ADVANCED SMT Partial Equipment List Description Ekra X4 (2) - - PowerPoint PPT Presentation

ISI Manufacturing Equipment

Partial Equipment List Description Ekra X4 (2) Precision stencil printers w/ 2.5D paste inspection Samsung SM421 (2) SMT placement machine, capable of placing 01005 passives and 55mm body size, 0.4mm pitch BGAs. 30 µm placement accuracy at Cpk 1.0 Fuji NXT-II 4M Modular SMT chipshooter, 45,000 component placements/hour, 30 µm placement accuracy Fuji QP-351E-MM High speed pick & place Fuji CP732 Chip shooter, up to 52K components per hour Heller 1800EXL & 1809W 10-zone & 8-zone convection reflow ovens Aqueous Trident Duo Two-chambered automatic de-fluxing and residue cleaning system with integrated cleanliness testing Asymtek Underfill and epoxy dispensing systems Novastar Wave soldering system Aqueous SW-ECO Ultrasonic stencil cleaning system Pace TF2000 BGA/CSP rework station Totech Dry storage cabinet Accutape QMT 1100D Tape and reel placement machine

ADVANCED SMT ASSEMBLY CAPABILITIES

ISI Manufacturing Equipment

Partial Equipment List Description Clean Room Class 10,000 with on-demand Class 1,000 capabilities Datacon 2200EVO Twin-head, multi-chip, die bonder / flip-chip placement

• system. Two machines in one:

A separate dispensing area with integrated dispenser and a bonding area for die attach and flip chip. 7,000 UPH with 10µm accuracy at 3σ Die size 0.17mm to 50mm. 300mm wafer handler. H&K Wedgebonder BJ815 Gold and aluminum wedge, area array, and deep reach

• bonder. 40µm pitch, 3µm positioning at 3σ

12.3” x 7” work area. Extremely short 75µm loops Kulicke & Soffa 8028PPS Gold-ball wire bonder, 45 µm in-line pitch; 25 µm interstitial Kulicke & Soffa 1484XQ Turbo Three automated gold-ball wire bonders Sikama Falcon 1200 Conduction /convection reflow oven Kulicke & Soffa Model 980 Precision 8-inch wafer dicing system Fico B100 Automated transfer overmold / underfill machine Fico MMS-12-M Large-area transfer overmold / underfill machine Advanced Plasma Systems B-6 Plasma cleaning system YES Technologies Plasma cleaning system

BARE DIE PACKAGING CAPABILITIES

ISI Manufacturing Equipment

Partial Equipment List Description ESI QSM (2) high-speed, four-spindle, precision drilling machines Dynamotion PMC-550 Six-spindle, high speed drilling machine Excellon Uniline 2000 Single-spindle, high-speed driller/router Precision PCB 101CM (2) precision routers Excellon 105DP (2) precision routers ISI (7) automated contact insertion machines Schmidt Technology (2) 40-ton presses Grieve (4) high-temperature ovens Fico B100 Automated transfer molding machine Fico MMS-12-M Large-area transfer molding machine Aurburg (10) 40-ton molding machines Autojector (4) 40-ton, horizontal injection, rotary-table molding machines Bruderer (2) 30-ton, 3-post, stamping presses Adapt (4) semi-automatic pin loaders Fully-equipped machine shop (3) Mitsubishi precision wire EDMs (FA10 advanced & FX10) Mitsubishi ED2000-M drill (hole popper), HAAS VF-0 CNC vertical mill, Chevalier FSG 818S automatic surface grinder, (3) Bridgeport vertical milling machines, (5) 6” X 18” surface grinders, and a 12” X 40” lathe

CONNECTOR MANUFACTURING CAPABILITIES

ISI Manufacturing Equipment

Partial Equipment List Description Nikon VMR 3020 Four automated laser and optical inspection systems Scienscope X-Scope 1800 X-ray inspection system, 70º tilt, five micron focal spot Nikon Profile Projector V12 2D contour measurement system RVSI LS-6000 IC package automated optical inspection system Fisherscope XDAL X-ray spectrometer Niton XRF X-ray fluorescence analyzer XYZTEC Condor 70-3 Multifunction bond pull / bond shear / ball shear tester SCS Instruments Ionic contamination testing instrument SMT Tools BGA-100 BGA optical inspection scope Espec TSE-11-A Two-zone environmental chamber, -65 to 200ºC Agilent Infinium DCA-J Three wideband oscilloscope mainframes with TDR modules Agilent E5071B 8.5 GHz network analyzer Corelis JTAG boundary scan system & software JTAG Technologies JTAG boundary scan system & software Trotec Laser Laser marking system A comprehensive range of electronics test equipment Precision oscilloscopes, function generators, source meters, and power supplies.

INSPECTION, TEST & MARKING CAPABILITIES