High Speed and Low-Power SerDes Architectures using Chord Signaling - - PowerPoint PPT Presentation

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High Speed and Low-Power SerDes Architectures using Chord Signaling - - PowerPoint PPT Presentation

High Speed and Low-Power SerDes Architectures using Chord Signaling Part 1: THEORY Amin Shokrollahi In collaboration with the Engineering Team of Kandou Bus Chip-to-Chip Communication Chip 1 Chip 2 Communication wires Task: reliably


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SLIDE 1

High Speed and Low-Power SerDes Architectures using Chord Signaling

Amin Shokrollahi

In collaboration with

the Engineering Team of Kandou Bus

Part 1: THEORY

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SLIDE 2

Chip 1 Chip 2

Communication wires

Task: reliably transmit information from Chip 1 to Chip 2

Chip-to-Chip Communication

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SLIDE 3

Many Application, But….

  • Abundant applications (networking, mobile devices, displays, automotive,…..)
  • Connection speeds are increasing, real estate is shrinking
  • Need to transmit more bits per second on every wire.
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SLIDE 4

Communication Channel

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SLIDE 5

Noise

Chip 1 Chip 2

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SLIDE 6

What it is not

Or any channel with a lot of “random” noise

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SLIDE 7

Recovery Process

Extremely limited on resources

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SLIDE 8

Rule of 1000’s

Throughput Energy/bit Recovery time/ bit Wireless Mbps nJ nano-second Chip-to-Chip Gbps pJ pico-second Hardly any power or time to recover a transmitted bit

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SLIDE 9

Noise Types

  • Simultaneous Switching Output (SSO) noise
  • Caused by changing current draws from symbol to symbol.
  • Reference noise
  • Reference voltages may not be the same at transmitter and receiver
  • Crosstalk
  • Transition on one wire effects the voltage/current on nearby wires
  • Electromagnetic Interference (EMI) noise
  • High frequency currents on a wire make it an antenna (affects other wires, and is affected by

them)

  • Common Mode (CM) noise
  • Power supply may bounce up and down; voltage levels on wires can go up and down by the

same amount.

  • Inter-symbol Interference (ISI) noise
  • Symbols “bleed” into subsequent symbols
  • Thermal noise
  • Random jitter
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SLIDE 10

Noise Types

SSO Ref Xtlk EMI CM ISI Thermal Deterministic Random

Almost all the noise is deterministic but resources are tight

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SLIDE 11

Noise Mitigation

Mitigation techniques SSO Modulation, design Ref Modulation, design Xtlk Layout, design EMI Shielding, modulation Common mode Modulation, design ISI Equalization, modulation Thermal Design

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SLIDE 12

Noise Mitigation

Mitigation techniques SSO Modulation, design Ref Modulation, design Xtlk Layout, design EMI Shielding, modulation Common mode Modulation, design ISI Equalization, modulation Thermal Design

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SLIDE 13

Current Modulation Techniques

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SLIDE 14
  • Any form of transmitting information through different voltage (current) levels on the

communication wires

  • Non-Return-to-Zero (NRZ) signaling: good for fast data transmission

1 1 0 0 0 1 0 1 1 1 1 0 Vcm Vhigh Vlow

Modulation = Signaling

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SLIDE 15

+

  • Vref

Driver Comparator

Transmission line

Reference

Single-ended Signaling

Transmits one bit per wire

~

x {1, +1} 3 b

Simple Receiver

sgn(x − Vref) = b

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SLIDE 16

+1 −1 Error Error Distinguisher

Single Ended Signaling

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SLIDE 17

Noise Immunity

Single-ended SSO

  • Ref
  • EMI
  • Common mode
  • ISI

+ Conclusion Not good for very high speed communication

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SLIDE 18

+

  • Driver

Comparator

Transmission line

sgn(x-y)

Transmits one bit per a pair of wires

x b

  • b

y

~

Differential Signaling

~

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SLIDE 19

Noise Immunity

Single-ended Differential SSO

  • +

Ref

  • +

EMI

  • +

Common mode

  • +

ISI +

  • Conclusion

Not good for very high speed communication pin count can be a problem

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SLIDE 20

Other Solutions?

  • Lower the frequency, i.e., send more data per clock cycle
  • How?
  • Allow detection of more than 2 states on a single wire, or on two wires

➡ 4-PAM signaling: 4 states, i.e., 2 bits ➡ 8-PAM signaling: 8 states, i.e., 3 bits ➡ What happens to noise?

