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CERN Open Hardware Licence 2.0 Andrew Katz www.moorcro0s.com A - PowerPoint PPT Presentation

CERN Open Hardware Licence 2.0 Andrew Katz www.moorcro0s.com A suite of licences designed for Open Hardware History March 2011: CERN OHL 1.0 July 2011: CERN OHL 1.1 September 2013: CERN OHL 1.2 2017: CERN OHL 2, beta 1


  1. CERN Open Hardware Licence 2.0 Andrew Katz www.moorcro0s.com

  2. A suite of licences designed for Open Hardware

  3. History • March 2011: CERN OHL 1.0 • July 2011: CERN OHL 1.1 • September 2013: CERN OHL 1.2 • 2017: CERN OHL 2, beta 1 • 2019 : CERN OHL 2, beta 2

  4. CopyleK for hardware Broad range: mechanical to electronic Create a hardware commons Easy to understand

  5. Specific Challenges • Scope of copyleK • CompaNbility with other licences • Fewer mature free and open-source toolchains for hardware than soKware (and parNcular problems with ASICs). • PracNcaliNes of working with FPGAs and ASICs

  6. Other issues addressed • Eliminate gendered Language • Simpler terminology • Borrowing terms (e.g. “Convey”) • Troll dissuasion (compliance first approach) • Contract, not a bare licence. • Strong, weak and permissive. • Now works for soKware

  7. SCOPE

  8. SCOPE If you Make a Product from Covered Source, you must make the Complete Source available to a recipient of the Product, either privately, or via a Source LocaNon and license it under the CERN OHL.

  9. Complete Source …includes design materials, code, interfacing informaNon etc. It does NOT include “Available Components” (for which you only have to provide specificaNons and interface informaNon).

  10. Complete Source …includes design materials, code, interfacing informaNon etc. It does NOT include “Available Components” (for which you only have to provide specificaNons and interface informaNon).

  11. Complete Source …includes design materials, code, interfacing informaNon etc. It does NOT include “Available Components” (for which you only have to provide specificaNons and interface informaNon).

  12. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  13. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  14. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  15. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  16. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  17. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  18. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  19. • Datacentre • Rack - network, power cabling • Enclosure/PSU • Circuit board • Component - resistor, capacitor, FPGA • Bitstream • Custom code, standard libraries, third party libraries

  20. “Available Component” • Itself available under CERN-OHL or compaNble licence; or • Available with the specificaNons, characterisNcs and interface informaNon necessary to Make the Product • Or is part of the normal distribuNon of the toolchain

  21. “Available Component” • Itself available under CERN-OHL or compaNble licence; or • Available with the specificaNons, characterisNcs and interface informaNon necessary to Make the Product • Or is part of the normal distribuNon of the toolchain

  22. “Available Component” • Itself available under CERN-OHL or compaNble licence; or • Available with the specificaNons, characterisNcs and interface informaNon necessary to Make the Product • Or is part of the normal distribuNon of the toolchain

  23. “Product” • May be a finished product, but may be •A Component, or • An intermediate form derived from the Complete Source, such as: • A bitstream • An object (.o) file

  24. “Product” • May be a finished product, but may be •A Component, or • An intermediate form derived from the Complete Source, such as: • A bitstream • An object (.o) file

  25. “Product” • May be a finished product, but may be •A Component, or • An intermediate form derived from the Complete Source, such as: • A bitstream • An object (.o) file

  26. “Product” • May be a finished product, but may be •A Component, or • An intermediate form derived from the Complete Source, such as: • A bitstream • An object (.o) file

  27. “Product” • May be a finished product, but may be •A Component, or • An intermediate form derived from the Complete Source, such as: • A bitstream • An object (.o) file

  28. Scope of copyleK: • Constrained upwards by “Product” • Constrained downwards by “Available Component”

  29. Difference between strong and weak • Weak: You can release a Product without releasing the code for all its components if you have all of the interfacing informaNon etc. for those components (like LGPL) • Strong: the excepNon above only applies to physical components (i.e you have to release the complete code for digital code: soKware, HDL files, etc). •Why physical only? •Physical components will generally have to be bought •Won’t have the design files to make those components from atoms

  30. Difference between strong and weak • Weak: You can release a Product without releasing the code for all its components if you have all of the interfacing informaNon etc. for those components (like LGPL) • Strong: the excepNon above only applies to physical components (i.e you have to release the complete code for digital code: soKware, HDL files, etc). •Why physical only? •Physical components will generally have to be bought •Won’t have the design files to make those components from atoms

  31. Difference between strong and weak • Weak: You can release a Product without releasing the code for all its components if you have all of the interfacing informaNon etc. for those components (like LGPL) • Strong: the excepNon above only applies to physical components (i.e you have to release the complete code for digital code: soKware, HDL files, etc). •Why physical only? •Physical components will generally have to be bought •Won’t have the design files to make those components from atoms

  32. Permissive version • Simpler than reciprocal versions, but with the same patent provisions. •Like Apache: NoNces must be preserved on transfer of the source.

  33. Where to next? • Licences, FAQ and commentary available on hhps:/ / www.ohwr.org/projects/cernohl/wiki/cern-ohl-v2-draK • We have been consulNng with FOSSi FoundaNon, SPDX and others • If you would like to comment, please contact me at andrew.katz@moorcroKs.com •Any QuesNons?

  34. Where to next? • Licences, FAQ and commentary available on hhps:/ / www.ohwr.org/projects/cernohl/wiki/cern-ohl-v2-draK • We have been consulNng with FOSSi FoundaNon, SPDX and others • If you would like to comment, please contact me at andrew.katz@moorcroKs.com •Any QuesNons?

  35. Where to next? • Licences, FAQ and commentary available on hhps:/ / www.ohwr.org/projects/cernohl/wiki/cern-ohl-v2-draK • We have been consulNng with FOSSi FoundaNon, SPDX and others • If you would like to comment, please contact me at andrew.katz@moorcroKs.com •Any QuesNons?

  36. Where to next? • Licences, FAQ and commentary available on hhps:/ / www.ohwr.org/projects/cernohl/wiki/cern-ohl-v2-draK • We have been consulNng with FOSSi FoundaNon, SPDX and others • If you would like to comment, please contact me at andrew.katz@moorcroKs.com •Any QuesNons?

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