3D A 3D Aerosol Jet Printing An Emerging l J t P i ti A E i - - PowerPoint PPT Presentation

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3D A 3D Aerosol Jet Printing An Emerging l J t P i ti A E i - - PowerPoint PPT Presentation

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3D A 3D Aerosol Jet Printing An Emerging l J t P i ti A E i MID Manufacturing Process. Dr. Martin Hedges g Neotech Services MTP, Nuremberg, Germany info@neotechservices.com MID Frth 30.9.10 Aerosol Jet Printing Aerosol Jet

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SLIDE 1

3D A l J t P i ti A E i 3D Aerosol Jet Printing – An Emerging MID Manufacturing Process.

  • Dr. Martin Hedges

g Neotech Services MTP, Nuremberg, Germany info@neotechservices.com

MID Fürth – 30.9.10

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SLIDE 2

Aerosol Jet Printing Aerosol Jet Printing

– Aerosol Jet Process Overview Aerosol Jet Process Overview Current Application Examples – Current Application Examples 3D P i ti – 3D Printing – Summary

MID Fürth – 30.9.10

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SLIDE 3

Aerosol Jet Process Overview Aerosol Jet Process Overview

  • Aerosol Jet is CAD driven printing technique.
  • Developed by Optomec Inc, Albuquerque, USA.
  • >$12m in Aerosol Jet Technology & Product Development.
  • 13 patents issued, 43+ pending…
  • Targeting $bn markets in Electronics, Energy, Life Science

O C

  • Active Opportunities in Packaging, Display, Flex, Fuel Cell, Drug

Discovery...

Aerosol Jet 300CE MID Fürth – 30.9.10

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SLIDE 4

How the Process Works How the Process Works

1 3 4 1 2

1 Functional ink is placed in the atomiser gas flow creates an aerosol 1. Functional ink is placed in the atomiser, gas flow creates an aerosol 2. Aerosol droplets ca.1-5μm, larger droplets return to ink (gravity effect) 3. The aerosol is carried to the deposition head, excess gas removed 4. The aerosol is focussed inside the nozzle by a secondary gas flow (sheath gas)

MID Fürth – 30.9.10

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SLIDE 5

Aerosol Jet Characteristics Aerosol Jet Characteristics

150μm

Foc ssed Aerosol Focussed Aerosol Beam No contact to nozzle

MID Fürth – 30.9.10

Natural stand-off from substrate

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SLIDE 6

Aerosol Jet Characteristics Aerosol Jet Characteristics

Too close - line spreads

50

p Ideal- line width constant with height Too far away - turbulent mixing, line widens

40 50

rons)

30 40

dth (micr

20

Line Wi

Focal Length

2 1 3 4 5 6 10

Focal Length MID Fürth – 30.9.10

Height of Nozzle above Substrate (mm)

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SLIDE 7

Conformal Deposition Conformal Deposition

60μm lines into 500μm trench

Nozzle standoff distance of ca. 5mm and long focal length allows conformal deposition with no change in Z-height.

MID Fürth – 30.9.10

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SLIDE 8

Scalability – Line Width y

  • Trials underway to reduce minimum line width to 5µm and below.

Trials underway to reduce minimum line width to 5µm and below.

  • Wide area nozzle development to print line widths 3mm+ (single pass).
  • Current Line width scalability through 3 orders of magnitude.

Ultra fine lines 2.5-3.5µm Ag Grid on Glass MID Fürth – 30.9.10 2.5 3.5µm Ag Grid on Glass

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SLIDE 9

Wide Area Nozzles

  • New contract signed with US Airforce for Wide Area Nozzles.

New contract signed with US Airforce for Wide Area Nozzles.

  • Next step is 5cm wide swaths - ie: 50mm line width.
  • Fallback is to develop a multi-nozzle/head approach for area coating.

Wide Area Nozzle 3mm Ag on Si Wafer CAD Model Wide Area Nozzle MID Fürth – 30.9.10

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SLIDE 10

Examples of Materials Used Examples of Materials Used

MID Fürth – 30.9.10

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SLIDE 11

Application Areas pp

Packaging and Assembly High Density Interconnects* Electronic Devices Solar Cells* Flip-Chip / Direct Die Attach Embedded / Integrated Passives Flex Circuits Displays* Fuel Cells Sensors & MEMS Flex Circuits Meso-Dispensing Electronic Components Sensors & MEMS Hybrid Manufacture 3D Smart Structures Resistors, Capacitors and Inductors Micro-Antennae Life Science Bio-Sensors*

*Production Applications 2010

Micro-Batteries Micro-Arrays MID Fürth – 30.9.10

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SLIDE 12

Connecting Stacked Dies

(R l Wi B d TSV) (Replace Wire Bond or TSV)

Interconnects: 25micron line width Interconnects: 25micron line width 10 microns thick MID Fürth – 30.9.10 Cross section for die interconnects. Insert shows close up of contact area.