Single-ended Differential 4-PAM diff. SSO

  • +

+/- Ref

  • +
  • EMI
  • +

+ Common mode

  • +

+ ISI +

  • -

Conclusion High speed problematic Pin count problematic High speed issues

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SLIDE 21

Other Solutions?

  • Lower the frequency, i.e., send more data per clock cycle
  • How?
  • Allow detection of more than 2 states on a single wire, or on two wires

➡ 4-PAM signaling: 4 states, i.e., 2 bits ➡ 8-PAM signaling: 8 states, i.e., 3 bits ➡ What happens to noise?

  • Or, pool more than two wires together

➡ Can this be done? ➡ How much more data can be sent? ➡ What happens to noise? ➡ Etc.

Chord signaling

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SLIDE 22

Chord Signaling

  • Simultaneous generalization of all previous signaling methods (including

single-ended, differential, differential 4-PAM, etc.)

  • Allows for the design of very high speed, very low power links
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SLIDE 23

Theory of Chord Signaling

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SLIDE 24

What I will be Talking about

How to arrive at a new type of modulation theory

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SLIDE 25

What I will not be Talking about

Constructions, solutions, etc Test chips, electronics behind it, etc

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SLIDE 26

+

  • Vref

{1, +1} 3 b

Vref

+

  • {1, +1} 3 b

1 −1 1 −1 1 1 −1 −1

All possibilities

Two Independent Wires

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SLIDE 27

Think of the simultaneous values on the wires as points in the 2-dimensional space

Abstraction

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SLIDE 28

Indistinguishable +1 −1 (+1, +1) (−1, +1) (−1, −1) (+1, −1) Distinguishable Distinguishable Indistinguishable D D Distinguisher New distinguisher

Geometric View

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SLIDE 29

Values on the n wires are points in the n-dimensional space Comparators are hyperplanes distinguishing points

Abstraction

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SLIDE 30

3 Bits 2 Wires

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SLIDE 31

3 Bits 2 Wires

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SLIDE 32

y x − y x x + y + − ++ + + ++ + − −+ + − −−

− − −−

− + −− − + +− − + ++ 000 001 011 010 110 111 101 100

3 Bits 2 Wires

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SLIDE 33

6 planes (comparators) 24 chambers = 24 points 4.5 bits on 3 wires

3 Wires

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SLIDE 34

General Architecture

Encoder(

  • +

Rx+frontend(

w0( b1(

Rx+frontend( Comparator(network(

  • +
  • +
  • +
  • +
  • +
  • +
  • +
  • +
  • +
  • +
  • +

Decoder(

b0( b1( b0( w1( w2(

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SLIDE 35
  • n is the interface size, i.e., number of wires in the interface.
  • n = dimension of space we are operating in.
  • c = number of comparators = number of hyperplanes used to separate the

points

  • All hyperplanes pass through origin (centrally referenced).
  • What is the maximum number N of chambers of this arrangement?
  • Equivalently, what is the maximum number of points we can

distinguish?

  • Zaslavsky’s formula: N is at most equal to

Parameters

n−1

X

i=0

✓c i ◆ 1 + (−1)n−1−i

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SLIDE 36

Examples

n = # wires c = # comparators = # hyperplanes

2 3 4 5 6 7 8 9 10 11 12 13 2 4 6 8 10 12 14 16 18 20 22 24 26 3 4 8 14 22 32 44 58 74 92 112 134 158 4 4 8 16 30 52 84 186 260 352 464 598 5 4 8 16 32 62 114 198 326 512 772 1124 1588 6 4 8 16 32 64 126 240 438 764 1276 2048 3172 7 4 8 16 32 64 128 254 494 932 1696 2972 5020 8 4 8 16 32 64 128 256 510 1004 1936 3632 6604

Possible to transmit 7 bits on 4 wires with a detector using 8 comparators

128

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SLIDE 37

But….

What happens to noise?

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SLIDE 38

Noise

Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • EMI
  • +

+

  • Common

mode

  • +

+

  • ISI

+

  • -

+/- Conclusion High speed problematic Pin count problematic High speed issues May have issues

Chord signaling can help lower the frequency. Does it help?

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SLIDE 39

Simulations

  • Realistic model of a mobile memory

channel

  • Channel consists of a group of 8 (9) wires
  • Would like to transmit up to 8.4 Gbps/

wire.

  • Fundamental clock frequency is 4.2 GHz for

single-ended signaling, corresponding to about 8 dB loss.

