funding opportunities in h2020

Funding opportunities in H2020 WorkProgramme 2018-20 Francisco J. - PowerPoint PPT Presentation

Electronic Components and Systems Funding opportunities in H2020 WorkProgramme 2018-20 Francisco J. Ibez DG CONNECT EFECS2017. Brussels ICT WorkProgramme 2018-20 Information and Communication Technologies Technologies for Digitising

  1. Electronic Components and Systems Funding opportunities in H2020 WorkProgramme 2018-20 Francisco J. Ibáñez DG CONNECT EFECS2017. Brussels

  2. ICT WorkProgramme 2018-20 Information and Communication Technologies • Technologies for Digitising European Industry • European Data Infrastructure High-Performance Computing, Big Data, Cloud • 5G • Next Generation Internet DIH and platforms • Digital Innovation Hubs • Platforms and Pilots Cybersecurity International calls

  3. ICT WorkProgramme 2018-20 Technologies for Digitising European Industry o Unconventional Nanoelectronics o Flexible and Wearable Electronics o Electronic Smart Systems (ESS) o Computing technologies and engineering methods for cyber-physical systems of systems o Security and resilience for collaborative manufacturing environments o Photonics Manufacturing Pilot Lines for Photonic Components and Devices o Photonics based manufacturing, access to photonics, datacom photonics and connected lighting o Application driven Photonics components o Robotics in Application Areas o Robotics Core Technology

  4. Focus Areas in the WP2018-20 • Building a low-carbon, climate resilient future • Digitising and transforming European industry and services • Connecting economic and environmental gains – the Circular Economy • Boosting the effectiveness of the Security Union

  5. Electronic components and systems Reinforcing the Electronics sector in Europe Unconventional Nanoelectronics 30 M € Electronic Flexible and 48 M € Smart Systems 30+20+8 M € wearable electronics

  6. Unconventional Nanoelectronics Open: October 2018 The Scope (RIAs) Close: March 2019 Beyond-CMOS devices • quantum, spintronic, single electron devices,.. Energy efficient architectures • neuromorphic and other hardware implementation Specific technological developments • » 3-D stacks (sequential / monolithic)  compactness, heat dissipation… » Cryogenic electronics for advance computing (supercomputing, quantum computing …) Design for advance nanoelectronics • » energy efficiency » Reliability » Robustness

  7. Flexible and Wearable Electronics Open: October 2017 Scope Close: 17 April 2018 - Enhancing manufacturability Combine Organic/printed electronics and large area deposition technologies TRL 4  Multi-functional components  Equipment and processes for: Large scale fabrication, Mass-customisation, Characterisation - Integration technologies New concepts for the Integration of: Transducers, Energy storage, Data storage, Logic, Displays, Light TRL 4-5 sources, Interconnect - Device demonstration Prototype validation in specific applications - Integration of electronic devices in wearables /portable setting (Textiles, flexible/streatchable substrates - Compatibility with low-cost manufacturing, Efficient energy scavenging and storage TRL 4-5 - Functional performance, Durability and reliability - Privacy, Security, Liability and free flow of data, Recyclability, waste management

  8. ICT-02-2018 (Flexible and Wearable Electronics) Expected Impact & Instrument Expected Impact Open: October 2017 Close: 17 April 2018 Tech-R&D • Technology leaps in performance: • Functionalities, autonomy, reliability, manufacturability, cost  European leadership in Large Area, flexible and wearable electronics • Increased R&D cooperation in technology device development and related manufacturing process New Opportunities (products-sectors) • Emergence of new products (combining printed and large area processed electronics) • New opportunities in new sectors, for new actors (eg designers, artists..) Economy-Finances • More manufacturing capabilities in Europe • More industrial investments in flexible and wearable electronics Instrument 30 M € - 100% funding Research and Innovation Actions (RIA) Submission deadline: 17-April-2018

