[PDF] - C o n t e n t s T e c h n o l o g y D e f i n PDF Document

SLIDE 1

1

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

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t i e r R & D P r

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r a m , M O S T

2 3 . 1 . 1 4 ~ 1 5

Center for Nanoscale Mechatrinocs & Manufacturing(CNMM) http:// www.nanomecca.re.kr

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SLIDE 2

2

C e n t e r f

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N a n

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c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

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r a m , M O S T

T e c h n

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SLIDE 3

3

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SLIDE 4

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SLIDE 5

5

C e n t e r f

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c

s& Ma n u f a c t u r i n g ( C N MM)

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SLIDE 6

6

C e n t e r f

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N a n

s

c a l e Me c h a t r

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c

s& Ma n u f a c t u r i n g ( C N MM)

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SLIDE 7

7

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

A p p l i c a t i

n

s

B i

s

e n s

r

D a t a s t

r

a g e N a n

s

a t e l l i t e I n t e l l i g e n t ma c h i n e N a n

t

u r b i n e I n t e l l i g e n t a u t

mo

b i l e Me t e

r
l
g

i c a l

b

s e r v a t i

n

N a n

me

c h a t r

n

i c s & ma n u f a c t u r i n g

O p t i c a l p a r t s Wi r e l e s s c

mmu

n i c a t i

n

s

I I

F u e l c e l l

C T

Mo v i e D i s p l a y N a n

c

l

t

h C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

T e c h n

l
g

y r

a

d ma p

1 n m l e v e l 5 n m l e v e l 1 n m l e v e l

N a n

p

a t t e r n i n gp r

c

e s s P a r a l l e l p r

b

e p r

c

e s s

3 2 ×3 2 1 ×1

H i g h

p

r

d

u c t i v i t y

N a n

f

a b r i c a t i

ne

q u i p me n t n a n

p

a t t e r n i n g n a n

f

a b r i c a t i

n

N a n

s

t r u c t u r eme a s u r e me n t / a n a l y s i s / d e s i g n t e c h n

l
g

y

2 2 2 5 2 8 2 1 2

SLIDE 8

8

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T Nanopattern Nanopattern molding molding process technology process technology Organic Organic nanopatterning nanopatterning process technology process technology

Ma s t e r Mo l d P r e p

l

y me r S t a mp I n k s

l

u t i

n

B l

w

d r y P r i n t I n k p a d G

l

d s u b s t r a t e R e l e a s e E t c h S A M

U V

n

a n

i

mp r i n t l i t h

g

r a p h y

P r e s s i n g & U V e x p

s

u r e U V

c

u a b l e r e s i n

M i c r

c
n

t a c t p r i n t i n g

M

l

d S u b s t r a t e

N a n

mo

l d N a n

p

a r t

Electrical Contacts To Measuring System

Sample Reservoir

Buffer or Standard solution Filterin g Filterin g Filt erin g Dilution & Mixing Reactor O2 Pump Waste Reservoir Nano- electrode array Electrode With nano-pole Air bent Or Waste reservoir Nano-channel & nano IDA Optical Port

Sample inlet

N a n

i

mp r i n t l i t h

g

r a p h y

Multi Multi-

functional

functional nanoprinting nanoprinting Process technology Process technology Nano Nano-

bio process

bio process technology technology

APPLICATION

N a n

s

e n s

r

( b i

,

c h e mi c a l ) N a n

f

l u i d i c d e v i c e Mo l e c u l a r me mo r y N a n

p

l a s t i c e l e c t r

n

i c s

L a r g e a r e a

T

p
g

r a p h y f

r

p l a s ma

p

l a n a r i z e d s u r f a c e Tool Plasma for planarization

Plasma Plasma nanomachining nanomachining technology technology

M

l

d r e mo v e

N a n

p

a t t e r n i n gp r

c

e s s t e c h n

l
g

y

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

Nanobio Nanobio interface interface Process Technology Process Technology Nanoassembling Nanoassembling Process Technology Process Technology

Near-field lithography Dip-pen lithography Micro actuating Process

p ro b e δ V p ro b e δ V

System Process CNT Batch Process Blood Integrated bio analyzer µ-CP + LB Process Single cell manipulation system

S u b p h a s e E le c tro B a la n c e W ih e lm y P la te M o n o la y e r T r o u g h B a r rie r S u b p h a s e S u b p h a s e E le c tro B a la n c e W ih e lm y P la te M o n o la y e r T r o u g h B a r rie r S u b p h a s e E le c tro B a la n c e W ih e lm y P la te M o n o la y e r T r o u g h B a r rie r S u b p h a s e S u b p h a s e

