Convergence in the ERC program with Illustrations for Nanotechnology - PowerPoint PPT Presentation

Convergence in the ERC program with Illustrations for Nanotechnology Farhang Shadman, Ph.D. Regents Professor of Chemical and Environmental Engineering Regents Professor of Optical Sciences Director, NSF Semiconductor Research Corporation Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Daniel J.C. Herr, Ph.D. Professor of Nanoscience University of North Carolina Greensboro 336-285-2862; djherr@uncg.edu 1 Panel 3, NSF NSE Grantees Conference, Westin Alexandria, VA December 9 th , 2019

Overview Opening Thought Some Stories Appendix Additional Results and Back-up Information

Opening Thought Let not what you do define what you are. Rather, let what you want to become define what you do. - John Hurt [NSF, 1997 CEBSM Review]

Early Perceptions of ESH Technology - ~1995

A Crisis and a Challenge Water May 16, 1994

An Epiphany Win-Win Resource Management Spring 1995

NSF MOU SRC Convergence #1 NSF-SRC Partnership December 1, 1995

High Environment, Semiconductor Performance & Safety and Technology Sustainable Health Convergence #2 Launched a Joint ERC on Environmentally Benign Semiconductor Manufacturing [CEBSM] High Performance and Sustainable Materials and Processes 1996

NSF Semiconductor Research Corporation Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Founding Leadership Team Prof. Farhang Prof. Robert Helms, Prof. Rafael Reif, Shadman, UAz Tucson Stanford University MIT

University-Industry Collaborative Research on the ESH Aspects of SC Manufacturing Other University members • Arizona State U • UCLA • U Colorado • Columbia • Cornell • Georgia Inst. of Tech. Founding Universities (1996) • Johns Hopkins ➢ U Arizona 22 years rs of • U Maryland ➢ U California – Berkeley Expe perie rienc nce • U Massachusetts ➢ MIT • U North Carolina ➢ Stanford • North Carolina A&T • Purdue • U Texas - Dallas • Tufts • U Utah • U Washington • U Wisconsin SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 10

ERC Mission and Vision for ESH Performance 1. Research to develop science and Obstacles technology leading to simultaneous performance improvement, cost reduction, and ESH gain 2. Incorporating ESH principles in Upper Level Upper Level engineering and science Constraint Constraint education Cost ESH Impact 3. Promoting Design for Environment and Sustainability as a Technology Driver and not Sustainability Triangle a burden SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 11

Performance, Business CEBSM Sustainability School & Cost Convergence #3 A New Culture of Stewardship 1997

ITRS* Crises New Semiconductor Nanomaterials Potential Toxicity and Hazards Competitive Barriers e.g., PFOS in Photoresists 2001 * ITRS ≡ International Technology Roadmap for Semiconductors

Performance, Biologists and Sustainability, CEBSM Toxicologists Risk Assessment & Cost Convergence #4 Semiconductor, ESH, Business And Risk Assessment Communities, e.g., Carbon Nanotubes 2006

New ERC Thrust and Projects on Assessment of Toxicity of New Materials A major shift in the focus of the new ERC projects (2 nd decade of the ➢ program, after the end of NSF funding). ➢ Emphasis on: a) new metrology methods, and b) data analysis and overall ESH assessment. ➢ New PIs with new expertise, including Toxicology, Environmental Science, and theoretical anf predictive methods for modeling and analysis of large /complex data sets. ➢ The early PIs in this collaborative effort included: Alex Tropsha, Rocky Draper, Paul Westerhoff, Reyes Sierra, Jim Field, Scott Boitano. ➢ Currently the major focus area of the program (fully funded by industry) SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 15

More-than- Expanded CEBSM Moore Scope Convergent Applications to Benefit Society More-than-Moore, e.g., Cell-based Toxicity Assays 2011

The CEBSM Legacy Continues 1996 -

… the smallest sustainable SemiSynBio factory? Thank You What if? Ultra-micro-bacteria (~200 nm) Extracted from a glacial ice core sample, herr@src.org 120,000 years old Miteva (2005) 18

