse
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10cm2, 500 MHz => 315Watts
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Reliability Issues
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Electro-migration
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IR drops on supply lines
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Inductive effects
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Tied to peak/average power consumption
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Environmental Concerns
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EPA estimate: 80% of office equipment electricity is used in computers
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“Energy Star” program to recognize power efficient PCs
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Power management standard for desktops and laptops
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Drive towards “Green PC”
LOW POWER (Src: A. Raghunathan, NEC)
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(Src: F. Pollack, Intel
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Pentium Crusoe
Pentium 4 Crusoe Processor
(source: www.transmeta.com)
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Temp max: 125.0°C Temp min: 81.5 °C Thermal variation: 43.5 Spatial thermal gradient: ~1.81 °C/mm
resources LUTs 2000 FFs 2000 DSPs 12 BRAMs DCM 1 Frequency 550 MHz Area 13% of chip Properties of the tested region
Src: Henkel, Amrouch, Ebi
Xilinx Virtex-5 FX100t, package ff1136, speed -3 (65nm)
Folgerung?
“Circuit heat generation is the main limiting factor for scaling of device speed and switch circuit density”
By Jeff Welser, Director SRC Nanoelectronics Research Initiative, IBM, Opening Keynote Address ICCAD 2007
Classical scaling
Device count S2 Device frequency S Device power (cap) 1/S Device power (Vdd) 1/S2 Utilization 1
Leakage limited scaling
Device count S2 Device frequency S Device power (cap) 1/S Device power (Vdd) ~1 Utilization 1/S2
(Src: “Dennard Scaling”)
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65nm 45nm 32nm 22nm 2 Cores @ < 2GHz
4 Core @ >= 2GHz 8 Core @ > 2GHz 16 Core @ >= 2GHz 8 Dark Cores 22nm 16 Core @ >= 4GHz 12 Dark Cores
Assumption: Scaling Factor S=2 Tradeoff between #Cores and Frequency
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Silicon and the End of Multicore Scaling”, in International Symposium on Computer Architecture (ISCA), 2011
utilization wall as a result of
a power greater than their power budgets given as TDP (thermal design power)
density are the ultimate limiting factors, thus determining the amount of Dark Silicon
power limited
Methodological Perspective on Energy Efficient Systems”, in ISLPED, 2012
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Scaling Limits when Dark Silicon Dominates
Even if there is unlimited Parallelism, The Speedup is limited by the Power Constraint
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Power and Heat in FPGAs
45 48 51 54 57 60 63 1 67 133 199 265 331 397 463 529 595 661 727 793 859 925 991 1057 1123 1189 1255 1321 1387 1453 1519 1585 1651 1717 1783 1849
Temperature [°C]
Time [sec] Core1 Core2
Thermal Camera Virtex-5 FPGA without packaging
Activity migration between two cores at the interval of 154 MCycle
Scr: Amrouch, Ebi, Henkel
Problem: vertical heat flow
Only one layer directly interfaces with the heat sink Heat needs to dissipate through multiple layers The heat sink is located on top of the chip Hot cores distant to the heat sink dissipate their heat through other layers Silicon has a low thermal conductivity! 150 W/(m*K) (Silicon) 401 W/(m*K) (Copper)
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Large (100X – 1000X) gap in energy efficiency between fully programmable and fully custom implementations
Ample scope for tradeoffs
Source: Rabaey et. al., IEEE Computer, July 2000
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Technology Operations/Watt [MOPS/mW] 1 0.1 0.01 0.13µ Ambient Intelligence 0.07µ DSP-ASIPs µPs 10 0.25µ 0.5µ 1.0µ poor design generation techniques
(Src:[Marw03])
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t P E
Energy: 1 Ws = 1 VAs = 1 Joule = 1 Nm
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Minimizing the power consumption is important for
the design of the power supply the design of voltage regulators the dimensioning of interconnect short term cooling
Minimizing the energy consumption:
Limited availability of energy (mobile systems, try to maximize the amount of computation that can be accomplished with a given amount of energy) through:
limited battery capacities (only slowly improving) very high costs of energy (solar panels, in space)
cooling
high costs limited space
dependability
long lifetimes, low temperatures
(Src:[Marw03])
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HW Power Consumption
Behavior level Register-transfer level Logic level Transistor level Power analysis iteration times seconds - minutes minutes - hours hours - days Decreasing design iteration times
High-level synthesis, RTL optimizations Architecture-level power analysis Logic synthesis Logic-level power analysis Transistor-level/ Layout synthesis Transistor-level power analysis Power models for macroblocks, control logic Power models for gates, cells, nets