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SLIDE 40

Statistical Eyes

~36 pico-seconds ~27 mV ~30% of UI

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SLIDE 41

~35 pico-seconds ~22 mV ~23.5% of UI

Statistical Eyes

000 100 010 101 001 011

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SLIDE 42

Statistical Eyes

~38 pico-seconds ~22 mV ~21.5% of UI

000 001 011 010 110 111 101 100

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SLIDE 43

Comparison

6 12 18 24 Single-ended Hexagon Octagon Vertical Horizontal %UI

Lowering the frequency didn’t really help

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SLIDE 44
  • Chambers become very small when number increases
  • System becomes more susceptible to noise.

ERROR

What is Happening?

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SLIDE 45

Increasing Immunity to Noise

20 40 60 80 100 Single-ended Hexagon Octagon GW Vertical Horizontal %UI

How was this designed?

6 12 18 24 Single-ended Hexagon Octagon Vertical Horizontal %UI

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SLIDE 46

Intersymbol Interference Noise (ISI)

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SLIDE 47

+

  • Error

Leads to errors

ISI

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SLIDE 48

Geometric Interpretation

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SLIDE 49
  • Figure of merit: a real number greater than or equal to 1.
  • Ratio of furthest codeword from a hyperplane to the closest one.
  • Maximum over all hyperplanes and all pairs of codewords

Smallest distance x Largest distance y

ISI ratio = y/x

ISI-Ratio

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SLIDE 50

Examples

I = 2

~ 17.5 - 24 psec 20 Gbps

I = 2

~ 18 - 23 psec 18.7 Gbps Almost same width Same ISI ratio

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SLIDE 51

Examples

I = √ 2 + 1

~ 7.5 - 12 psec 24 Gbps

I = 3

0 psec 24 Gbps Higher ISI ratio loses....

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SLIDE 52

Noise

Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • EMI
  • +

+

  • Common

mode

  • +

+

  • ISI

+

  • -

+/- Conclusion High speed problematic Pin count problematic High speed issues May have issues Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • EMI
  • +

+

  • Common

mode

  • +

+

  • ISI

+

  • -

+ by design Conclusion High speed problematic Pin count problematic High speed issues May have issues

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SLIDE 53

Reference, EMI, Common Mode Noise and SSO

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SLIDE 54

Noise Mitigation

Common Mode noise, EMI noise, SSO, and reference noise can be dealt with one elegant construction.

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SLIDE 55

Common Mode Noise

a b c d e a + x b + x c + x d + x e + x

Common mode noise

  • Bad for signal integrity
  • Common mode should be rejected at receiver

Means that comparators should evaluate to 0 on vector (1,1,1,...,1)

  • Codewords should have no common mode component

Common mode component is along vector (1,1,1,...,1) Means that the sum of the values on the wires should be constant.

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SLIDE 56

+

  • sgn(x-y)

x b

  • b

y

~

CM Resistance Differential Signaling

~

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SLIDE 57

Common mode direction Orthogonal space Codewords should be on this line (-1,1) (1,-1)

CM Resistant Codes Differential Signaling

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SLIDE 58

Orthogonal space Codewords should be on this line (-1,1) (1,-1)

Orthogonal Transformation

Common mode direction

Differential from Single Ended

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SLIDE 59
  • Creates CM resistant Chordal code from any Chordal code
  • The number of wires of the interface grows by one
  • All other parameters of the code stay the same (including the ISI ratio)
  • Use Tempering Orthogonal Transformation on the codewords.
  • (0 | old codeword) * Tempering Orthogonal Matrix = new codeword
  • (0 | old comparator) * Tempering Orthogonal Matrix = new comparator

* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * + + + + + * =

Orthogonal matrix Tempering orthogonal matrix

Tempering Process

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SLIDE 60

Examples ENRZ

±(1, −1/3, −1/3, −1/3) ±(−1/3, 1, −1/3, −1/3) ±(−1/3, −1/3, 1, −1/3) ±(−1/3, −1/3, −1/3, 1)

  • +
  • +
  • +

ACTUAL IMPLEMENTATION MAY BE DIFFERENT

1 2     1 1 1 1 1 −1 1 −1 1 1 −1 −1 1 −1 −1 1    

Hadamard Transform

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SLIDE 61

Common Mode Noise

Disappears by construction.

Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • EMI
  • +

+

  • Common

mode

  • +

+

  • ISI

+

  • -

+ Conclusion High speed problematic Pin count problematic High speed issues May have issues Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • EMI
  • +

+

  • Common

mode

  • +

+ + ISI +

  • -

+ Conclusion High speed problematic Pin count problematic High speed issues May have issues

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SLIDE 62

Reference Noise

Disappears, since no reference needed.

Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • EMI
  • +

+

  • Common

mode

  • +

+ + ISI +

  • -

+ Conclusion High speed problematic Pin count problematic High speed issues May have issues Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • +

EMI

  • +

+

  • Common

mode

  • +

+ + ISI +

  • -

+ Conclusion High speed problematic Pin count problematic High speed issues May have issues

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SLIDE 63

EMI Noise

Largely mitigated, since sum of currents on the wires is 0 (far- fields cancel each other). Will talk about it later.

Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • +

EMI

  • +

+

  • Common

mode

  • +

+ + ISI +

  • -

+ Conclusion High speed problematic Pin count problematic High speed issues May have issues Single-ended Differential 4-PAM diff. Chord Signaling (so far) SSO

  • +

+/-

  • Ref
  • +
  • +

EMI

  • +

+ + Common mode

  • +

+ + ISI +

  • -

+ Conclusion High speed problematic Pin count problematic High speed issues May have issues

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SLIDE 64

SSO Noise

Largely mitigated through additional constraint on tempering matrix.

SSO Ref EMI Common mode ISI Conclusion Chord Signaling + + + + + Can be used in a wide range of applications Single-ended Differential 4-PAM diff. Chord Signaling SSO

  • +

+/- + Ref

  • +
  • +

EMI

  • +

+ + Common mode

  • +

+ + ISI +

  • -

+ Conclusion High speed problematic Pin count problematic High speed issues

Chord Signaling

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SLIDE 65

A (n, N, c, I)-Chordal Code (CC) is a pair where

  • C is a subset of of size N (set of codewords)
  • is a subset of of size c (set of comparators)

such that

  • (Distinguishability)
  • (ISI-tolerance)

Lots of practical concerns swept under the rug.

Chordal Code Definition

[−1, 1]n Λ (Rn)∗ |λ(c1)| |λ(c2)| ≤ I 8c1, c2 2 C, c1 6= c29λ 2 Λ: λ(c1)λ(c2) < 0 (C, Λ) ∀λ ∈ Λ, c1, c2 ∈ C : Given n and N, find minimum I, such that there exists a (n, N, c, I)-CC for some c.

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SLIDE 66

Chordal Code Definition

A (n, N, c, I)-Chordal Code (CC) is a tuple where

  • C is a subset of of size N (set of codewords)
  • is a subset of of size c (set of comparators)
  • is a subset of (set of inactives)

such that

  • (Distinguishability)
  • (ISI-tolerance)

Lots of practical concerns swept under the rug. (C, Λ, I) [−1, 1]n Λ (Rn)∗ I C × Λ 8λ 2 Λ8c1, c2 2 C, (c1, λ), (c2, λ) 62 I : |λ(c1)| |λ(c2)| ≤ I 8c1, c2 2 C, c1 6= c2 : 9λ 2 Λ, (c1, λ), (c2, λ) 62 I : λ(c1)λ(c2) < 0

Number of wires Number of codewords ISI-ratio Detection complexity

log2(N) n Rate, or pin-efficiency

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SLIDE 67

(Trivial) Bounds

For a (n, N, c, I)-CC we have:

  • c ≥ n (every comparator gives at most one bit of information)
  • I ≥ 1:
  • N ≤ (Zaslavsky’s formula)

|λ(c1)| |λ(c2)| ≤ I = ⇒ |λ(c2)| |λ(c1)| ≥ 1 I

n−1

X

i=0

✓c i ◆ 1 + (−1)n−1−i

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SLIDE 68

Example of a Concrete Question

What is the best ISI-ratio for n = 3, N = 16? Best result so far: 2.39304, 11 comparators, not practical

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SLIDE 69

A Conjecture

(n, N, c, I) − CC = ⇒ N ≤ (1 + I)n

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SLIDE 70

Electromagnetic Interference (EMI) Noise

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SLIDE 71

Electromagnetic Interference (EMI)

First order analysis of strength of the Electric far-field generated by a charge loop Area = A Frequency = f Current = I Far field strength ~ f 2 · I · A Fix all parameters to 1 for a baseline computation. Then far-field has FOM = 1.

