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FYS4340 Summary lecture 3 Energy dispersive X-ray analysis - - PowerPoint PPT Presentation

FYS4340 Summary lecture 3 Energy dispersive X-ray analysis November 19th 2015 Energy dispersive X-ray spectroscopy (EDS) Introduction and basic physics [W&C chap. 4.1-4.2] Instrumentation [W&C chap. 32] Quantification


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SLIDE 1

November 19th 2015

FYS4340 Summary lecture 3 Energy dispersive X-ray analysis

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SLIDE 2

Energy dispersive X-ray spectroscopy (EDS)

  • Introduction and basic physics [W&C chap. 4.1-4.2]
  • Instrumentation [W&C chap. 32]
  • Quantification and spectrum imaging [W&C chap. 33-35]
  • Spatial resolution [W&C chap. 36]
  • Fultz & Howe chapter 5.6 + 5.7
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SLIDE 3

Electron beam – sample interaction

W&C

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SLIDE 4

Energy transfer processes

The main energy transfer processes are:

  • Brehmsstrahlung
  • Single electron excitations
  • Collective excitations (plasmons)

The first two processes are observed both in energy dispersive X- ray spectroscopy (EDS) and in electron energy loss spectrscopy (EELS). The last process is only observed in EELS.

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SLIDE 5

Brehmsstrahlung

The change in trajectory is caused by an acceleration of the electron. The spectrum of the photons generated is given by the Fourier transform of a(t) for the electron.

F&H

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SLIDE 6

Brehmsstrahlung

Single bremsstrahlung event Several events Many events

Kramer’s cross section for production

  • f bremsstrahlung

F&H W&C

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SLIDE 7

1: Incident electron transfers energy to a «core» electron

  • f the atom,

which exits the sample. 2: The atom is left in an excited state with a core hole. 3a: The atom can relax to the ground state either by emitting a photon (characteristic X- ray)… 3b:…or by emitting an Auger-electron

Single electron excitations

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SLIDE 8

Nomenclature

Atomic shell Main quantum number n Orbital quantum number l Total spin quantum number j Spectroscopic notation 1s 1 +1/2, -1/2 K 2s 2 +1/2, -1/2 L1 2p1/2 2 1 1/2 L2 2p3/2 2 1 3/2 L3 3s 3 +1/2, -1/2 M1 3p1/2 3 1 1/2 M2 3p3/2 3 1 3/2 M3 3d3/2 3 2 3/2 M4 3d5/2 3 2 5/2 M5

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SLIDE 9

More on nomenclature

W&C

Siegbahn notation is most commonly used to name the transitions generating X-rays. However, this can get quite complicated as seen in the figure

  • n the left.

The International Union of Pure and Applied Chemistry (IUPAC) recommends an alternative system that is simpler, but unfortunately not widely in use.

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SLIDE 10
  • R. Jenkins et al. X-Ray Spectrometry 20(3), 149-155 (1991).
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SLIDE 11

Copper K lines

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SLIDE 12

Copper K lines

Eb(K) = -8979 eV Eb(L3) = -933 eV Eb(L2) = -952 eV Eb(M2,3) = -76 eV L3 -> K transition (Kα1) E=hn= Eb(L3)- Eb(K) = 8.046 keV L2 -> K transition (Kα2) E=hn= Eb(L2)- Eb(K) = 8.027 keV M2,3 -> K transition (Kb) E=hn= Eb(M2,3)- Eb(K) = 8.903 keV

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Threshold/critical energy

In order to generate X-rays, the electron beam must have an energy E0 larger than the critical energy Ec of the process. Usually not a problem in TEM E0> 100 keV; Ec< 20 keV BUT: with Cs correctors, low voltage operation has become more

  • common. 60 keV, 40 keV, even down to 30 keV.

