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I NTEGRAL Holding www.integral.by Through the element base and display systems to finished microelectronic products Advantages : 50 years of experience in design and production of microelectronic components Complete cycle of


  1. “I NTEGRAL” Holding www.integral.by

  2. Through the element base and display systems to finished microelectronic products Advantages : ● 50 years of experience in design and production of microelectronic components ● Complete cycle of design/development and manufacture of integrated circuits and semiconductor devices: from silicon ingots to finished products ● Vertically-integrated production structure - from integrated circuits to electronic devices ● Manufacture of ICs with minimal design rules 0.35 µm on Ø200 mm wafers ● Design/development and manufacture of microelectronic components are certified for compliance with the National and International standards ISO 9000 ● Highly skilled and experienced personnel www.integral.by

  3. Structure of “INTEGRAL” Holding JSC “INTEGRAL” - “INTEGRAL” Holding Managing Company Branch “Semiconductor Device Factory Branch “Belmicrosystems” R&D Center ICs, discrete semiconductor devices, LCD indicators, foundry services, photomasks Vitebsk Molodechno Branch “Transistor” Minsk Discrete semiconductor devices, Mogilev Grodno ICs Branch “ELECTRONICA FACTORY” Brest Gomel Electronics Pinsk JSC “TSVETOTRON” Diodes, electronics, PCBs Branch “KAMERTON” Silicon wafers, electronics JSC “Electromodule” Power semiconductor diodes & rectifier modules www.integral.by

  4. Milestones 1961 Starting construction of the main administrative 1978 Manufacture of first microprocessor. building 1978 “Electronica Factory” launched (Minsk) 1963 Launching Semiconductor Device Factory 1979 “Kamerton Factory” launched (Pinsk) named after Dzerzhinsky F.E. (Minsk) 1981 The Order of Lenin is awarded for design and 1963 Starting construction of “Transistor” factory manufacture of electronic units for reusable space (Minsk) system ground complex 1963 First diodes manufactured 1982 Manufacture of ALS Logic ICs 1965 First transistors manufactured 1983 “Tzvetotron Factory” launched (Brest) 1968 “Transistor” factory was put into operation 1986 “Zapad Design Center” launched (Brest) and first transistors were manufactured (Minsk) 1988 Manufacture of first lap-tops 1969 Mass production of ICs started 1990 Telephone ICs 1971 RPC “Integral” amalgamated 1991 “Nemiga Design Center” launched (Minsk) 1972 Special Design Center of RPC “Integral” launched 1992 Bank and trade electronic devices 1973 First electronic wrist watch “Secunda-2” 1992 First telephone set made manufactured 1993 Calculator ICs 1974 Order of October Revolution is awarded for design and manufacture of instruments for space exploration. 1977 Manufacture of first memory ICs www.integral.by

  5. Milestones 2011 Shipped USD 4.5KK products manufactured at the new 1994 Logic ICs of HC/HCT, AC/ACT, 4000B series, submicron production facility EEPROM ICs 2012 In frames of “BKA” program, manufactured 1995 ICs for one-PCB TV-sets of the 6 generation microassemblies and IC assemblies of photosensitive CCD 1995 Telephone plastic cards devices for remote sensing satellites 1999 Quality Assurance System is certified for 2013 On June 14, 2013, the Ministry of Economy entered conformance to the requirements of National “INTEGRAL” Holding into the Public Register of holdings Standards and International ISO 9001 Standards #62 2000 Sophisticated VLSI for domestic electronic 2013 Completion of the design of nonvolatile 1M (128Kx8) FRAM applications memory 2001 Development of fast and ultra-fast diodes (FRD and 2014 There has been developed and launched into mass UFRD) production a 16 Mbit CMOS RAM multi-chip module. A set 2001 Mastering of special ICs for automotive electronics of the 5584-series ICs, 23 types, for space applications has 2002 Development of ICs for ILA8842 TV processor been developed and put into series production. A mobile 2003 Establishment of Integral’s Representative Offices in artificial lung ventilation apparatus has been developed. China and India 2015 K1643RA014 SRAM IC with the capacity of 1 Mb (128Kx8) 2005 MOSFET type power field-effect transistors mass manufactured under "silicon on insulator" technology. Software production start up and hardware for identification of reinforced concrete structures. 2005 VLSI development for “BelKa” satellite LED lighting system for poultry farms with "sunrise-day-sunset" 2006 0.8 µm ICs mass production start up function. 2007 Starting production of sophisticated products for medical equipment 2008 Starting production of special purpose 256 К memories 2009 0.35 µm IL1307/1356 LSI development 2010 Starting production of special purpose 1 Mbit memories 2010 IC mass production start-up on 200mm wafers 2010 Joint Stock Company “INTEGRAL” established 2011 Start commercial production of 5 products in 0.35 μ m process node: IN1307, IN1356 – real-time clock ICs, IZ1325 – high-precision RTC IC with thermocompensation, IZ8563 – CMOS timer LSI with 12C-bus RAM, IZ2009 – IC for authentication systems with 1-Wire interface with EEPROM www.integral.by