1 Power Cap Switching _Power Leakage/Static Power + … = ( . _ +
L dd
2 C V A f . . .
2
)
(src: A. Raghunathan, NEC)
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Source: [Marc03]
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(source: Jan Madsen DTU)
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Manufacturing plants & Power distribution
Health care
rooms
cardiac attacks Energy-efficient buildings
US
Disaster Prevention & Emergency Response
Traffic control
by 15 min => $15B/year in California alone “Smart” environments
(source: A. Raghunathan, NEC)
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Banking & Money transfer smart cards, … Consumer cell phone, MP3 player, PDA, … Clothing electronic textiles Environment sensor networks Healthcare hearings aids, pace maker, … Telecom Systems satellite, …
…
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1 10 100 1000 10000 100000 1000000 10000000
Algorithmic Complexity (Shannon’s Law) Processor Performance (Moore’s Law) Battery Capacity 1G 2G 3G
(src: A. Cuomo, ST Micro, Stockholm, Sept.8, 2004)
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Primary batteries
+ availability + no re-charging required + often higher density compared to secondary batteries (later)
Secondary batteries
Ni-Cd (nickel-cadmium), NiMH (nickel-metal-hydride, Lithium-Ion, Lithium-polymer + can be re-charged
increasing but “plateauing” i.e. cannot be significantly improved any more. Lithium-Ion: has increased around 8-10% in the last 10 years (every year)
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1994 200 wh/kg 1996 1998 2000 2002 2004 2006 150 100 50 Sanyo Toshiba 1994 500 wh/l 1996 1998 2000 2002 2004 2006 300 100 200 400 Sanyo Toshiba
shown Lithium-Ion technology
Gravimetric: Wh/kg -> Watt * hours / kg Volumetric: Wh/l -> Watt * hours / liter
(src: [Blo04])
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Average cost of Lithium-Ion technology (currently 2005) is ~0.5 USD/Wh Will decrease further but curve is predicted to flatten in the near future
0,5 1 1,5 $0,55 $0,55 $0,45 $1,27 $ per Wh NiCd average price NiMH average price Li-ion cyl. average price Li-ion prism. average price
1 2 3 4 5 6 7 8 9 10 US $/cell 1999 2000 2002 2001 2003 2004 2005 2006 Li-ion (average) Li-ion Cylindrical Li-ion Prismatic Li-ion Polym r e
(src: [Blo04])
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Improving the gravimetric and/or volumetric by embedding part of the battery into the final device and obtain the
does not have to be carried by the user Example: metal-air system. Basic idea: positive electrode is the ambient air. Metal-air system: Reaction: Negative electrode:
Zn + 4 OH- -> Zn(OH-)4
2- + 2 e- E0 = -1.266V
Positive electrode:
½ O2 + H2O +2 e- -> 2 OH- E0 = 0.401V
Allover reaction:
Zn + H2O + ½ O2 -> ZnO E0 = 1.667V
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Oxidation reaction of zinc with oxygen produces very high energy density: 1370 Wh/kg (theoretical) Reaction begins by presence of air and continues until zinc has been used up
- For continuous use only - No re-charging (then energy density would drop) + low cost + simple to use + environmentally OK (no heavy or noble metals nor hazardous compounds involved)
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Technologies: Solid oxide fuel cells (SOFC):
Needs 800-850 degrees centigrade
Polymer exchange membrane (PEM)
Reaction positive electrode:
½ O2 + 2 H3O+ + 2e- -> 3 H2O
Reaction negative electrode:
H2 + 2 H2O -> 2H3O+ + 2 e-
Overall reaction:
H2 + ½ O2 -> H2O E0 = 1.229V
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Functionality:
separated by an ion-conducting polymeric membrane (electrolyte)
catalytic sites at the negative electrode and form protons (H+) which cross the membrane and electrons on the other hand which produce a current outside the cell
electrons recombine at the positive electrode with protons (H+) coming from the negative electrode and
electricity, water heat
next page
H*
EME
Heat O (air)
2
H O + O
2 2
Cathode Solid Polymer Elektrolyte Anode H
2
H O + H
2 2
Current collector Bipolar plate
Proton exchange membrane fuel cell principle (PEM)
(src: [Blo04])
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Whole system contains besides the core (stack): a) electrical, b) thermal, c) and fluidic management systems
Methanol Methanol Reformer Humidi- fication water PEMFC Stack H Loop
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Water pump Heat exchanger Water condenser exhaust Cooling Loop
DC DC
Air + H O
2
Regulation Compressor Air H
2
Buffer battery
DC DC
Electric device
(src: [Blo04])
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Estimated to be more energy efficient in converting chemical energy to work (via electrical and afterwards mechanical energy conversion) Environmentally clean (byproduct is water) Efficiency of 50% (globally) is claimed to be achievable (incl. peripherals like water/heat/fuel management and fuel storage)
Ex: H2 heating value: 33.3 Wh/g , 600g H2
600g * 33.3 Wh/g * 50% = 10,000 Wh (e.g. 10kW for 1 hour)
However: large-power fuel cells are not likely to be mass- produced before probably 2020 But: miniature fuel cells are on their way …
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Application domain: portable electronic devices (PDA, cell ph, cameras, etc.) Two approaches:
A) “bipolar” technology
Built with bipolar plates forming the fuel cell stack Typically 20-500W Smaller stacks seem not to be competitive with Lithium-Ion batteries www.smartfuelcell.de and many others
B) Various approaches with new concepts e.g. micro fabrication techniques
Typically 0.1-25W substrate (thin-film)-based
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Current Collector Positive electrode Elektrolyte Diffusion layer Catalyst layer Hydrogen or methanol Air H O
2
e- e- H+
O 2 H 2
Silicon wafer; grown and treated with lithographic techniques Often less than a centimeter wide By various companies/institutions like: Neah Power; Integrated Fuel Cell Technologies, French Atomic Energy Commission, Case Western University
(src: [Blo04])
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Source: [StaPa04]
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Increases in a computing system by component
Improvement multiple since 1990
1990 1992 1994 1996 1998 2000 2002 1 10 100 1000 Year Disk capacity CPU speed Available RAM Wireless transfer speed Battery erargy density
(Note: different physical units for different components are given) Battery capacity only grew by 3x since 1990 On contrary: storage size, as an example, grew by 4000x during same time frame Problem: how can these largely increased system components appropriately fed with electrical energy?