For heavy elements this may limit which characteristic X-rays are generated

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SLIDE 14

Ionization cross section

Non-relativistic (Bethe) cross section for ionization

  • E0: energy of electrons
  • Ec: critical energy of

excitation

  • E0/ Ec: Overvoltage
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The fluorescence yield

The probability for generating a characteristic X-ray is given by the fluorescence yield w The probability of generating an Auger electron is the 1- w.

F&H

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The detector and electron/hole-pair generation

  • Characteristic X-rays are generated in the specimen and enter

the detector

  • There, they generate a number of electron/hole-pairs

depending on their energy

  • The electron/hole-pairs are separated by an applied bias, and

the current measured

W&C

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The detector and electron/hole-pair generation

  • Historically, the most common detectors have been the Si(Li)

detectors

  • The so-called Silicon-drift detectors (SDD) have been used for

SEM for quite a while, and are becoming more common also for TEM

  • The detectors are usually cooled to avoid

– diffusion of dopants in the strong applied bias – thermal noise

  • Si(Li) detectors are usually cooled to

LN2 temperatures (-196 C)

  • SDD detectors can make do with only

Peltier cooling (~-30 C)

W&C

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Windows

  • Detectors that are cooled to LN2 temperature «need» to be

protected from contamination

  • Water, hydrocarbons
  • A «window» is used for protection
  • Beryllium, thin polymer, thin polymer with support
  • But is the window transpararent «enough»?

W&C

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Detector-microscope interface

W&C

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It may be necessary to tilt the sample towards the detector to avoid

  • shadowing. But this also has drawbacks.
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Spurious and system X-rays

  • Spurious X-rays from the

specimen, but not the region of interest

  • System X-rays from the sample

holder, specimen support grid, microscope itself (Cu, Fe)

W&C

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SLIDE 22

Example: LaNbO4 doped with Sr

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SLIDE 23

Absorption and fluorescence in the sample

  • The X-rays generated in the

primary event must travel through the specimen to reach the detector

  • The longer the path, the greater

the likelihood of absorbtion…

  • …and fluorescence
  • Might skew the ratio of element

A and B X-rays detected

  • TEM samples are thin
  • Absorption is mainly a problem

for low Z elements (e.g. O)

  • Fluorescence is rarely a

problem at all

  • But still: be aware of these

effects!

W&C

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Detector artefacts

  • Escape peaks
  • Internal fluorescence
  • Sum peaks
  • Energy resolution
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Escape peaks

  • The detector determines the

photon energy by measuring the charge pulse from the electron- hole pairs generated

  • Some times, fluorescence occurs

in the detector, and a Si K photon is generated

  • This photon can leave the

detector, taking with it some of the energy that «should» have gone into making electron-hole pairs

  • The detector then sees a smaller

charge pulse, which is interpreted as a lower energy of the incoming photon giving a peak at E-1.74 keV

  • Usually a small effect, but be

aware when counting for a long time

W&C

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Internal fluorescence

  • The reverse of the previous

problem

  • Incoming X-rays can excite the Si

atoms in the detector (dead layer) making a Si K

  • If this photon enters the «active»

region of the detector, it will be detected

  • A small Si K peak appears in the

spectrum

  • Usually a small effect, but be

aware when counting for a long time

W&C

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Sum peaks

Detector «sees» one photon with E=E1+E2 E=E1 E=E2

EDS detector

Two photons enter detector with small t Mainly a problem when count rates are very high (>> 10 kcps). May be mistaken for another element

Some K sum peaks

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Peak overlap, energy resolution

  • Typical energy

resolution is ~130 eV

  • Measured as

FWHM of Mn K

  • You may easily

see only one peak where in reality there are many

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WDS vs EDS

  • Uses a diffraction grating

(crystal) to select X-rays with particular energy (wavelength)

  • Braggs law
  • Wavelength dispersive, in

stead of energy dispersive

  • Excellent energy resolution
  • Low background, no detector

artefacts

  • Good for light elements
  • Serial detection
  • Movable parts
  • Low effective detection angle
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SLIDE 30