APPLICATION

Nanolithography Nanocomputer Data storage Portable nanosample analyzer

Scanning Probe Lithography Scanning Probe Lithography Process Technology Process Technology Parallel Probe Parallel Probe Process Technology Process Technology

N a n

p

r

b

eA p p l i c a t i

n

T e c h n

l
g

y

SLIDE 9

9

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

Nano Nano Control Technology Control Technology Nano Nano Positioning Technology Positioning Technology

Si Substrate Au, Ag, Cu, GaAs Alkanethiolate PhotoResist Quartz/PDMS Nano-Imprinting x y z Initial template Substrate Macro translation in z α β Template stage Substrate stage (a) (b) Closing gap motion Final orientation configuration z z z z

I m p r i n t i n g H e a d S t a m p S t a m p A l i g n e r X Y

T

h e t a S t a g e R e f l e c t i n g M i r r

r

N a n

i

m p r i n t i n g E q u i p m e n t M

v

i n g p l a t f

r

m B a s e f r a m e N a n

a

c t u a t

r

F

r

c e s e n s

r

N a n

l

e v e l i n g & S t a g e S t a m p & S u b s t r a t e A l i g n m e n t

APPLICATION

Bearingless Micromotor Nanostep Inchworm Motor

O n e S h

t

/ S t e p

f

l a s h P r

c

e s s

(a) Bi-Sr-Ca-Cu-O 5 nm (b) β-Si3N4 1 nm 1 nm (d) dd-(Ta,V)1.6Te (c) tremolite (Ca2Mg5Si8O22(OH)2) O b j e c t i v e l e n s a p e r t u r e I n c i d e n t e l e c t r

n

S p e c i m e n O b j e c t i v e l e n s I m a g e P l a n e I n t e r m e d i a t e l e n s 1 nm 5 nm

P

t

e n t i a l P a t t e r n s

Second chamber Aperture for checking of focus depth Unit of electronic-motor Stage for wafer Slice handle Patterning lens Objective lens Aperture Specimen cartridge Cartridge align knob – 4ea Open X Y Z Nano-rotator PZT Actuator Nano-Actuator Laser Detector Nano-actuator

x y z

PZS

Interferometer Laser Bimorph Diaphragm

6

a

x e s N a n

m

a n i p u l a t

r

T e c h n

l
g

y 6

a

x e s N a n

m

a n i p u l a t

r

T e c h n

l
g

y N a n

e

n d e f f e c t

r

T e c h n

l
g

y N a n

r

i e n t e d c

n

t r

l

& T e l e

p

e r a t i

n

T e c h n

l
g

y

Hybrid Patterned Stamps Optical Waveguide

S e r i a l P r

c

e s s i n g U n i t

Nano Nano Patterning Equipment Patterning Equipment Technology Technology Large Large-

area Serial

area Serial-

processing

processing Unit Technology Unit Technology

N a n

p

r

c

e s sE q u i p me n t T e c h n

l
g

y

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

APPLICATION

Nanoscale Material Properties Mechanical

E-modulus, yield strength.
Nanotribology
DB of material properties

Electromagnetic

Electric conductivity
Average free path
Conduction mechanism

Optical

Phase change
Thickness and reflectivity
Non-contacting 3-D shape

Defects and reliabilities

Crystallization analysis
Local structure
Damage mechanism

“ “Atom Atom-

To

To-

Structure

Structure” ”

QUANTUM: Ab Initio or TB ATOMISTIC: ATOMISTIC: MD or MC MD or MC MESOSCALE: Field-based Models