SRC/NSF Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Multidisciplinary Research on Environmental Aspects of Semiconductor Manufacturing SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 19

University-Industry Collaborative Research on the ESH Aspects of SC Manufacturing Other University members • Arizona State U • UCLA • U Colorado • Columbia • Cornell • Georgia Inst. of Tech. Founding Universities (1996) • Johns Hopkins ➢ U Arizona 22 years rs of • U Maryland ➢ U California – Berkeley Expe perie rienc nce • U Massachusetts ➢ MIT • U North Carolina ➢ Stanford • North Carolina A&T • Purdue • U Texas - Dallas • Tufts • U Utah • U Washington • U Wisconsin SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 20

ERC Mission and Vision for ESH Performance 1. Research to develop science and Obstacles technology leading to simultaneous performance improvement, cost reduction, and ESH gain 2. Incorporating ESH principles in Upper Level Upper Level engineering and science Constraint Constraint education Cost ESH Impact 3. Promoting Design for Environment and Sustainability as a Technology Driver and not Sustainability Triangle a burden SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 21

Examples of Research Results Greener Chemistries for Patterning: Deposition, Lithography, Etching, and Chamber Cleaning SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 22

Early ERC Projects on PFC Alternatives More exotic dielectric etch Unsaturated molecules PECVD chamber replacements for dielectric etch clean experiments (iodofluorocarbons) (UFC) (NF 3 and C 4 F 8 O) (1997 – 1999) (1999 – 2002) (1996 – 1998) Future generation processes Focus on identifying (Deep-submicron Drop-in dielectric potential alternative Decouple C and F low-k & ultra low-k) etch replacements chemistries (NF 3 /hydrocarbon) (2001 – 2003) (hydrofluorocarbons) (1996) (1999 – 2001) (1996 – 1998) 1996 1997 1998 1999 2000 2001 2002 2003 Post-CVD Chamber Clean Low-k Etch Silicon Oxide Etch Several novel chemistries, developed by ERC were adopted and used by industry MIT-Stanford- UC Berkeley SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 23 teams

Environmentally Friendly PAGs PFOS-Free alternatives 1 st & 2 nd 3 rd Generation Generation Natural molecules Linear Polar Hydrophilic Aromatic based Sugar based branch Nonpolar Biocompatible/ Hydrophobic Aliphatic “Sweet” PAG ring Biodegradable PAG By Ober SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 24

Computer-Aided Process Simulation Examples of Development and Application Water and Energy Use Reduction SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 25

Lowering Water Usage ➢ Surface preparation is the largest user of UPW ➢ Conventional processes are typically based on recipes that use large excess cleaning, with no on- line monitoring ➢ Critical need: Real-time and on-line monitoring for detection of cleaning end-point SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 26

Cleaning of Nano-Structures Convection/ Desorption Desorption Diffusion Convection Convection Mechanism Time Scale Flow Effect d 2 /D ~ 10 s Boundary Diffusion Indirect, mild Convection d/u ~ 1-3 s Direct, strong 1/k d ~ 0 - 10 5 s Desorption No effect Lowering water and energy usage Needs: Better metrology and process control By Helms- Shadman SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 27

Novel Electro-Chemical Residue Sensor (ECRS) KEY FEATURES: • Real Time • In-situ • Online • High Sensitivity • Non-destructive • Quick Response Solution (pH) UPW (pH=7) HCl(pH=6) HCl (pH=5) Resistivity (M Ω ) 18 2.3 0.23 (ppt) Resolution 5 30 400 By Shadman SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 28

Dynamics of Cleaning and Rinsing Processes Extent of Cleaning water Desorption Diffusion water Diffusion Convection wafer Dominant Operation Parameters: • Temperature wafer • Time • Water Purity Dominant • Additives Operation Parameters: • Flow • Mixing Time Purge Transition Final Surface Cleaning By Helms- Shadman SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 29

Novel Staged Rinsing Methods Post SC-1 Rinsing • Savings: • ~ 25% cold water • ~ 80% hot water By Zhao SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing 30