Quantification from EDS spectra

  • How to get from a spectrum to composition
  • Assumptions usually made in EDS in TEM
  • Cliff-Lorimer k-factor method
  • Limits of the CL-method and the assumptions

made

  • Statistical errors

Williams & Carter chapter 35

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The thin film approximation

F&H

In the SEM In the TEM

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The Cliff-Lorimer equations

F&H

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𝑑𝐵 𝑑𝐶 = 𝑙𝐵𝐶 𝐽𝐵 𝐽𝐶

𝑙𝐵𝐶 = 𝑑𝐵𝐽𝐶 𝑑𝐶𝐽𝐵 1 𝑙𝐵𝐶 = 𝑑𝐶𝐽𝐵 𝑑𝐵𝐽𝐶 = 𝑙𝐶𝐵 𝑑𝐵 + 𝑑𝐶 = 1

𝑑𝐶 𝑑𝐷 = 𝑙𝐶𝐷 𝐽𝐶 𝐽𝐷

𝑑𝐵 + 𝑑𝐶 + 𝑑𝐷 = 1 𝑙𝐵𝐷 = 𝑙𝐵𝐶𝑙𝐶𝐷 Binary system Ternary system

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k-factors are not constants

W&C

33

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34

Sheridan (1989)

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k-factors are not constants

Depend on:

  • Acceleration voltage
  • Detector
  • Analysis conditions
  • Background subtraction
  • Peak-integration

k-factors are a sensitivity factor for the particular system. For the best accuracy you the k-factors must be determined for the particular experimental setup. Usually not done today, calculated k-facors used in stead. Less reliable (+/- 20%)

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Limits to the thin film approximation

F&H

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Limits to the thin film approximation

F&H

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Background removal – simple fitting

W&C

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Background removal – modeling

W&C

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Peak integration vs modeling

  • Simply integrating the peak

intensity and subtracting the background works well in many cases

  • But what about peak overlap?
  • The integration would add the

two peaks together

  • Inaccurate results

W&C

40

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Peak integration vs modeling

41

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Peak integration vs modeling

  • In stead, model the known

peaks e.g. with Gaussian funtions

  • Look at the residual
  • Are there unexplained

discrepancies?

  • Perhaps another element is

present?

W&C

42

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Introduction

  • There is uncertainty in all measurements
  • We simply do not have direct access to exact measures of physical

quantities

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Physical quantity Measuring device Analysis/calculation Result

  • All of these steps introduce uncertainties
  • A measured quantity x should alway be given as follows:

x = your best estimate ± some measure of the uncertainty

  • «Error analysis» is the process of finding this best estimate and

deciding on a measure of uncertainty

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Measuring many times

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200 210 220 230 240 250 260 270 280 290 300 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Measured value Number of measurements

n = 5 mean  = 247.3 spread  = 7.6

200 210 220 230 240 250 260 270 280 290 300 5 10 15 20 25 30 Measured value Number of measurements

n = 150 mean  = 249.1 spread  = 9.8 True value= 250 𝜈 = 𝑦 = 1 𝑜 𝑦𝑗

𝑜 𝑗=1

𝜏 = 1 𝑜 − 1 𝑦𝑗 − 𝑦 2

𝑜 𝑗=1

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The Gaussian distribution

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Question: If I make one more mesurement, where is it likely to appear? Answer:

  • 1 :

68%

  • 2 :

95%

  • 3 :

99% We say that the 95% confidence interval for the measurement is [-2, +2] We can treat  as the error in a single measurement.

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Precision vs accuracy

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But shouldn’t many measurements give a more reliable result?

47

200 210 220 230 240 250 260 270 280 290 300 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Measured value Number of measurements 200 210 220 230 240 250 260 270 280 290 300 5 10 15 20 25 30 Measured value Number of measurements

True value= 250 n = 5 mean  = 247.3 spread  = 7.6 n = 150 mean  = 249.1 spread  = 9.8

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SLIDE 48

But shouldn’t many measurements give a more reliable result?