r Discrete

Dislocation Dyn. CONTINUUM: FEM, FDM, Meshfree A bI n i t i

M

D T B M D H y b r i d Q M / M D A bI n i t i

M

D T B M D H y b r i d Q M / M D D D D / M D C

u

p l i n g H y b r i d M D / F E Q C m e t h

d

D D D / M D C

u

p l i n g H y b r i d M D / F E Q C m e t h

d

D D D + F E M C

n

f i g u r a t i

n

a l F

r

c e P h a s e F i e l d M

d

e l D D D + F E M C

n

f i g u r a t i

n

a l F

r

c e P h a s e F i e l d M

d

e l M e c h a n i c a l / T h e r m a l / E l e c t r

m

a g n e t i c / O p t i c a l b e h a v i

r

N a n

p

a t t e r n i n g / N a n

p

r

b

eA p p l i c a t i

n

/ N a n

p

r

c

e s sE q u i p me n t

Property measurement & DB

Property measurement & DB

Testing method & in

Testing method & in-

situ measurement

situ measurement

Process design improvement

Process design improvement

Reliability evaluation

Reliability evaluation

Multi

Multi-

scale/multi

scale/multi-

physics analysis

physics analysis

Nanoprocess

Nanoprocess design Improvement design Improvement

Simulation of process condition

Simulation of process condition

Prediction of structural behavior

Prediction of structural behavior

A n a l y s i s t

l

M a t e r i a l D B

M e a s u r e me n t a n d e v a l u a t i

n
f

M e a s u r e me n t a n d e v a l u a t i

n
f

n a n

s

c a l e n a n

s

c a l ep r

p

e r t i e s p r

p

e r t i e s M u l t i M u l t i

s

c a l e / mu l t i s c a l e / mu l t i

p

h y s i c s a n a l y s i s a n d d e s i g n p h y s i c s a n a l y s i s a n d d e s i g n

N a n

p

r

b

eA p p l i c a t i

n

N a n

p

r i n t i n g

E l e me n t a r y T e c h n

l
g

y f

r

N a n

s

c a l e P r

c

e s s

Nanoscale Measurement and Nanoscale Measurement and Evaluation Technology Evaluation Technology Nanoscale Analysis and Design Nanoscale Analysis and Design Technology Technology

SLIDE 10

1

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

R & D s c h e me

2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 2 1 2 1 1

1 n m l e v e l n a n

p

a t t e r n i n g 5 n m l e v e l n a n

p

a t t e r n i n g 1 n m l e v e l n a n

p

a t t e r n i n g 2 n m l e v e l 3 2 x 3 2 p a r a l l e l n a n

p

r

b

ep r

c

e s s 2 n m l e v e l 1 x 1 p a r a l l e l n a n

p

r

b

ep r

c

e s s H i g h p r

d

u c t i v i t y

f

p r

b

e p r

c

e s s a n d a p p l i c a t i

n

t e c h n

l
g

y 1 n m l e v e l N a n

f

a b r i c a t i

n

e q u i p m e n t 5 n m l e v e l h y b r i d N a n

f

a b r i c a t i

n

e q u i p m e n t 1 n m l e v e l 3 D h y b r i d N a n

f

a b r i c a t i

ne

q u i p m e n t 1 n m l e v e l n a n

s

t r u c t u r e m e a s u r e m e n t a n d a n a l y s i s 5 n m l e v e l n a n

s

t r u c t u r e m e a s u r e m e n t a n d a n a l y s i s 1 n m l e v e l n a n

s

t r u c t u r e M e a s u r e m e n t / a n a l y s i s / d e s i g n

F u n d a m e n t a l s a n d I n f r a s t r u c t u r e s A p p l i c a t i

n

s C

m

m e r c i a l i z a t i

n

P h a s e 1 ( 3 y r . ) 2 2 ~ 2 4 P h a s e 2 ( 3 y r ) 2 5 ~ 2 7 P h a s e 3 ( 4 y r . ) 2 8 ~ 2 1 1

