Fabless silicon photonics operation and design trends LETI - - PowerPoint PPT Presentation

fabless silicon photonics operation and design trends
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Fabless silicon photonics operation and design trends LETI - - PowerPoint PPT Presentation

1 July 2018 Fabless silicon photonics operation and design trends LETI INNOVATION DAYS 2018 CONFIDENTIAL Outline Vertical vs. Horizontal / fabless business model Fabless model in photonic integration Fabless silicon photonics


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1 July 2018 CONFIDENTIAL

Fabless silicon photonics operation and design trends

LETI INNOVATION DAYS 2018

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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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Understanding fabless integration

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment Test Packaging Fabrication Design Definition Characterization

Traditional optical component manufacturers (lasers, PDs, splitters, AWGs, modulators, etc.)

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Packaging Characterization Fabrication Design Definition ✔ Performing device ✔✔ Low Investment

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Packaging Characterization Foundry Design Definition Fabrication

Fabless model

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Packaging Characterization Foundry Design house Definition Fabrication Design

Fabless model

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Outsourced Semiconductor assembly and test (OSAT) Foundry Design house Definition Fabrication Design Characterization Packaging

Fabless model

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Horizontal business model

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The growth of the fabless model

Source: Statista

In two decades...

  • Pure-play foundry

revenues have grown, becoming the predominant manufacturing model.

  • Wile IDM sales are still

larger given the large concentration in few players, fabless sales have been growing faster and at a more stable rate

  • ver the last two

decades.

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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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PIC technology evolution

1970 1980 1990 2000 2010 2020

EU fabless Investment 100 Gb/s TX/RX InP, 2004 40 Gb/s AOC SOI, 2007

Optical component Manufacturers

Lasers Photodiodes Passives Splitters AWGs VOAs

Beam combiner Si3N4, 2012

Global investment

FBG interrogator InP, 2015 OCT SOI, 2015

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Silicon photonics technology take-up

PUBLICATIONS EACH YEAR

(Conferences not included)

Start of industrial interest

Courtesy Roel Baets, IMEC/UGhent

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PIC market trends

$866M

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Horizontal business model

Photonics lags 30 years behind!

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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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Photonic EDA tools

  • Traditional Electronic Design Automation (EDA) tool vendors are

heavily investing and partnering with smaller photonic design tool vendors.

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Photonic EDA tools (II)

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Fabless Si photonics manufacturing

  • All major CMOS foundries investing, specially in

Asia following IC trends.

  • Proprietary generic processes: passives,

actives (heaters, Ge PDs, Modulators, heterogeneous InP)

  • Extra FEOL modules (SiN, SSC, etc.)
  • BEOL options (Al/Cu, multilayer routing, TSV,

pillars, etc.)

  • Electronic-Photonic co-design

Source: IC Insights

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Fabless Si photonics manufacturing (II)

  • Different software versions of Process Design Kits (PDKs) in

place at most foundries, compiling design libraries with many mature building blocks for several processes.

  • Multi-Project Wafer (MPW) runs available directly or through

brokers for low-cost prototyping.

  • R&D foundries setting up strategic agreements to transfer

process and allow to scale-up production.

VLC Photonics technical foundries report:

  • 35 silicon photonic

foundries, 6 brokers

  • Contact info,

capabilities, & PIC developments

  • 180 pages & +650

references

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Challenges in fabrication

  • Lack of updated information & roadmaps
  • PDK availability & BB validation
  • Turn around (cycle) time & delays
  • Fabrication reporting
  • Performance and delivery guarantees
  • Wavelength range
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Test and Packaging

Back-end (post fab) processes comprise:

  • Wafer metrology and probing
  • Wafer back grinding (thinning) and dicing/cleaving
  • Bare die characterization
  • Packaging into component
  • Component testing
  • Assembly into module

Challenges in photonics still remain:

  • High cost contribution at the back-end
  • On wafer electrical+optical testing
  • Package & assembly scalability
  • Lack or fragmentation of standards
  • DC+RF+optical package design & multiphysics
  • Small pool of expertise and providers
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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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PIC design challenges

  • IP on building blocks / PDKs
  • DRC validation & routing automatization
  • Workfmow standardization & tool interfacing
  • Software licensing models and incumbent pricing
  • Training & documentation
  • Skilled workforce
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Design company trends

Company Type Characteristics Typical size ID design consultants 1-2 person operation focusing on consulting on particular specialties 0.2 to 0.5M € PIC design house Always fabless, 3-25 people, sometimes also brokers fabrication or

  • ther services

0.5 to 2M € IP / Technology licensing company Usually focused on one technology or product area, engineering oriented management 2 to 15M € Fabless chip firm Growing fast to a niche product or market; usually fabless, strong marketing, product development and distribution departments, 20-200 people < 200M €

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IP approach in photonic integration

  • Design IP is a large business in

semiconductor markets.

  • IP owned by:

Foundries

Fabless fjrms

EDA vendors

Source: Semico research Source: IBS Source: Mentor

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IP approach in photonic integration

  • Photonics still lacks such business model, mainly due to:

Lack of market volume and enough licensee base,

Low maturity of fabrication processes, risky and expensive IP development,

IP usually limited to building blocks, not circuits,

Diffjcult IP usage, checking and enforcing,

Expensive patent/semiconductor topography registration, maintenance and defence, specially for SMEs. Fabless firms Foundries EDA vendors

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Summary and take-aways

  • Photonic integration is maturing very quickly due to growing

market demands, and silicon photonics is profjting from all experience of the CMOS world.

  • The fabless model is being successfully replicated in the

photonic integration fjeld.

  • Main technical and business challenges remain on the back-

end processes.

  • On the design side, the photonics EDA market is quickly

consolidating, while design IP will take longer to become a market reality.

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info@vlcphotonics.com

Contact details

www.vlcphotonics.com @vlcphotonics linkedin.com/company/vlc-photonics

Thank you for your attention!