  • Sigma is a measure of the spread of the

measurements.

  • If the spread is caused by e.g. the

measurement system you use, this spread will not improve with more measurements.

  • But we are not really interested in the spread
  • f the measurements, but how reliable the

mean of the measurements is.

  • Standard error of the mean
  • This quantity improved with the number of

measurements.

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Error propagation

  • Often we are not interested in the property

that is measured directly, but some quantity which we calcuculate from one or more measured values.

  • For example the force F = m*a, where m and

a are measured with some uncertainty.

  • What is then the uncertainty in in F?
  • The mean is another such example
  • 49

𝜈 = 𝑦 = 1 𝑜 𝑦𝑗

𝑜 𝑗=1

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Rules for error propagation

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Propagating the errors in the mean

51

𝜈 = 𝑦 = 1 𝑜 𝑦𝑗

𝑜 𝑗=1

= 𝑦1 𝑜 + 𝑦2 𝑜 + ⋯ + 𝑦𝑜 𝑜 Assume same uncertainty  in all measured xi This is called the Standard Error in the Mean (SE)

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200 210 220 230 240 250 260 270 280 290 300 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Measured value Number of measurements 200 210 220 230 240 250 260 270 280 290 300 5 10 15 20 25 30 Measured value Number of measurements

𝜈 ± 1𝑇𝐹 = 247.3 ± 3.4 n = 5 mean  = 247.3 spread  = 7.6 𝑇𝐹 = 𝜏 𝑜 = 7.6 5 = 3.4 n = 150 mean  = 249.1 spread  = 9.8 𝑇𝐹 = 𝜏 𝑜 = 9.8 150 = 0.8 𝜈 ± 1𝑇𝐹 = 249.1 ± 0.8

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Introduction to counting statistics

  • Generation/emission of X-ray photons from an irradiated

sample is a random process with a probability p per unit time.

  • For an large (infinite) counting time t, we would expect to see

N=<N>=t*p

  • But what does that mean for set of a real measurements (small

t)?

  • We would find N1, N2, N3, N4,..
  • These values will not be equal, but will be clustered around an

average 𝑂

  • For a large number of measurements, 𝑂

→ 𝑂

  • Counting experiments of this sort follow the Poisson distribution
  • Here, the uncertainty (standard deviation) of a measurement

counting N events is estmated as 𝜏 = √(𝑂)

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What does this mean for our interpretation of our experiments?

  • The intensity of each characteristic peak is a counting of the

number of X-ray photons

  • If we count N photons, the uncertainty is 𝜏 = √(𝑂)
  • If we reapeat the experiment, there is a 68% likelyhood that the

new measurement will give 𝑂 ± 1𝜏 , 95% likelyhood of 𝑂 ± 2𝜏, 99% of 𝑂 ± 3𝜏

  • This uncertainty has to be accounted for in our quantification,

and when we report composition measurements.

  • The background is also Poisson distributed
  • This means that the background will show fluctuations with

intensity 𝜏 = √(𝑂)

  • How do we then distinguish a “real” signal from “noise”?

54

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Significant or not?

W&C

55

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Let’s quantify the ratio of Cu to Zn

  • Cliff-Lorimer equations

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𝑑𝐵 𝑑𝐶 = 𝑙𝐵𝐶 𝐽𝐵 𝐽𝐶

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SLIDE 57

W&C

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Let’s quantify the ratio of Cu to Zn

  • Cliff-Lorimer equations
  • 𝑙𝐷𝑣,𝑇𝑗 = 1.51 ± 0.40 2𝜏
  • 𝑙𝑎𝑜,𝑇𝑗 = 1.63 ± 0.28 (2𝜏)
  • 𝑙𝐷𝑣,𝑎𝑜 =?
  • 𝑙𝐷𝑣,𝑎𝑜 = 𝑙𝐷𝑣,𝑇𝑗 𝑙𝑇𝑗,𝑎𝑜 = 𝑙𝐷𝑣,𝑇𝑗

