Advacam Advacam semiconductor semiconductor company company pr - - PowerPoint PPT Presentation

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Advacam Oy | Company presentation | Espoo, Finland 18/08/17 1

Advacam Advacam semiconductor semiconductor company company pr presentat esentation ion

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• Advacam is one-stop shop for pixel sensor assemblies
• Office in Micronova building www.micronova.fi
• Access to all process tools in VTT’s clean room
• Expertise in fabrication of the state-of-the-art silicon sensors and in

flip chip technology

• Planar and edgeless Si sensors
• Wafer-level solder micro-bumping
• Single and multi-chip flip chip bonding (Si, GaAs & Cd(Zn)Te)
• Short delivery time and guarantee of quality is given for the services
• Advacam Oy employees 8 people full time
• Visit www.advacam.com

Edgeless Si sensor modules

Advacam Advacam Oy Oy

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Service concept Service concept

• Commercialization of long term research done by VTT
• Advacam Oy founded by former VTT researchers
• PhD Juha Kalliopuska (CEO)
• M.Sc. Sami Vähänen (CTO)
• Unique radiation pixel detector fabrication + flip chip

service

• Full value chain covered within the same company
• From prototyping to production
• We are the “garage” of very challenging fabrication

services within radiation pixel detectors

• Utilization of complete sensor fabrication and flip chip

lines

• Looking for regular production work with emphasis in

gathering more statistics of the process steps, for maintaining quality and investing in new equipment

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150 mm baseline Par5al 200 mm compa5bility

Cleanroom 2611 m2

• class 10

550 m2

• class 100-1000

875 m2 Other lab areas 2619 m2 Office space 8038 m2

Facility - Facility - Micronova Micronova

• Micronova is Finland's National Research Infrastructure for micro- and

nanotechnology, jointly run by VTT Technical Research Centre of Finland and Aalto University

• Great variety of tools for thin film processing
• Renting of equipment time – no capital cost

Advacam Oy | Company presentation | Espoo, Finland 18/08/17 4

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Planar sensors Planar sensors

• Advacam has experience in manufacturing customized pixel sensor
• n 6” (8” R&D) wafers ranging from thickness of 300um to 1mm.

Advacam Oy | Company presentation | Espoo, Finland 18/08/17 5

500 μm planar pixel sensor

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Edgeless and special sensors Edgeless and special sensors

• Advacam has experience in manufacturing edgeless and ultra thin

sensor 6” wafers ranging from thickness of 5um to 675um.

Advacam Oy | Company presentation | Espoo, Finland 18/08/17 6

300 μm edgeless pixel sensor

Sensi've volume up to silicon edge

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Micr Micro-packaging of hybrid modules

• -packaging of hybrid modules

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Advacam’s Advacam’s Bumping Bumping Toolbox Toolbox

• Typical bumps are

Typical bumps are:

• ~20 μm high
• Placed with 50 μm – 110 μm

pitch (can be larger)

• Available solder alloys:

Available solder alloys:

• Eutectic SnPb
• Cu-pillar (CuSn / CuSnPb)
• InSn (melting point ~ 120 °C)
• Thin film UBM pads:

Thin film UBM pads:

• Different metal stacks available
• Under development:

Under development:

• Bumping with finer pitches

(18μm – 35μm)

Advacam Oy | Company presentation | Espoo, Finland 18/08/17 8

SnPb bumps on edgeless sensor Cu pillars Thin film UBM pads

• n edgeless sensor

InSn bumps on ASIC wafers Plated UBM with a solder cap 25 μm pitch solder bumps

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Capacity Capacity

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Manufacturing capacity Manufacturing capacity

• Sensor production:
• Current production: ~200 wafer per year
• Full capacity: 5,000 wafers per year
• Wafer solder bumping:
• Current production: 50-100 wafers per year
• With the current electroplating tools it is possible to process

up to 500 wafers per year

• Flip chip bonding:
• Current production: 1,500 flip chip placements per year
• With the current bonding tools it is possible to make up to

