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MPI Project Review
BepiColombo-a planetary mission to Mercury
Focal plane instrumentation for the MIXS instrument Ringberg, 24.4.2007
Mercury as seen on 16.9.2004
BepiColombo-a planetary mission to Mercury Focal plane - - PowerPoint PPT Presentation
MPI Project Review BepiColombo-a planetary mission to Mercury Focal plane instrumentation for the MIXS instrument Ringberg, 24.4.2007 Mercury as seen on 16.9.2004 1 Johannes Treis MPI Halbleiterlabor Institutions 2 Johannes Treis MPI
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Mercury as seen on 16.9.2004
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Ziggurat of Ur
Babylonian record
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Statue of Mercury by Giambologna (16th century, Florence)
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Mercury in the staircase fresco by Gianbattista Tiepolo at the Wuerzburg residence (18th century).
Engl.: Merchant Commerce Mercury (Hg) Mercenary Wednesday
French: Merci Mercredi
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Transit of Mercury, 7.5.2003
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Mariner 10
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Sun (to scale) Mercury Venus Earth Radii to scale
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Origin and evolution of a planet close to the parent star Mercury as a planet: form, interior, structure, geology, composition and craters Detect traces of Mercury's vestigial atmosphere (exosphere): composition and dynamics Mercury's magnetized envelope (magnetosphere): structure and dynamics Origin of Mercury's magnetic field Test of Einstein's theory of general relativity
Mercury surface as seem by Mariner 10
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zum Selberbasteln...
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MIXS-C FPA MIXS-T FPA
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Prototype
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FRONT END ELECTRONICS FPA MAIN ASSEMBLY
Baffle Thermal strap Front bracket Sensor assembly
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MOUNTING FRAME THERMAL STRAP THERMAL STRAP SUPPORT CERAMICS SUPPORT BARS SENSOR ADAPTER SENSOR COOLING BLOCK
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6.40 keV 7.06 keV Fe K 2.31 keV 2.47 keV S K 5.90 keV 6.49 keV Mn K 2.02 keV 2.14 keV P K 5.41 keV 5.95 keV Cr K 1.74 keV 1.84 keV Si K 4.95 keV 5.43 keV V K 1.49 keV 1.55 keV Al K 4.51 keV 4.93 keV Ti K 1.25 keV 1.30 keV Mg K 3.69 keV 4.01 keV Ca K 1.04 keV 1.07 keV Na K 3.31 keV 3.59 keV K K 0.71 keV Fe L
Mercury key element emission lines
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Depends on annealing scenario
Operation temperature
Detector plus FEs
≤ 2.5 W Power consumption
Depends on temperature
20 krad 3 x 1010 p/cm2 Radiation hardness
Depends on FE speed
128 μs (192 μs) Time resolution
O.K.
≥ 80 % @ 500 eV QE
Depends on temperature
≤ 200 eV FWHM @ 1 keV Energy resolution
O.K.
300 x 300 mm2 Pixel size
O.K.
64 x 64 pixels Array dimension
O.K.
1.92 x 1.92 cm2 sensitive area Format
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RB in P+ -driftring implants Polysilicon separators R1 in V_inner_substrate „readout node“
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N-type high resistive bulk (common) Radiation entrance window (common) Ultra-thin p+ Pixel matrix
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200 400 600 800 1000
Energy resolution @ 1 keV (eV)
Operating temperature (deg. C) Pixel size (μm)
60.00 80.00 100.0 120.0 140.0 160.0 180.0 200.0 220.0 240.0 260.0 280.0 300.0
White Line: 200 eV
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200 400 600 800 1000
White Line: 200 eV
Operating temperature (deg. C) Pixel size (μm)
60.00 80.00 100.0 120.0 140.0 160.0 180.0 200.0 220.0 240.0 260.0 280.0 300.0
Energy resolution @ 1 keV (eV)
20
200 400 600 800 1000
Operating temperature (deg. C) Pixel size (μm)
60.00 80.00 100.0 120.0 140.0 160.0 180.0 200.0 220.0 240.0 260.0 280.0 300.0
Energy resolution @ 1 keV (eV) White Line: 200 eV
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100 150 200 250 300 350
White line: 200 eV requirement
Energy resolution FWHM @ 1 keV
Temperature (°C) Integration time (μs)
60 100 140 180 220 260 300
100 150 200 250 300 350
Temperature (°C) Integration time (μs)
60 100 140 180 220 260 300
Energy resolution FWHM @ 1 keV
White line: 200 eV requirement
4 μs / row 6 μs / row 4 μs / row 6 μs / row
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Calculations provided by J. Carpenter University of Leicester