1 𝑙𝑎𝑜,𝑇𝑗 = 0.93

  • What is 𝜏?
  • 𝜏 = 0.93

0.20 1.51 2

+

0.14 1.63 2

= 0. 15

  • 𝑙𝐷𝑣,𝑎𝑜 = 0.93 ± 0.15 (1𝜏)

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𝑑𝐵 𝑑𝐶 = 𝑙𝐵𝐶 𝐽𝐵 𝐽𝐶

1 𝑙𝐵𝐶 = 𝑙𝐶𝐵 𝑙𝐵𝐷 = 𝑙𝐵𝐶𝑙𝐶𝐷

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59

𝑱𝒂𝒐 𝑱𝑫𝒗 𝝉𝒂𝒐 = 𝑱𝒂𝒐 𝝉𝑫𝒗 = 𝑱𝑫𝒗 𝒅𝑫𝒗 𝒅𝒂𝒐 Sample A 9782 269 99 16 Sample B 10063 297 100 17 Sample A:

𝑑𝐷𝑣 𝑑𝑎𝑜 = 𝑙𝐷𝑣,𝑎𝑜 𝐽𝐷𝑣 𝐽𝑎𝑜 = 0.93 × 269 9782 = 0.026

𝜏 =

𝑑𝐷𝑣 𝑑𝑎𝑜 0.015 0.93 2

+ (

16 269)2+( 99 9782)2= 0.004

Sample B:

𝑑𝐷𝑣 𝑑𝑎𝑜 = 0.027

𝜏 = 0.005 Is the difference significant? 𝐸𝑗𝑔𝑔 = 0.001 ± 0.0042 + 0.0052 = 0.001 ± 0.006

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Measurement #i

𝑱𝒂𝒐 𝑱𝑫𝒗 𝝉𝒂𝒐 = 𝑱𝒂𝒐 𝝉𝑫𝒗 = 𝑱𝑫𝒗 𝒅𝑫𝒗 𝒅𝒂𝒐 𝜏𝑗

1 9782 269 99 16 0.026 0.004 2 9261 279 96 17 0.028 0.005 3 1660 26 41 5 0.015 0.006 4 35175 977 188 31 0.026 0.004 5 23370 641 153 25 0.025 0.004 6 11938 343 109 19 0.027 0.004 7 16015 436 127 21 0.025 0.004 8 100026 2757 316 53 0.026 0.004

Measurement #i

𝑱𝒂𝒐 𝑱𝑫𝒗 𝝉𝒂𝒐 = 𝑱𝒂𝒐 𝝉𝑫𝒗 = 𝑱𝑫𝒗 𝒅𝑫𝒗 𝒅𝒂𝒐 𝜏𝑗

1 10063 297 100 17 0.027 0.005 2 3668 99 61 10 0.025 0.005 3 9711 199 99 14 0.019 0.003 4 28191 606 168 25 0.020 0.003 5 35148 761 187 28 0.020 0.003 6 13589 294 117 17 0.020 0.003 7 7720 186 88 14 0.022 0.004 8 100245 2222 317 47 0.021 0.003

Sample A Sample B

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Sample A Average:

𝑑𝐷𝑣 𝑑𝑎𝑜 = 0.025

Spread: 𝜏 = 0.004 Standard Error: 𝑇𝐹 = 𝜏

𝑜 = 0.0014

Sample B Average:

𝑑𝐷𝑣 𝑑𝑎𝑜 = 0.022

Spread: 𝜏 = 0.003 Standard Error: 𝑇𝐹 =

𝜏 𝑜 = 0.0011

Difference = 0.003 ± 0.00142 + 0.00112 = 0.003 ± 0.002 Virtually identical to the error in the individual measurements