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SLIDE 72

EMI

+1

  • 1
  • 1

+1

FOM = 1 FOM = -1 Average strength = (1+|-1|)/2 = 1 Differential signaling:

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SLIDE 73

Electromagnetic Interference

Two differential lanes:

+ + + +

  • 2
  • 2

Average strength = (2+|-2|)/4 = 1

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SLIDE 74

Electromagnetic Interference

General form:

c0 c1 c2 c3 c5 c4 c5

  • c5

c4+c5

  • c4-c5

c1+c2+c3+c4+c5

  • c1-c2 -c3 -c4-c5

c3+c4+c5

  • c3 -c4-c5

c2+c3+c4+c5

  • c2 -c3 -c4-c5

+ + + + c5 c4+c5 c3+c4+c5 c2+c3+c4+c5 c1+c2+c3+c4+c5 + + + +

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SLIDE 75

Electromagnetic Interference

General form:

c1+2c2+3c3+4c4+5c5 c5

  • c5

c4+c5

  • c4-c5

c1+c2+c3+c4+c5

  • c1-c2 -c3 -c4-c5

c3+c4+c5

  • c3 -c4-c5

c2+c3+c4+c5

  • c2 -c3 -c4-c5

+ + + + c5 c4+c5 c3+c4+c5 c2+c3+c4+c5 c1+c2+c3+c4+c5 + + + + c’(1)

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SLIDE 76

Electromagnetic Interference

FOM for a code C in which for all codewords sum of coordinates is zero:

1 |C| X

c2C

|c0(1)|

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SLIDE 77

Examples

Two differential lanes: 1 4 (2 + | − 2|) = 1 ENRZ: FOM = (2+2/3)/2 = 4/3 ±(1, −1/3, −1/3, −1/3) → 2 ±(−1/3, 1, −1/3, −1/3) → 2 3 ±(−1/3, −1/3, 1, −1/3) → 2 3 ±(−1/3, −1/3, −1/3, 1) → 2 Equal throughput: differential runs at 1.5 times the frequency. Throughput-normalized FOM: Differential: (1.5)2 = 2.25 ENRZ: 4/3 ~ 1.33 SMALLER!

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SLIDE 78

E-Field of ENRZ

ENRZ DS

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SLIDE 79

Summary

  • Chord Signaling (Chordal Coding) provides a mathematically concise framework for

the design of noise resilient modulation schemes for chip-to-chip communication.

  • From a theoretical point of view the main question is to construct for a given number
  • f wires and a given ISI-ratio chordal codes of that ratio that have the maximum

number of codewords.

  • One optimal class (of ISI-ratio 1) of is provided by applying the the tempering

construction to the hypercube.

  • The definition of a chordal code given above can be extended in different ways (not

subject of current presentation).

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SLIDE 80

High Speed and Low-Power SerDes Architectures using Chord Signaling

Amin Shokrollahi

In collaboration with

the Engineering Team of Kandou Bus

Part 2: APPLICATIONS

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SLIDE 81

Digital Design, Shannon

Claude Elwood Shannon 1916 - 2001 MSc Thesis, MIT, 1937

He asked

  • How to analyse switch network

circuits

  • How to synthesise switch network

circuits efficiently And he provided answers! Father of digital design, at least 20 years ahead of his ?me

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SLIDE 82

Bell Laboratories

Aerial view of Bell Labs in Murray Hill

http://users.ece.gatech.edu/~juang/B%20JUANG%20Georgia%20Tech%20Pictures.html

slide-83
SLIDE 83

Invention of the Transistor (End of 1947)

First Transistor Bardeen, Shockley, and Brettain, 1948 Received the Nobel Prize in Physics in 1956

slide-84
SLIDE 84

Integrated Circuits

http://www.just2good.co.uk/cpuSilicon.php ARMv6 processor

  • Discrete transistors were

difficult to connect

  • Too many wires
  • The next big idea was the

use of “integrated circuits

  • Put all the electronic

circuits onto one small plate of semiconductor material (typically silicon)

  • The entire circuit can be

made much smaller

  • Today manufacturing uses

the process of optical lithography

slide-85
SLIDE 85

Transistors: Size, Speed, and Power

Reduc?on in capacitance reduces device delay by same factor Reduc?on in size reduces effec?ve capacitance by 1

√ 2

TD reduced by implies frequency 1/(3*TD) is increased by

1 √ 2 √ 2

To keep constant electrical field, voltage is mul?plied by 1

√ 2

x y A y √ 2 x √ 2 A 2

TD TD TD

Ring oscillator

slide-86
SLIDE 86

Transistors: Size, Speed, and Power

x y y √ 2 x √ 2 A A 2

Reduc?on in feature size by

  • Allows for packing 2 x number of transistors
  • Decreases voltage by 30%
  • Increases speed by 40%

1 √ 2

slide-87
SLIDE 87

Gordon Moore and his Law

Gordon Moore 1929 - Electronics Magazine 1965

slide-88
SLIDE 88

Moore’s Foresight

Figure 2 in Moore’s paper

http://www.businessinsider.com/munster-iphone-lines-launch-day-2013-9?IR=T https://www.wsj.com/articles/apple-store-lines-return-as-iphone-x-debuts-1509683635 https://www.gottabemobile.com/why-you-shouldnt-bother-lining-up-for-the-iphone-x-and-iphone-8/