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SLIDE 13

Printed Interconnect Advantages g

F t Features

  • Interconnects as small as 10μm at <30μm Pitch.
  • Full Range of High Conductivity Materials.
  • High Aspect Ratio for Low Resistivity.

g p y

  • Supports Non-Planar and 3D Surfaces.

Cost & Functional Advantages. & g

  • Higher Frequencies* with Better Reliability than WireBond.
  • Much Better Time-to-Market and Cost Structure vs. TSV.
  • Reduced Form Factors vs. Package on Package.

3D Stacked Die

Working with Leading Smart Phone Players for Multi-Chip Packages (Processor/Memory Chip Sets)

3D Stacked Die

*Supports HF without antenna effect. Enables Multi-Chip Packages that combine Processor with Memory, etc. MID Fürth – 30.9.10

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SLIDE 14

Touch Screen-Bridge/Jumper Circuit Touch Screen Bridge/Jumper Circuit

Pre-Patterned ITO 5mm Step 1: Print Insulator 30 microns wide Step 2: Print Nano-Silver 10 microns wide MID Fürth – 30.9.10

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SLIDE 15

Bridge Jumper on ITO Bridge Jumper on ITO

REFLECTION REFLECTION

Insulator Ag

TRANSMISSION

Step 1: Print Insulator 30 microns wide

MID Fürth – 30.9.10

30 microns wide

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SLIDE 16

All-Printed OE Circuit All Printed OE Circuit

8 NAND Gates, 3 Inverters

2m m

NAND Gate Inverter Crossover MID Fürth – 30.9.10 NAND Gate Inverter Crossover

*Optomec Inc. collaboration with Dan Frisbie Group UMN

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SLIDE 17

Printed Sensor Networks for St t l H lth M it i Structural Health Monitoring

Ag Strain Gauge on Al CuNi Strain Gauge

COURTESY:

MID Fürth – 30.9.10

Ag Strain Gauge on CFC

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SLIDE 18

Printed Sensor Networks

Simulation of Sensor Networks for Structural Health Monitoring Simulation of Sensor Networks for Structural Health Monitoring

Pt Strain Gauge FEA

Combination with 3D MID Substrates – Smart systems.

MID Fürth – 30.9.10

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SLIDE 19

Printed Temperature Sensor Printed Temperature Sensor

Ag and Ni sensor structure

MID Fürth – 30.9.10

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SLIDE 20

Example of Current 2 1/2D printing.

Ceramic MID with Gold Ink

ca 5mm

  • ca. 5mm

Interconnects ca. 100microns wide

MID Fürth – 30.9.10

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SLIDE 21

6-Axis Aerosol Jet Printer 6 Axis Aerosol Jet Printer

Test Part Part Gripper

Nozzle Shutter

Installed a 6-Axis Aerosol Jet printer which extends process capabilities to true, large area, 3D printing. Build volume: c. 850 x 1200 x 1000mm (x-y-z)

MID Fürth – 30.9.10

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SLIDE 22

6-Axis Aerosol Jet Printer 6 Axis Aerosol Jet Printer.

AJ-6X System installed at the Electronics Lab of FAPS (Institute for Manufacturing Automation & Producton Systems), University Erlangen-Nuremberg. FAPS Lab has extensive expertise in electronic systems and MIDs. Aim for Synergistic Effect in 3D Electronics.

MID Fürth – 30.9.10

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SLIDE 23

Summary Summary

Aerosol Jet Process Capability

  • Non-contact, conformal deposition
  • Scalability: Ultra fine printed fine features to wide area

High Utility

  • Wide range of materials compatibility
  • Wide range of applications
  • Scalability for volume manufacture

New 6-Axis Printer opens the way for novel 3D Printed MIDs over large areas.

MID Fürth – 30.9.10

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SLIDE 24

Thank You! Thank You!

Neotech Services MTP - Dr. Martin Hedges Tel: +49 911 274 5501 info@neotechservices.com @

MID Fürth – 30.9.10