HIGH VACUUM ENVIRONMENT Sheila Hamilton Teknek Limited Issue - - PowerPoint PPT Presentation

▶

Dec 20, 2022 214 likes •417 views

SUBSTRATE CLEANING IN A HIGH VACUUM ENVIRONMENT Sheila Hamilton Teknek Limited Issue Particles of contamination on substrates cause defects in coating, printing, lamination and vacuum deposition processes used in Flat Panel display

SLIDE 1

SUBSTRATE CLEANING IN A HIGH VACUUM ENVIRONMENT

Sheila Hamilton Teknek Limited

SLIDE 2

Issue

Particles of contamination on substrates

cause defects in coating, printing, lamination and vacuum deposition processes used in Flat Panel display manufacturing

Defects cause significant yield loss
Removal of particles is essential for high

functionality and reliability

IMID 2013 2

SLIDE 3

Technology Drivers

IMID 2013 3

Films are getting thinner - more difficult to

process

Coatings are getting thinner – even

nanoscale particles can

penetrate the entire thickness of the coating

causing pinholes

No air or wet systems can be used in vacuum

environments

Smaller particles can now cause defects
Barrier properties are more demanding

SLIDE 4

Challenges

IMID 2013 4

Need a cleaning system which can
perate under vacuum
Needs to be able to remove very small

particles

Cannot use air or liquid for cleaning
Must not alter the surface energy
Must not outgas

SLIDE 5

Contact Cleaning Technology

The Teknek Cleaning Core

PPT 7 / 21

IMID 2013 5

SLIDE 6

Cleaning Technologies

IMID 2013 6

SLIDE 7

Defect reduction in optical coating

IMID 2013 7

SLIDE 8

IMID 2013 8

SLIDE 9

Pinhole reduction in metallised film

10 20 30 40 50 60 70 No cleaning CRC Vacuum Plasma

Cleaning Operation Pinhole Density (>5µ) / cm² (x100) Average Pinhole Density of commercially available metallised polyester film

IMID 2013 9

SLIDE 10

Outgassing Test

Scud Vacuum System 032
2 small rollers
2 sheets adhesive
Pumped down to 1E-7 mbar
Time in vacuum 66 hours
Each sample weighed before and after.

IMID 2013 10

SLIDE 11

Ultracleen RGA

IMID 2013 11

SLIDE 12

Ultracleen Outgassing

IMID 2013 12

SLIDE 13

Nanocleen RGA

IMID 2013 13

SLIDE 14

Adhesive Roll RGA

IMID 2013 14

SLIDE 15

Cleaning Efficiency Test

roller roller vacuum condition adhesive sheet condition weight before weight after Differen ce [g] nanocleen ambient ambient 4.31 4.57 0.26 1 weekend in vac (0.1 mbar) 4.31 4.54 0.25 18 hours in high vac (1e-6 mbar) 4.3 4.55 0.25 1 weekend in vac (0.1 mbar) ambient 4.31 4.57 0.26 1 weekend in vac (1e-6 mbar) ambient 4.3 4.55 0.25 nanocleen ambient ambient 4.31 4.6 0.26 ambient ambient 4.3 4.55 0.25

IMID 2013 15

SLIDE 16

IMID 2013 16

AREAS OF APPLICATION

After stripping of protective film to remove

possibility of static induced recontamination

Immediately prior to sputtering to remove any

particles deposited from the walls of the chamber

Before rewind to stop particles imprinting on the

layer below or fracturing the film

Cleaning the protective film at rewind prior to

application to stop damage to the coating

SLIDE 17

IMID 2013 17

SLIDE 18

Benefits

Teknek technology can now

– Remove particles down to 100 nm – From all types of substrates – As thin as 15 microns – In both sheet and roll format – At speeds from 1m/min to 300m/min – In a high vacuum environment – Without silicone – Gives significant yield improvements

IMID 2013 18

SLIDE 19

Acknowledgements

European Funding Programme FP7

Clean4Yield project

The Holst Institute, Eindhoven
The Technical University of Dresden

IMID 2013 19