High-Speed VLSI Simulator Q I CH E N P A N ZH A N G S U P E R V - - PowerPoint PPT Presentation

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High-Speed VLSI Simulator Q I CH E N P A N ZH A N G S U P E R V - - PowerPoint PPT Presentation

High-Speed VLSI Simulator Q I CH E N P A N ZH A N G S U P E R V I S O R : P R O F . S O U R A J E E T R O Y Background Interconnects transmission lines, copper wires, and Carbon nano-tubes Board to board, chip to chip, PCB, on


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Q I CH E N P A N ZH A N G S U P E R V I S O R : P R O F . S O U R A J E E T R O Y

High-Speed VLSI Simulator

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Background

 Interconnects

 transmission lines, copper wires, and Carbon nano-tubes  Board to board, chip to chip, PCB, on chip level

 High-speed

 High frequency clock rates  Short signal rise-time

 Current Challenges

 Interconnect can be responsible for logic glitches, and signal delay which

can render the circuit inoperable

 Distributed element, tradeoffs between CPU cost and accuracy

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Objective

 Fall Semester

 Design and develop a general purpose circuit simulator

capable of CAD of high-speed interconnect

 Frequency domain and time domain  Single conductor and multi conductor

 Spring Semester

 Reduce computation time and cost by investigating Model

Order Reduction(MOR) method

 Parallel simulation, wave form relaxation  Reduces the number of unknowns to significantly decrease

computation time

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Engineering Methods

 Tools

 Programs written in C++ and operates on CSU’s CRAY

supercomputer

 Usage of an industry standard, HSPICE, as a result reference

 Mathematical Models

 Modified Nodal Analysis  Partial, ODE circuit representation and solution  Lumped model representation  Matrix operations

 Technical Performance Measurements

 Accuracy, CPU time, and stability of the simulation results

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Current Work

 Budget

 $0, purely software design

 Responsibilities

 Joint  From layout to mathematical representation (MNA)  Qi  Implement the code to simulate circuit in the time domain  Pan  Implement code to simulate circuit in the frequency domain

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Interconnect Model

 Telegrapher’s partial differential equation  Lumped Model

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Interconnect Model

Single conductor Lumped Model Multi- conductor Lumped Model

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Frequency Domain Analysis

 Mathematical representation

 Layout to “Stamp”(MNA/ ODE model)  Laplace domain  LU decomposition & complexity

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Frequency Domain Analysis

 Simulation

 single line interconnect, comparison to HSPICE

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Frequency Domain Analysis

First Trial

CPU time: 92 s

Second Trial

CPU time: 61 s

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SLIDE 11

Frequency Domain Analysis

First Trial

CPU time: 92 s

Second Trial

CPU time: 61 s

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SLIDE 12

Time Domain Analysis

 Mathematical representation

 Using existing models from frequency domain analysis  Using implicit numerical integration methods to approximate

time domain solution

 Backwards Euler method  Trapezoidal method

 Coupled HSI

x n 1 x 1 x n n

x C b x G C

x x x x

t t t t − + =         + −

+ + + + 1 1

x n n x 1 x 1 x n n

x G C b b x G C         − − + + =         + −

+ + + +

2 2 2

1 1 x x x x

t t t t

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Time Domain Analysis

V1 for d=0.5cm V2 for d=0.5cm Time vs Length

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Conclusion

 Expected delivery but need improvement  Good feedback for future optimization  Next step

 CPU time complexity extraction  Complete accuracy evaluation by L2 error norm  MOR  Parallel simulation

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Special Thanks

 Professor Sourajeet Roy  Vibhanshu Katiyar

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Sources

[1] E. Lelarasmee, A. E. Ruehli, and A. L. Sangiovanni-Vincentelli, “The waveform relaxation method for time-domain analysis of large-scale integrated circuits,” IEEE Trans. CAD Integr. Circuits Syst., vol. 1, no. 3,pp. 131–145, Jul. 1982.

[2] J. White and A. L. Sangiovanni-Vincentelli, Relaxation Techniques for the Simulation of VLSI Circuits. Norwell, MA: Kluwer, 1987.

[3] Roy, Sourajeet. “Chapter 1: Formulation of Network Equations.” 2014

[4] Roy, Sourajeet. “Chapter 3: Numerical Integration Techniques of Differential Equations.” 2014

[5] Roy, Sourajeet. “Chapter 5 High Speed Interconnects.” 2014