N a n

p

a t t e r n i n g N a n

p

r

b

e N a n

e

q u i p m e n t E l e m e n t a r y t e c h n

l
g

y

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

Ma j

r

R & D P r

j

e c t s f

r

t h e 1

s tp

h a s e

N a n

p

r

c

e s s e q u i p me n t t e c h n

l
g

y N a n

p

a t t e r n i n g p r

c

e s s t e c h n

l
g

y

D

e v e l

p

me n t

f

t h e n a n

p

a t t e r n i n g e q u i p me n t t e c h n

l
g

y

N

a n

d

r i v e a n d c

n

t r

l

t e c h n

l
g

y

D

e v e l

p

me n t

f

n a n

p

r

b

e p r

c

e s s

N

a n

c
mp
n

e n t a s s e mb l y a n d p a r a l l e l p r

b

e t e c h n

l
g

y

N

a n

i

n t e r f a c e p r

c

e s s t e c h n

l
g

y

Mu

l t i

f

u n c t i

n

a l n a n

p

r i n t i n g p r

c

e s s t e c h n

l
g

y

P

l a s ma n a n

ma

c h i n i n g p r

c

e s s

D

e v e l

p

me n t

f
r

g a n i c t h i n f i l ms

D

e v e l

p

me n t

f

p r

c

e s s t e c h n i q u e f

r

me d i c a l n a n

s

c a l e b l

d

a n a l y s i s s y s t e m

R

e p l i c a t i

n

p r

c

e s s t e c h n

l
g

y

f

n a n

p

a t t e r n s

A

n a l y s i s s i mu l a t i

n

t e c h n

l
g

y f

r

n a n

ma

n u f a c t u r i n g p r

c

e s s

T

h e me a s u r e me n t a n d e v a l u a t i

n

t e c h n

l
g

y

f

n a n

s

c a l e ma t e r i a l s p r

p

e r t i e s f

r

n a n

p

r

c

e s s

N a n

p

r

c

e s s e l e me n t a r y t e c h n

l
g

y N a n

p

r

b

e a p p l i c a t i

n

t e c h n

l
g

y

SLIDE 11

1 1

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

R & D R e s u l t s f

r

t h e 1

s ty

e a r

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

N a n

p

a t t e r n i n gp r

c

e s s t e c h n

l
g

y

E

b

e a m l i t h

g

r a p h y

Wi d t h : 1 5 7 n m, P i t c h : 5 n m

H

l
g

r a p h i c l i t h

g

r a p h y

D i a . : 2 7 n m, P i t c h : 5 n m

N a n

e

l e c t r

f
r

m i n g

D i a . : 1 n m, P i t c h : 2 5 n m

400nm level Disc

U V l a s e r ( L B R )

L i n e w i d t h : 3 7 7 n m 464.8㎚

M a s t e r / S t a m p e r f a b r i c a t i

n

SLIDE 12

1 2

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

N a n

p

a t t e r n i n gp r

c

e s s t e c h n

l
g

y R e s u l t s

f

P a t t e r n T r a n s f e r

E l e me n t

w

i s e d s t a mp

1 . U V I m p r i n t i n g

N a n

i

mp r i n t e q u i p me n t ( E V G 6 2

N

I L / µC P ) S i w a f e r T S R 8 2 U V C u r a b l e p

l

y me r

2 . G r a t i n g p a t t e r n t r a n s f e r b y T h e r m a l i m p r i n t i n g

2 n m g r a t i n g p a t t e r n

n

mr i

8

2 p

l

y me r

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

N a n

p

a t t e r n i n gp r

c

e s s t e c h n

l
g

y

M a s t e r P a t t e r n L i n e s t r a i g h t n e s s : ±2 ㎛ C i r c l e : 5 ㎛ L i n e w i d t h : ≤1 ㎛ D e p t h : . 5 ㎛ ~ 5 ㎛ P r i n t e d l i n e

3 . C

n

t a c t P r i n t i n g 4 . T h i n F i l m P r i n t i n g

C
a

t i n g

f

A u

n

C r

c
a

t e d S i w a f e r

P

r i n t i n g p r

c

e s s u s i n g P D MS s t a mp

A

c h i e v e 4 n m n a n

p

a t t e r n sa f t e r A u e t c h i n g

5 . N a n

m
l

d i n g

N a n

mo

l d i n gma c h i n e H

l

e p a t t e r n ( 2 n m d i a . ) P i l a r p a t t e r n ( 1 n m d i a . )

O

f f

s

e t p r i n t i n g

f

P R

n

C u s u b s t r a t e

R e s u l t s

f

P a t t e r n T r a n s f e r

SLIDE 13

1 3

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

N a n

p

a t t e r n i n gp r

c

e s s t e c h n

l
g

y A p p l i c a t i

n

T e c h n

l
g

y D e v e l

p

m e n t

P h

t
n

i c c r y s t a l w a v e g u i d e a r r a y

λ1λ2λ3 ……λΝ λ1λ3λ4 ……λΝ λ2

S i n g l e

m
d

e w a v e l e n g t h

U n p

l

a r i z e dL i g h t S

p
l

a r i z e d L i g h t P

p
l

a r i z e d L i g h t

S u b w a v e l e n g t hg r a t i n g p

l

a r i z e r Wa v e l e n g t h f i l t e r

O p t i c a l d e v i c e s

Quartz stamp for single-mode waveguide

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

N a n

p

a t t e r n i n gp r

c

e s s t e c h n

l
g

y

P a t t e r n e d Me d i a

R e f . I B M

H i g h d e n s i t y

p

t i c a l d a t a s t

r

a g e d e v i c e

Charged TFT Plate

Charged ball spacer Voltage supply Unit Nozzle

D a t a s t

r

a g e B i

s

e n s

r

D i s p l a y d e v i c e

N a n

t

h i c k e n z y m e e l e c t r

d

e N a n

p
r
u

s e l e c t r

d

e N a n

p
r
u

s b i

s

e n s

r

t e s t

d

e v i c e

Cell detector velocimeter Chip-integrated micropump Cultured Cells & medium

Quick Push

Cell waste or Temperary reservoir for other consecutive processes Functional polymer pad for adsorption & desorption of cells Cell-trap chamber