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SLIDE 89

Transistors: Size, Speed, and Power

Processor Transistor count Manufacturer Transistor pitch ARM-1 25'000 ARM Holdings 3000 nm Intel i-960 250'000 Intel 600 nm Pentium Pro 5'500'000 Intel 500 nm Pentium III 45'000'000 Intel 130 nm Pentium 4 184'000'000 Intel 65 nm Apple A7 1'000'000'000 Apple 28 nm Apple A8 2'000'000'000 Apple 20 nm Xeon Haswell 5'560'000'000 Intel 22 nm Fiji (GPU) 8'900'000'000 AMD 28 nm iPhone 6 iPhone 5S PC’s Gaming

slide-90
SLIDE 90

Moore’s Law against Reality

0.00 7.50 15.00 22.50 30.00 1974 1976 1977 1978 1980 1982 1984 1985 1986 1988 1989 1990 1992 1994 1995 1997 1999 2001 2004 2006 2008 2010 2012 2014 2017 2018 2020 2022 2024 2026 2028 Actual Moore’s law

slide-91
SLIDE 91

Andreas Bechtolsheim 1955 -

Time Performance CPU: 64X/12Y GigE: 10X/12Y Routers: 4X/12Y

Moore’s Law doesn’t hold for I/O

slide-92
SLIDE 92

Data Explosion

“The amount of data is doubling every 24 months, and will reach 44 zettabytes (4.4 x 1022 bytes) by 2020” – IDC, 2014 “IP datacenter traffic will be 8.6 zettabytes by 2018” – Cisco forecast, 2013 “Monthly global mobile data traffic will surpass 24.3 exabytes (2.4 x 1018 bytes) by 2019” – Cisco forecast, 2015 “In 2008 the world’s 27 million business servers processed 9.57 zettabytes” – Computerworld, 2011

slide-93
SLIDE 93

Interconnect Problem

THE bottleneck the industry is facing

slide-94
SLIDE 94

Shannon, again

slide-95
SLIDE 95

Shannon, for Wireline Communication

Noise Throughput 20G 400G 20x Today Target

How do we get there?

slide-96
SLIDE 96

Secret of getting close to Capacity (wireless, DSL,

ADC AdC?

Way too much power consump?on in wireline world at super high speeds (at least up un?l now).

slide-97
SLIDE 97

Challenge

Design an approximate ADC that works in this se[ng

slide-98
SLIDE 98

Chord Signaling

  • +
  • +

av

  • +

av av

  • +
  • +

av

Encoder w0 w1 w2 w3 w4 w5 b0 b1 b2 b3 b4 b0 b1 b2 b3 b4

1 2 1 1 2 3 4 5 3 4 5 4 5

Rx frontend

Much be\er u?lisa?on of communica?on bandwidth using “MIMO” like techniques (without an elaborate ADC)

slide-99
SLIDE 99

Moore’s Paper, again

Massive “integra?on” on chip (SoC’s) is running its course

slide-100
SLIDE 100

Massive Disintegration with Glasswing

DRAM DRAM Analog DSPs Memory interface Memory interface Long-reach SerDes Long-reach SerDes Long-reach SerDes Long-reach SerDes Long-reach SerDes Photonics (SiGe) Photonics (SiGe) Photonics (SiGe) Photonics (SiGe) Photonics (SiGe)

System on Chip SoC

Long-reach SerDes Long-reach SerDes Long-reach SerDes Long-reach SerDes Long-reach SerDes Photonics (SiGe) Photonics (SiGe) Photonics (SiGe) Photonics (SiGe) Photonics (SiGe)

SoC/2 SoC/2

Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing Glasswing

Lifeline for Moore’s law: low cost integra?on of func?onality

slide-101
SLIDE 101

Chordal Code Used

        1 1 1 1 1 1 1 −1 −1 2 −1 1 −1 −1 2 −1 1 1 1 −1 −1 −1        

Tempering process applied to a version of the orthogonal form of the matrix

slide-102
SLIDE 102

Glasswing Chip

TC0 TC1 TC3 TC2 12 mm 5 mm 24 mm

  • Fully characterized.
  • Power consumption is ~30% of

comparable products

  • Highest speed for in-package SerDes

(more than 20Gbps/wire)

