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SERIO Printing Systems Welcome 04 / 2016 SERIO Printing Systems - - PowerPoint PPT Presentation
SERIO Printing Systems Welcome 04 / 2016 SERIO Printing Systems - - PowerPoint PPT Presentation
SERIO Printing Systems page 1 SERIO Printing Systems Welcome 04 / 2016 SERIO Printing Systems page 2 Agenda ASYS Group / EKRA Company Overview EKRA SERIO Printing Process EKRA SERIO Printing Solutions EKRA Quality Assurance
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EKRA, a part of the ASYS Group
Wertheim Mönchweiler Dornstadt (Headquarter) Bönnigheim
847 employees in Germany (2015)
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ASYS Group
Location: Dornstadt/Ulm Founded: April 1992 Managing Directors: Werner Kreibl Klaus Mang Employees 2015: 1051
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ASYS Group: 1051 employees worldwide (2016)
900 employees in Germany
USA Brazil Spain
3
Rumania Hungary
3
Finland/Sweden
2 6
Singapore/Manufacturing
17
Shanghai
28 11
India
9 2 32
Korea Mexico
21 8
Czech Republic
3 6
Taiwan
6
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1992 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2008 2009 2011 1992 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2008 2009 2011 Extension Extension to 30,000 ft² Office extension to 14,500 ft² Extension Production Floor by um 54,000 ft² Extension Production Floor by 96,875 ft², Office extension to 16,791 ft² Company ASYS GmbH ASYS P&R GmbH ASYS Metall GmbH MEVO GmbH EKRA GmbH Botest GmbH ASYS TECTON Establishments ASYS Automation LLC, USA ASYS Automation Asia Pacific, Singapore ASYS Automation Kft., Hungary ASYS Automation Asia China, Shanghai ASYS Automation Nordic Oy, Finland ASYS Automation, Mexico ASYS Automation, Brazil ASYS Group Iberia, Spain Office Hillsboro/OR, USA ASYS Group ASIA South Korea ASYS Group ASIA India
Corporate History
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ASYS Product Range
Handling | Marking | Printing | Depaneling | Customized | Tray and Transfer | Solar
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Systems Installed
Installed equipment From April 1992 to December 2015 56510
9639 14571 180 37 5647 937 25499
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ASYS Group ‒ Trading volume (Mio. €)
137 Mio.
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EKRA ‒ Headquarter
Location: Founded: Managing Directors: Employees: Bönnigheim 1946 Werner Kreibl Klaus Mang Jakob Szekeresch 149
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EKRA – Corporate History
1946 1967 1976 1984 1989 1995 1998 1999 2000 2005 2006 2007 2008 2011 EKRA was founded by Mr. Eduard Kraft as a mechanical workshop EKRA became a key equipment supplier to the electronics industry First EKRA Screen printer was launched First SMT printer was launched First Printer installed at Bosch in Stuttgart EKRA moved into its new facility in Bönnigheim with 6.000 m² (64.000 Ft²) production site EKRA Eduard Kraft Asia Pte. Ltd. was founded in Singapore EKRA America Inc. was founded in Marlborough, MA, USA Bosch Award Winner for Special Supplier Performance EKRA GmbH was integrated as an independent company in the worldwide ASYS Group Global Sales & Service Structures of ASYS and EKRA implemented in the ASYS Group Foundation of ASYS Group Manufacturing in Singapore IPC Award Winner for Best Innovation on iPAG Dispensing System SIMPLEX (User Interface), Winner of the “New Product Introduction Award NPI” 2011
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EKRA Installed Base
2803 1468 3948 1062 87 17 32
Total installed base: ≆ 9417 Systems* Fully automated Systems: ≆ 5802 Semi automated Systems: ≆ 2983
*incl. handling systems, set-up and storage systems, by Dec. 2015
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EKRA Options
For increased print system efficiency
EKRA Process-/ Application Support EKRA HYCON
Product Line Special Applications
EKRA SERIO
SMT Printing Systems
› Solution for your SMT challenges › Scalable platforms › Special printing applications (Hybrid, 3D, foils, wafer, glass, LTCC › Turn-key line solutions, custom processes › Best in class flexibility › Automatic dispenser, clamping systems, camera systems, paste & glue dispenser, … › Over 60 years experience › Local experts for your challenges › Process trainings
EKRA – Your solution provider
EKRA S10 SERIES*
Consumables, accessories and supplementary products *only for EUROPE
› Cleaning papers, squeegees, mobile tooling and storage systems
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EKRA - German Quality across 5 Continents