Flow-blocker Waste

C e l l m a n i p l u a t i

n

c h i p

SLIDE 14

1 4

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

N a n

p

r

b

eA p p l i c a t i

n

T e c h n

l
g

y

Thin Chrome Film Patterning Thin Chrome Film Patterning

n Au substrate
n Au substrate

(using NSOM Probe Coupled (using NSOM Probe Coupled Femtosecond Femtosecond Laser) Laser) 8 n m Selective Resist Removal by Light Source SAM Removal by Chemical Etching Nano Pattern by Metal Etching

Substrate Metal Substrate Metal Laser SAM SAM Substrate Metal SAM Metal

N S O M l i t h

g

r a p h y

P a t t e r n e d l i n e Topographical Image

f line pattern

P r

b

e

a

p p l i e d p a t t e r n i n g ( P r e l i m i n a r y s t u d y ) N S O M a p p r

a

c h M e c h a n

c

h e m i c a l a p p r

a

c h E l e c t r

c

h e m i c a l a p p r

a

c h D P N a p p r

a

c h

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

H D T P a t t e r n T i p I C

n

d i t i

n

: R H = 5 5 % , T = 2 2 °C T i p S c a n : 1 2 m m / s , 4 t i m e s A u w i r e A u d i a m e t e r = 5 n m T i m e = 6 h 1 µm

5 n m

A u l i n e f a b r i c a t e d t h r

u

g h H D T m

l

e c u l a r p a t t e r n s

Etching Etching (Top-Down) Self assembly (Bottom-Up)

I n t r

d

u c t i

n
f

D P N

N a n

p

r

b

eA p p l i c a t i

n

T e c h n

l
g

y

N S O M a p p r

a

c h M e c h a n

c

h e m i c a l a p p r

a

c h E l e c t r

c

h e m i c a l a p p r

a

c h D P N a p p r

a

c h P r

b

e

a

p p l i e d p a t t e r n i n g ( P r e l i m i n a r y s t u d y )

SLIDE 15

1 5

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T M e c h a n

c

h e m i c a l a p p r

a

c j h P a t t e r n s

n

F D T S / S i ( P a t t e r n w i d t h ~ 3 n m ) P a t t e r n s

n

S S 3 4 i n H

2

S O

4

( P a t t e r n w i d t h ~ 3 n m ) P u l s e = 1 µs , V

l

t a g e = 3 . 5 V

N a n

p

r

b

eA p p l i c a t i

n

T e c h n

l
g

y

N S O M a p p r

a

c h M e c h a n

c

h e m i c a l a p p r

a

c h E l e c t r

c

h e m i c a l a p p r

a

c h D P N a p p r

a

c h P r

b

e

a

p p l i e d p a t t e r n i n g ( P r e l i m i n a r y s t u d y )

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T F a b r i c a t i

n
f

u n i t p r

b

e ( P Z T + P R s e n s

r

c

n

t a i n e d )

P Z TM i c r

a

c t u a t

r

P R s e n s

r

T i p

H

r

i z

n

t a l a s s e mb l y

f

C N T

D

i e l e c t r

p

h

r

e s i s C N T

n

A F M t i p

A

C

n

l y 5 M H z , 7 V

l

t s

D e s i g n

f

p r

b

e a r r a y C N T a s s e m b l y

C N T

n

A F M t i p

A

C + D C , 1 M H z

N a n

p

r

b

eA p p l i c a t i

n

T e c h n

l
g

y – S P L s y s t e m

SLIDE 16

1 6

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

N a n

p

r

c

e s sE q u i p me n t T e c h n

l
g

y

M e c h a n i s m d e v e l

p

m e n t f

r

U V n a n

i

m p r i n t E q u i p m e n t e l e m e n t a r y t e c h n

l
g

y

N a n

s

t a g e N a n

L

e v e l i n g U n i t N a n

p
s

i t i

n

g V i b r a t i

n

i n s u l a t i

n

( I n p l a n e / v e r t i c a l : 1 ~ 1 . 5 H z ) S

f

t P r e s s i n g I m p r i n t i n g H e a d

1

s tV

.