  • Highly optimized second generation

(16nm) in products in 2018

slide-103
SLIDE 103

Commercial Applications

  • Technology and implementation licensed by Marvell Technology Group
  • Application is in the networking space
  • If adopted widely by the industry, the Glasswing technology can save the electronics

several $B per year through

  • Higher yield
  • Shorter design time of new products and features
  • Lower manufacturing cost by using older process technologies alongside modern
  • nes
  • Currently being considered by companies in the networking, defense, consumer

electronics, and wireless space

slide-104
SLIDE 104

References

[1] A. Abbasfar, “Generalized differential vector signaling,” Proc. of the ICC, pp. 1-5, 2009. [2] A. Abbasfar, “Simplified receiver for use in communication systems,” U.S. patent no. 8,159,375 [3] A. Amirkhany, “Multi-carrier signaling for high speed electrical links,” Ph.D. Thesis, Stanford University, 2008. (http://vlsiweb.stanford.edu/

people/alum/pdf/0803_AmirAmirkhany_Analog_Multitone_Links.pdf)

[4] A. Amirkhany, A. Abbasfar, V. Stojanovic, and M.A. Horowitz, “Practical limits of multi-tone signaling over high-speed backplane electrical links,” Proc. Of the ICC, pp. 2693–2698, 2007. [5] A. Amirkhany, K. Kaviani, A. Abbasfar, F. Shuaeb, W. Beyene, C. Hoshino, C. Madden, K. Chang, and C. Yuan, “A 4.1pJ/b 16Gb/s Coded Differential Bidirectional Parallel Electrical Link,” ISSCC 2012, pp. 138-140. [6] A. Bechtolsheim, “Moore’s law and networking,” North American Network Operator’s Group (NANOG) meeting, 2012. (https://

www.nanog.org/meetings/nanog55/presentations/Monday/Bechtolsheim.pdf)

[7] D.M. Chiarulli, J.D. Bakos, J.R. Martin, and S.P. Levitan, “Area, power, and pin efficient bus transceiver using multi-bit-differential signaling,” IEEE International Symposium on Circuits and Systems, pp. 1662–1665, 2005. [8] H. Cronie and A. Shokrollahi, “Orthogonal differential vector signaling,” U.S. Patent application no. 12/784414. [9] H. Cronie, A. Shokrollahi, and A. Tajalli, “Methods and systems for noise resilient, pin-efficient and low-power communications with sparse signaling codes,” U.S. Patent no. 8,649,445. [10] K. Fukuda, H. Yamashita, G. Ono, R. Nemoto, N. Masuda, T.Takemoto, F. Yui, and T. Saito, “A 12.3-mW 12.5-Gb/s complete transceiver in 65-nm CMOS process,” IEEE J. Solid State Circuits, 45, 2010. [11] K. Gharibdoust, A. Tajalli, and Y. Leblebici, “A 7.5 mW 7.5 Gb/s mixed NRZ/multi-tone serial- data transceiver for multi-drop memory interfaces in 40nm CMOS,” ISSCC 2015, pp. 1–3, 2015. [12] M. Harwood et al., “A 12.5 Gb/s SerDes in 65nm CMOS using a Baud-Rate ADC with Digital Receiver Equalization and Clock Recovery”, ISSCC 2007, pp. 436-439. [13] A. Healey and C. Morgan, “A comparison of 25 Gbps NRZ & PAM-4 Modulation used in legacy & premium backplane channels,” DesignCon 2012. [14] A. Hormati, A. Shokrollahi, and R. Ulrich, “Method and apparatus for low power chip- to-chip communications with constrained ISI- ratio,” U.S. Patent application no. 14/612241. [15] A. Hormati and A. Shokrollahi, “ISI tolerant signaling: a comparative study of PAM4 and ENRZ,” DesignCon 2016. [16] A. Hormati, A. Tajalli, Ch. Walter, K. Gharibdoust, and A. Shokrollahi, “ A Versatile Spectrum Shaping Scheme for Communicating Beyond Notches in Multi-Drop Interfaces,” DesignCon 2016.