  6. Integral product structure Die in Wafer Silicon substate IC in Package Electronic Products www.integral.by

  7. Company profiles INTEGRATED SEMICONDUCTOR CIRCUITS DEVICES DESIGN/ SPECIAL ELECTRONIC DEVELOPMENT/ PROCESS PRODUCTS MANUFACTURE EQUIPMENT and CONCUMER AND TOOLING/ GOODS ACCESSORIES FABLESS FOUNDRY BUSINESS BUSINESS www.integral.by

  8. Integrated Circuits www.integral.by

  9. Semiconductor devices Low Diodes Arrays power transistors Pulse High frequency complementary Pulse diodes Pulse complementary Zener Varicaps Power diodes Rectifier, medium frequency Unijunction Low-voltage, Varicaps high-frequency, low-noise Medium-power transistors Schottky, power Power transistors High-frequency complementary Rectifier-limiter (Zener) Pulse complementary Field, N-channel, high voltage Noise generators Bipolar, complementary, SHF generator Noise diodes generators high-voltage Complementary, Darlington MOS switches Field, high-current, N and P-channel Thyristors and triacs www.integral.by

  10. ≤ ≤ ≤ ≤ Foundry business Production Capacities used Foundry business for Foundry Business: Semiconductor ICs and Discrete Devices- Production line for 8'' wafers with Manufacturing on the base of Customer's Design (0.5-0.35) µm Design Rule (delivery on the base of on-chip testing) Production line for 6'' wafers with (0.8-1.2) µm Design Rule Semiconductor and Discrete Devices - Production line for 4'' wafers with Manufacturing on the base of Customer's Design (1.2-3.0) µm Design Rule (delivery on the base of wafer PCM testing) Wafer Fab Service – execution of separate Process Flow Steps or bloks Basic Process Flows available: (Metal sputtering, film deposition, EPI-growing, back grinding, wafers testing and so on) Discrete devices: D-MOS ( 1000V) Raw Si substrate manufacturing by IGBT-bipolar transistor with Customer's Specs isolated gate ( 1500V) Process Flows available: Multi-Epi ( 700V) Integrated Circuits: Bipolar n-MOS High-frequency devices ( 300V) CMOS BiCMOS MOSFET CDMOS Fabless-business starting from 0.18 µm design rules («Belmicrosystems» Research BiCDMOS, DMOS and Design Center Branch) Bipolar (TTL, TTL/ALS) www.integral.by

  11. Technological Capabilities 0.35µm CMOS technology, 2 poly, 3 Ме 0.8µm BiCMOS technology, 3 poly, 2 Ме High-voltage 0.8µm CMOS technology, 2 poly, 1 Ме Bipolar technologies, 1.5…5 μ m, 1-2 Ме 0,8…2 μ m BCD, DMOS technologies, 1 Ме Microwave bipolar transistor technology Schottky technology Planar thyristor technology with separation by interdiffuision Epitaxial planar and diffusion planar technologies for manufacturing silicon semiconductor devices , including high-voltage transistors www.integral.by

  12. Technological Capabilities IC packaging: SO, DIP, P-SOT223-4-1, P-SOT223-4-2, P-TO-5-11, P-TO-5-12, TO-220AB/5, TO-220AB/7, P-TO-220-7-180, P-TO-220-7-230, SIL-3P, SIL-9P, SIL-9MPF, DBS-9P, DBS-9MPF, SOT523-1, SIL-13P, SIL-15P, QFP-80, QFP-100 Semiconductor device assembly: - plastic packages: TO-92, TO-126, TO-218, TO-220, DPACK, D2PACK, IPACK, SOT-23 , - metal-glass packages: TO-3, TO-18, TO-72, Case 22A-01. www.integral.by

  13. Hardware components application Industrial Electronics Household appliances: Networking & Telecommunications Automation, instrument engineering, LCD TV, monitors, microwave ovens, Telephones, modems, fax machines, energy flow meters, electric drives, fridges, washing machines. electronic dial exchange. electronic start-control devices. Access Control & Identification RFID-tags, smart key, Space Electronics contactless cards. Satellite-borne electronic equipment, optoelectronic systems, satellite launch control. Payment Systems Agriculture Automotive Electronics Plastic bank cards, payment cards, Automated control systems and devices for Fuel injection and ignition systems, phone cards, agriculture and agricultural machinery. turn-indicator systems, wiper systems, prepaid cards for public transport. lighting equipment. www.integral.by

  14. “INTEGRAL” Holding www.integral.by

  15. “INTEGRAL” Holding www.integral.by

  16. International background The products are exported to 34 countries of the world www.integral.by

  17. www.integral.by

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