  9. DT-NMBP 18-2019 : Materials, manufacturing processes and devices for organic and large area electronics Challenge Advance the technology readiness level of Organic / Large area Electronics  to advance its manufacturability Via: Demonstration of OLAE-enables prototypes in selected applications Work to cover: materials, manufacturing processes and devices • Material : Electrical performance, Processibility and seamless integration Scope Stability, lifetime in operation • Processes: Seamless integration into traditional/new products High speed integration processes on flexible substrates • Prototyping of advanced products • New products in flexible and wearable electronics. Expected Impact • Improvement in cost competitiveness • Improved stability, mobility, lifetime, processibility • Improved business opportunities and value creation in Europe • Development of manufacturing capabilities in Europe The Instrument 20 M € * - 70% funding * Co-funded by ICT and NMBP programmes Deadline for submission (2-step procedure): Innovation Actions (IA) 22-jan-2019 and 5-Sept-2019

  10. Electronic Smart Systems (ESS) Open: October 2017 The Challenge Close: 17 April 2018 • Develop a new generation of multi-functional ESS technologies Hardware integration of Sensing, actuating, processing, wireless transmission • Validation of ESS technologies, via application demonstrators The Instruments and 39 M € - 100% funding - Research and Innovation Actions (RIA) 8 M € - 70% funding - Innovation Actions (IA) - Coordination and Support Actions (CSA) 1 M € - 100% funding

  11. Electronic Smart Systems (ESS) Open: October 2017 The Scope (RIA) Close: 17 April 2018 • Research and Innovation Actions (RIA) a - Technological breakthroughs: miniaturisation TRL 4 functionalities power consumption, autonomy reliability secure operation b – Bio-electronics Smart Systems: Cost effective miniaturisation, manufacturing and demonstration: TRL 5 specificity/sensitivity time to results reliability manufac turability submission: 17 April 2018 39 M € - 100% funding

  12. Electronic Smart Systems (ESS) ICT-07-2018 The Scope (IA and CSA) • Innovation Actions (IA) Access to Nanoelectronics and Electronic Smart Systems - Access to advance design and manufacturing (academia, research institutes, SMEs) - Rapid prototyping production for SMEs and market deployment - Technical support and training 8 M € - 70% funding • Coordination and Support Actions (CSA) - Collaboration between projects/experts in Nanoelectronics+ Electronic Smart Systems+ Flexible /wearable electronics - Increase outreach - International cooperation - Technology/development monitoring - Roadmapping 1 M € - 100% funding submission: 17 April 2018

  13. Electronic Smart Systems (ESS) The Expected impact Open: October 2017 Close: 17 April 2018 Technology / R&D • Build a European Leadership for system performances • Improved ESS manufacturing capabilities in Europe • Increase cooperation – Promote multi-disciplinary initiatives New opportunities (sector, product) • New opportunities for digitising in traditional sectors • New users in industry (SMEs, mid-caps) and academia Economy/Finances • More industrial investments • Increased market penetration for ESS and bio-electronics systems • Increased long-term industrial involvement in R&I

  14. Digitising and transforming European industry and services Aims to contribute to: • enabling all sectors to adapt, Integrates R&I Covers the main actions of transform and benefit from related to major the work programme digitisation; technological addressing the priorities of • developing new business models; trends with • connecting to MS and regions, the Digital Single Market application-driven • removing barriers for innovation Strategy of the EC and enabled by digitisation. initiatives through a helping seizing the multidisciplinary opportunities offered by approach. digital technologies. Total indicative budget (2018-2020): EUR 1 689 million

  15. DT-ICT-01-2019 : Smart Anything Everywhere Initiativ e Stimulate the development of the next wave of products that integrate digital technologies  A network of Digital Innovation Hubs in the following technology areas: • Area 1: Cyber-physical and embedded systems • Area 2: Customised low energy computing powering CPS and the IoT • Area 3: Flexible and Wearable Electronics • Area 4: Widening Digital Innovation Hubs Innovation Actions up to 8 M € 48 M € Call opening: 16 October 2018 Call deadline: 2 April 2019

  16. Smart Anything Everywhere Where are we now? SMART EES Pilot Phase & Phase 2 Phase 1 2017-present 2011 - present 25M € 37M € Smart Cyber- Organic and System Physical Advanced Large Area Integration Systems Computing Electronics

  17. european-industry components-systems


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