Endcap Disc DIRC-Mechanics Status PANDA CM 19/2 MEC Session - - - PowerPoint PPT Presentation

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Endcap Disc DIRC-Mechanics Status PANDA CM 19/2 MEC Session - - - PowerPoint PPT Presentation

Apr 02, 2024 217 likes •392 views

Endcap Disc DIRC-Mechanics Status PANDA CM 19/2 MEC Session - 2019/06/25 Ilknur Kseo lu Sar, Simon Bodenschatz, Lisa Brck, Michael Dren, Avetik Hayrapetyan, Jan Hofmann, Sophie Kegel, Jhonatan Pereira de Lira, Mustafa Schmidt, Marc

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SLIDE 1

Endcap Disc DIRC-Mechanics Status

1

Ilknur Köseoğlu Sarı, Simon Bodenschatz, Lisa Brück, Michael Düren, Avetik Hayrapetyan, Jan Hofmann, Sophie Kegel, Jhonatan Pereira de Lira, Mustafa Schmidt, Marc Strickert

PANDA CM 19/2 – MEC Session - 2019/06/25

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SLIDE 2

2

EDD elements

  • Quadrants
  • Light tight
  • Gas tight
  • Mounting Plate, MP
  • Stabilizing Cross
  • Readout Modules, ROM
  • Light tight
  • Gas tight
  • 96 ROMs in total
  • 24 ROMs/Quadrant

ROM

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SLIDE 3

3

Readout module (ROM)

  • 3 Focusing elements
  • 3 Bars
  • ROM case
  • Rigid-flex PCB
  • HV divider

Rigid-flex PCB ROM case

HV Divider

Optical link

Alignment of 8 ROMs

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SLIDE 4

4

Mounting plate & Support frame

  • 96 ROMs align around the EDD radiator
  • Because of the EMC insulation, ROM

position differs for each region.

ROM positions differ for each ROM.

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SLIDE 5

5

Limited regions

Crates Legs Legs Insulation

  • Lightened areas are critical

regions

  • Spatial constraint changes

depending on phi-angle.

  • Crate region at two

sides

  • Leg region
  • Insulation at bottom
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SLIDE 6

6

Crate region

Bar Focusing element EMC Insulation Support frame Crates

Optical link HV cables

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SLIDE 7

7

Crates Crates Legs Legs Legs Insulation

7

Limited regions

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SLIDE 8

8

Leg region

Optical link cage HV cables Cooling pipe for ASICs

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SLIDE 9

9

Radial limit

Insulation

  • Distance between insulation and flex PCB is ~ 3mm in radial direction.
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SLIDE 10

10

Problems

  • There are limits both z-direction and radial direction.
  • No space for cable alignment
  • HV cables
  • LV cables
  • Optical link
  • Cooling system for FPGA has not been implemented yet!
  • No space for HV divider

Cable specifications

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SLIDE 11

11

Proposed solutions

  • 1. Reduce number of ROMs in each quadrant, not preferable.
  • 2. Moving EDD through the upstream direction. EDD is in-between GEM

detectors and forward EMC.

7 ROMs design

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SLIDE 12

12

New design

LV cables HV cables

HV divider

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SLIDE 13

13

New design

  • There will be one more frame between mounting plate and support

frame.

  • We can align HV-LV cables.
  • There is a distance between EMC insulation and EDD electronics.
  • HV divider can be implemented on top of the ROM.
  • Cooling system can be designed also for FPGA.
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SLIDE 14

14

Thanks for your attention!

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SLIDE 15

15

Backup

ROM Case Rigid-PCB Rigid-PCB Flex-PCB HV-Divider HV-Cables