Q I CH E N P A N ZH A N G S U P E R V I S O R : P R O F . S O U R A J E E T R O Y
High-Speed VLSI Simulator Q I CH E N P A N ZH A N G S U P E R V - - PowerPoint PPT Presentation
High-Speed VLSI Simulator Q I CH E N P A N ZH A N G S U P E R V - - PowerPoint PPT Presentation
High-Speed VLSI Simulator Q I CH E N P A N ZH A N G S U P E R V I S O R : P R O F . S O U R A J E E T R O Y Background Interconnects transmission lines, copper wires, and Carbon nano-tubes Board to board, chip to chip, PCB, on
Background
Interconnects
transmission lines, copper wires, and Carbon nano-tubes Board to board, chip to chip, PCB, on chip level
High-speed
High frequency clock rates Short signal rise-time
Current Challenges
Interconnect can be responsible for logic glitches, and signal delay which
can render the circuit inoperable
Distributed element, tradeoffs between CPU cost and accuracy
Objective
Fall Semester
Design and develop a general purpose circuit simulator
capable of CAD of high-speed interconnect
Frequency domain and time domain Single conductor and multi conductor
Spring Semester
Reduce computation time and cost by investigating Model
Order Reduction(MOR) method
Parallel simulation, wave form relaxation Reduces the number of unknowns to significantly decrease
computation time
Engineering Methods
Tools
Programs written in C++ and operates on CSU’s CRAY
supercomputer
Usage of an industry standard, HSPICE, as a result reference
Mathematical Models
Modified Nodal Analysis Partial, ODE circuit representation and solution Lumped model representation Matrix operations
Technical Performance Measurements
Accuracy, CPU time, and stability of the simulation results
Current Work
Budget
$0, purely software design
Responsibilities
Joint From layout to mathematical representation (MNA) Qi Implement the code to simulate circuit in the time domain Pan Implement code to simulate circuit in the frequency domain
Interconnect Model
Telegrapher’s partial differential equation Lumped Model
Interconnect Model
Single conductor Lumped Model Multi- conductor Lumped Model
Frequency Domain Analysis
Mathematical representation
Layout to “Stamp”(MNA/ ODE model) Laplace domain LU decomposition & complexity
Frequency Domain Analysis
Simulation
single line interconnect, comparison to HSPICE
Frequency Domain Analysis
First Trial
CPU time: 92 s
Second Trial
CPU time: 61 s
Frequency Domain Analysis
First Trial
CPU time: 92 s
Second Trial
CPU time: 61 s
Time Domain Analysis
Mathematical representation
Using existing models from frequency domain analysis Using implicit numerical integration methods to approximate
time domain solution
Backwards Euler method Trapezoidal method
Coupled HSI
x n 1 x 1 x n n
x C b x G C
x x x x
t t t t − + = + −
+ + + + 1 1
x n n x 1 x 1 x n n
x G C b b x G C − − + + = + −
+ + + +
2 2 2
1 1 x x x x
t t t t
Time Domain Analysis
V1 for d=0.5cm V2 for d=0.5cm Time vs Length
Conclusion
Expected delivery but need improvement Good feedback for future optimization Next step
CPU time complexity extraction Complete accuracy evaluation by L2 error norm MOR Parallel simulation
Special Thanks
Professor Sourajeet Roy Vibhanshu Katiyar
Sources
[1] E. Lelarasmee, A. E. Ruehli, and A. L. Sangiovanni-Vincentelli, “The waveform relaxation method for time-domain analysis of large-scale integrated circuits,” IEEE Trans. CAD Integr. Circuits Syst., vol. 1, no. 3,pp. 131–145, Jul. 1982.
[2] J. White and A. L. Sangiovanni-Vincentelli, Relaxation Techniques for the Simulation of VLSI Circuits. Norwell, MA: Kluwer, 1987.
[3] Roy, Sourajeet. “Chapter 1: Formulation of Network Equations.” 2014
[4] Roy, Sourajeet. “Chapter 3: Numerical Integration Techniques of Differential Equations.” 2014
[5] Roy, Sourajeet. “Chapter 5 High Speed Interconnects.” 2014