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SLIDE 105

References

[17] S.A. Ibrahim and B. Razavi, “Design requirements of 20-Gb/s serial links using multi-tone signaling,” ISSCC 2009, pp. 1–4. [18] J. Lee, M. Chen, and H. Wang, “Design and Comparison of Three 20-Gb/s Backplane Transceivers for Duobinary, PAM4, and NRZ Data”, JSSC, vol. 43, no .9, 2008. [19] F.J. MacWilliams and N.J.A. Sloane. “The Theory of Error-Correcting Codes.” North-Holland, 1988. [20] M. Mansuri, J.E. Jaussi, J.T. Kennedy, T. Hsueh, S. Shekhar, G. Balamurugan, F. O’Mahony, C. Roberts, R. Mooney, and B. Casper, “A scalable 0.128-to-1Tb/s 0.8-to-2.6pJ/b 64-lane parallel I/O in 32nm CMOS,” ISSCC 2013, pp. 402–403. [21] A. Nazemi, Kangmin Hu, B. Catli, Delong Cui, U. Singh, T. He, Zhi Huang, Bo Zhang, A. Momtaz, and J. Cao, “A 36Gb/s PAM4 transmitter using an 8b 18GS/s DAC in 28nm CMOS,” ISSCC 2015, pp. 58–60. [22] D. Oh, F. Ware, J.-H. Kim, A. Abbasfar, J. Wilson, L. Luo, R. Schmitt, and C. Yuan, “Pseudo- differential vector signaling for noise reduction in single-ended signaling systems,” Designcon, 2009. [23] P. Orlik and H. Terao. Arrangements of Hyperplanes. Springer Verlag, 1992. Number 300 in Grundlehren der mathmetischen Wissenschaften. [24] V. Parthasaraty, “PAM4 digital receiver performance and feasibility,” IEEE 802.3bj meeting, 2012 (http://www.ieee802.org/3/bj/public/jan12/

parthasarathy_01_0112.pdf)

[25] D.V. Perino and J.B. Dillon, “Apparatus and method for multilevel signaling,” U.S. Patent no. 6,005,895. [26] J.W. Poulton, S. Tell, and R. Palmer, “Multiwire differential signaling,” University of North Carolina-Chapel Hill, 2003. [27] A. Shokrollahi, “Vector signaling codes with reduced receiver complexity,” U.S. Patent application no. 14/313966. [28] A. Shokrollahi, “Vector signaling codes with high pin-efficiency and their applications to chip-to-chip communications and storage,” U.S. Patent application no. 14/612252. [29] A. Shokrollahi and R. Ulrich, “Vector signaling codes with increased signal to noise characteristics,” U.S. Patent application no. 62/015172. [30] A. Shokrollahi et al., “A Pin-Efficient 20.83 Gb/s/wire 0.94 pJ/bit Forwarded Clock CNRZ-5 coded Serial Link up to 12mm for MCM Packages in 28nmTechnology,” ISSCC 2016. [31] A. Singh et al., “A pin- and power-efficient low-latency 8-to-12Gb/s/wire 8b8w-coded SerDes link for high-loss channels in 40nm technology,” ISSCC 2014, pp. 442–443. [32] J. Poulton, W.J. Dally, , X. Chen, J.G. Eyles, Th.H. Greer, S.G. Tell, J.M. Wilson, and C.Th. Gray, “A 0.54 pJ/b 20 Gb/s ground-referenced single-ended short-reach serial link in 28 nm CMOS for advanced packaging applications,” JSSC, vol. 48, pp. 3206–3218, 2013.

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SLIDE 106

References

[33] D. Slepian, “Permutation modulation,” Proc. IEEE, vol. 53, pp. 228–236, 1965. [34] D. Stauffer, J. Trinko-Mechler, M.A. Sorna, K. Dramstad, C.R. Ogilvie, A. Mohammad, and J.D. Rockrohr. “High Speed SerDes Devices and Applications.” Springer Verlag, 2009. [35] V.M. Stojanovic, A. Amirkhany, and J. Zerbe, “Multi-tone system with oversampled precoders,” U.S. Patent no. 7,817,743. [36] A. Tajalli, H. Cronie, and A. Shokrollahi, “Methods and circuits for efficient processing and detection of balanced codes,” U.S. Patent no. 8,593,305. [37] Th. Toifl, C. Menolfi, M. Ruegg, R. Reutemann, P. Buchmann, M. Kossel, T. Morf, J. Weiss, and M.L. Schmatz, “A 22-Gb/s PAM-4 receiver in 90-nm CMOS SOI technology,” JSSC, vol. 41, pp. 954–965, 2006. [38] R. Ulrich, “Multilevel driver for high speed chip-to-chip communications,” U.S. patent application no. 14/315,306. [39] G.A. Wiley, “Three phase and polarity encoded serial interface,” U.S. Patent no. 8,472,551. [40] L. Yang and J. Armstrong, “Oversampling to reduce the effect of timing jitter on high speed OFDM systems,” IEEE Communication Letters, vol. 14, pp. 196–198, 2010. [41] S. Zogopoulos and W. Namgoong, “High-Speed Single-Ended Parallel Link Based on Three-Level Differential Encoding”, JSSC,

  • Vol. 44, pp. 549-557, 2009.
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SLIDE 107

KANDOU BUS reinventing the