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Sleeping Lying quietly Sitting Standing at case Conversation Eating a meal Strolling Driving a car Playing the violin or piano Housekeeping Carpentry Hiking, 4 mph Swimming Mountain climbing Long-distance run Sprinting 70 80 100 110 110 110 140 140 140 150 230 350 500 600 900 1400 81 93 116 128 128 128 163 163 163 175 268 407 582 698 1048 1630 Activity Kilocal/hr Watts Human Energy Expenditures for Selected Activities
Source: Derived from D. Morton. Human Locomotion and Body Form. Williams & Wilkens, Baltimore, MD.1952
A span of ~20x !
not be easily harvested
the power/energy stored, converted (DC/DC, impedance, etc)
harvesting needs to be completely non-obtrusive
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Body Heat 2.4 - 4.8 W (Carnot efficiency) Blood pressure 0.37W (0.93 W) Arm motion 0.33 W (60 W) Footfalls 5.0 - 8.3 W (67 W) Exhalation 0.40 W (1.0 W) Breathing band 0.42 W (0.83 W) Finger motion 0.76 - 2.1 mW (6.9 - 19 mW)
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Body heat:
(T_body-T_ambient)/T_body = 310K-293K)/310K = 5.5%
From breath
Principle: uses diff. in from breath pressure and atmospheric pressure -> only 2%
From blood pressure Capturing energy from vibrations, motion etc.
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Power from typing
Ex: 50g key pressure, depress by 0.5cm (0.05kg/key-stroke) / (9.8m/s2) * 0.005m * (7.5 key-strokes / sec) = = 19 mW -> too less to power a whole portable system; plus, user is not continuously typing Idea: keyboard can at least announce its character to the rest of the system through own energy
Inertial micro systems
Used for hundred of years in watches
Electrical version (next slide)
Functionality:
the mass winds a spring when enough mech. (spring) energy is accumulated, a micro generator is driven at 15,000 rpm (rotations per minute) yields 6mA and 16V for 50ms
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Walking (68kg human, 3.5mph) costs ~324Watt of power
Most of this power is used to move legs
Power through the fall of the heel:
68kg * (9.8m/sec2) * 0.05m * (2 steps/sec) = 67W This power cannot simply converted in electrical power w/o significant intrusion Converting to electrical power: e.g. via piezoelectric device (e.g. Quartz)
Mechanically stressed axis during fabrication Piezoelectric Material
Electrostatic Poling Direction (across electrodes)
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Energy Source Power/Energy Density Batteries (Zinc-Air, primary) 1050-1560 mWh/cm3 Batteries (Li, rechargeable) 300 mWh/cm3 Solar (outdoors) 15 mW/cm2 (direct sun) 1 mW/cm2 (24 hour avg) Solar (indoors) 0.006 mW/cm2 (office desk) 0.57mW/cm2 (<60W desk lamp) Vibrations 0.01-0.1 mW/cm3 Acoustic (noise) 3 e-6 mW/cm2 @ 75dB 9.6 e-4 mW/cm2 @ 100dB Miniature Fuel cells 0.1-500W Nuclear Reaction 80 mW/cm3, 1 e+6 mWh/cm3
(Src.(modified): A. Raghunathan, NEC)
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[Src: Hande, Dallas]
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[Piguet04] Ch. Piguet (Ed.), “Low Power Electronics Design”, CRC Press, ISBN 0-8493-1941-2, 2004. {Marc03], Marculescu, D.; Marculescu, R.; Park, S.; Jayaraman, S.; “Ready to ware”, Spectrum, IEEE ,Volume: 40 , Issue: 10 , Oct. 2003, Pages:28 – 32. [StaPa04] Th. Starner, J. Paradiso, “Human-generated power for mobile electronics”, appeared in “Low Power Electronics Design”, CRC Press, 2004. [Blo04] D. Bloch, “Miniature fuel cells for portable applications”, appeared in “Low Power Electronics Design”, CRC Press, 2004. [Marw03] P. Marwedel, “Embedded System Design”, Kluwer, 2003. [Raghunathan] A. Raghunathan, Tutorial on low power design, held at various CAD conferences