10,000 flip chip bonding placements per year

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Quality Quality

SLIDE 12 A B C D E F G H I J K L M 11 F F F F 0.00 E A A A 0.25 B B B B 1.00 F F F F 0.00 E A A A 0.41 10 A A A A 1.00 B B B B 0.99 B B B B 0.99 B B B B 1.00 E A F F 0.44 A A A A 1.00 A A A A 1.00 B B C B 1.00 F F F F 0.00 9 E A A A 0.00 A A A A 1.00 A A A A 1.00 A A A A 1.00 A A A A 1.00 A A A A 0.99 F F F F 0.00 F F F F 0.00 B B B B 1.00 B B B B 1.00 F F F F 0.00 8 A A A A 1.00 B B B B 1.00 A A A A 1.00 A A A A 1.00 A A A A 0.99 A A A A 1.00 A A A A 1.00 B B B B 1.00 B B B B 1.00 A A A A 1.00 B B B B 1.00 7 F F F F 0.00 F F F F 0.00 A A A A 1.00 C C C C 0.99 F F F F 0.00 F F F F 0.00 D D D D 0.95 F F F F 0.00 B B B B 0.74 A A A A 1.00 D D D D 0.99 E D F F 0.00 E B B B 0.00 6 F F F F 0.00 F F F F 0.00 A A A A 1.00 C C C C 1.00 A A A A 0.99 B A A A 0.99 A A B A 0.99 A A B B 1.00 F F F F 0.00 B B B B 1.00 B B B B 1.00 A A A A 1.00 F F F F 0.00 5 A A A A 1.00 F F F F 0.00 A A A A 0.99 A A A A 1.00 A A A A 1.00 A A A A 0.99 F F F F 0.00 A A A A 1.00 B B C C 0.99 F F F F 0.00 A A A A 1.00 A A B B 1.00 E D F F 0.00 4 B B B B 1.00 A A A A 1.00 B B B B 0.99 F F F F 0.00 A A A A 1.00 F F F F 0.00 A A A A 0.99 A A A A 1.00 B B B B 1.00 A A A A 1.00 F F F F 0.00 3 F F F F 0.00 A A B B 1.00 A A C B 0.97 A A A A 0.99 F F F F 0.00 C C C C 1.00 B B B B 0.94 A A A A 0.99 A A A A 1.00 A A A A 1.00 F F F F 0.00 2 F F F F 0.00 A A A A 1.00 A A A A 1.00 B B B B 1.00 B B C C 1.00 B B B B 1.00 A A A A 0.99 A A A A 1.00 F F F F 0.00 1 A A A A 1.00 A A A A 1.00 A A A A 1.00 A A A A 1.00 D D D D 1.00

Fabrica'on* process* follow*up*

Visual*inspec'on* Defects*recorded* Sensor'

Electrical* measurement*

IV9curve*recorded* and*wafer*mapped* Final*visual* inspec'on* Sensors*classified*

Wafer* probing*

ROC’s*classified* wafer*mapped* ASIC'

Incoming* wafer* inspec'on*

Visual*inspec'on* Defects*recorded*

Bumping* process* follow*up*

Visual*defects*and** Op'cal*bump*height** Data*recorded* Wafer*dicing* Final*visual* inspec'on* ROCs*classified* Wafer*dicing* Chip*and*sensor*cleaning* Flip*chip*bonding*

Electrical* measurement*

Assembly*acceptance* Shipping*for*wire*bonding* PCB'' Preassembled*chip* board*recived*

Power* regulator* probing*

Chip*board* acceptance* Assembly*gluing*to*chip*board* and*wire*bonding*

Tes'ng*and* equaliza'on*

• n*chip*board*

Report*and*log*file*of* the*assembly*

Energy* calibra'on*on* chip*board*

Shipping*together*with*the* report*and*log*file/files* Report*and*log*file*

• f*the*per*pixel*

energy*calibra'on* Report*and*log*file*of* the*energy*calibra'on*

Energy* calibra'on*of* threshold*

Quality management Quality management

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