f

N a n

p

a t t e r n i n g E q u i p m e n t C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

G e n e r a l c

mme

n t s f

r

t h e 1

s ty

e a r ’s R & D r e s u l t s

P a p e r s : 1 2 4 P a t e n t s : 2 2 E n s u r e

f

p

s

s i b i l i t y f

r

R & D s u c c e s s e s i n t h e f i e l d

f

n a n

f

a b r i c a t i

n

e q u i p m e n t N a n

p

r

c

e s sm e a s u r e m e n t i s e x p e c t e d t

b

e a v i a b l e t e c h n

l
g

y i n v i e w

f

c

m

m e r c i a l i z a t i

n

R & D f

r

f u s i

n

t e c h n

l
g

y ( N B T , N I T ) i s p e r f

r

m e d , w h i c h s u g g e s t s n e w c h a l l e n g i n g a r e a s f

r

n a n

m

e c h a t r

n

i c s t e c h n

l
g

y E n s u r e

f

p

t

e n t i a l s i g n i f i c a n c e f

r

n a n

m

e c h a t r

n

i c s t e c h n

l
g

y i n v a r i

u

s a p p l i c a t i

n

s

SLIDE 17

1 7

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

C l

s

i n g R e m a r k s

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

S t r a t e g y f

r

R & D T h r u s t i n C N MM

O r g a n i z e c

l

l a b

r

a t i

n

s y s t e m a m

n

g i n d u s t r i e s , u n i v e r s i t i e s , a n d r e s e a r c h i n s t i t u t e s P r

m
t

e I n t e r n a t i

n

a l c

p

e r a t i

n

a n d c

l

l a b

r

a t i

n

s E m p h a s i z e c

n

d u c t i n g s e l f

m
t

i v a t e d , i n t e r e s t e d , a n d v a l u a b l e r e s e a r c h e s M u l t i

d

i s c i p l i n a r y n e t w

r

k s

E

n c

u

r a g e c r e a t i v e a n d i n n

v

a t i v e i d e a s

f

a l l r e s e a r c h e r s C

n

s t r u c t e f f e c t i v e c

m

m u n i c a t i n g s y s t e m sb e t w e e n r e s e a r c h t e a m s

n

a b a s i s

f

r e l i a b i l i t y a n d c

p

e r a t i

n

M a x i m i z e r e s e a r c h

u

t p u t s t h r

u

g h a d a p t i v e m a n a g e m e n t s y s t e m

SLIDE 18

1 8

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

T h r u s t s f

r

I n t e r n a t i

n

a l C

l

l a b

r

a t i

n

P r

j

e c t s

U

. C . B e r k e l e y , U S A

P

u r d u e U n i v . , U S A

M

I T , U S A

S

t a n f

r

d U n i v . , U S A

N

a t i

n

a l A c a d e m y

f

S c i e n c e

f

B e l a r u s , B E R A L U S

O n g

i

n g S t r a t e g i c I n t e r n a t i

n

a l C

l

l a b

r

a t i

n

f

r

C N M M

N
r

t h e a s t e r n U n i v . , U S A

P

u r d u e , U S A

T h e 1

s tI

n t e r n a t i

n

a l N a n

m

e c h a t r

n

i c s S y m p

s

i u m

T
b

e h e l d i n F e b . 5 ~ 6 , 2 4 a t H

a

m C

n

v e n t i

n

H a l l , S N U

I

n t e r n a t i

n

a l E x p e r t s ( f r

m

U S A , J a p a n , E U ) i n v i t e d

I n t e r n a t i

n

a l C

l

l a b

r

a t i

n

& E x c h a n g e A c t i v i t i e s

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

T h a n k s !

SLIDE 19

1 9

C e n t e r f

r

N a n

s

c a l e Me c h a t r

n
c

s& Ma n u f a c t u r i n g ( C N MM)

2 1 C F r

n

t i e r R & D P r

g

r a m , M O S T

A c k n

w

l e d g e m e n t s ;

M

i n .

f

S c i . & T e c h . , K O R E A 2 1 C F r

n

t i e r R & D P r

g

r a m h t t p : / / w w w . n a n

m