›Worldwide sales and service centers ›24 / 7 / 365 availability for service and spare parts
Branch offices in more then 40 countries for best customer support
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›ASYS Group / EKRA Company Overview ›EKRA SERIO Printing Process ›EKRA SERIO Printing Solutions ›EKRA Quality Assurance ›Q & A
Agenda
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› Should not require investment into excessive trainings › Should be as easy to operate › Should not require more than one person › Reducing down times to an minimum › Must be flexible for the future
Machine Operation
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›Smart control over gesture (tablet like) ›Clear and transparent structure ›Language neutral and icon based ›Capture PCB image for easiest operation
SIMPLEX User Interface
Winner of the “New Product Introduction Award NPI” 2011
SIMPLEX – setting the benchmark
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›New Product Introduction in less than 2 minutes ›Live image for: › Optical stencil stop › Easy fiducial teaching › 2 ½ D inspection programming within seconds
SIMPLEX – NPI w/o gerber data or tape meassure
SIMPLEX User Interface
Winner of the “New Product Introduction Award NPI” 2011
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PCB Handling and Clamping
Fast & reliable transport
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PCB recognition
›Reliable ›Improved optical detection ›Dual beam sensor ›Improved adjustment possibility
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PCB Handling and Clamping
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›Over top and side clamping is standard
- n every printer
›Clamp force can be automatically adjusted by print program (option)
Standard Transport with Over Top & Side Clamping
- incl. Adjustable pressure for side clamps
fixed rail flexible rail
Reduce PCB stress & increased process control
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›Support of the substrate on the outer edge if you need to print all the way to the end of the substrate.
Disc Transport Systems
fixed rail flexible rail
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PCB Handling and Clamping
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›Straighten the substrate with the over top snugger, clamp the substrate with the side clamps and retract the over top snugger for a absolute flat surface.
Retractable Clamping
fixed rail flexible rail
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›The combination of disc transport and retractable clamping; straighten the substrate and retract the over top snugger for a absolute flat surface as well as supporting the very edge
- f the substrate.
MultiClamp System
fixed rail flexible rail
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Automatic Height Adjustment of the Substrate
fixed rail flexible rail
›MultiClamp with automatic height adjustment
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›Various transport systems for best performance and safe substrate handling ›Single rail transport system ›HSP – High Speed transport › 3x 508mm ›Heavy duty transport ›Shuttle transport ›DualCon transport ›FlexCon transport
Transport Systems
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PCB Handling and Clamping
Fast & reliable transport
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› Various clamping systems › EKRA standard: Side & Top clamping › Retractable clamping › MultiClamp › Various transport systems for best performance and safe substrate handling › Single segment transport system (11 – 9 – 7 seconds) › Standard transport up to 2kg (optional 10kg) › Standard PCB size 508 x 508 mm › HSP 3 segment transport system ›3 x 508mm for up to 6 second ›3 x 320mm for up to 5 second
SERIO – Transport and Clamping Systems
EKRA transport systems – adapted to your needs
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PCB & Substrate Support
›Wrong or insufficient support will result in bad printing results ›Bridging ›Volume variations ›Misprints
Table
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Proper Support / Tooling
Table
›Standard support blocks ›Laser guided pin placement ›Dedicated print nest ›Vacuum print nest ›Carrier support
PCB support is required for perfect printing results!
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›Standard support blocks ›Laser guided pin placement ›Dedicated print nest ›Vacuum print nest ›Carrier support
Solid Support Systems
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›Quicktool ›Variogrid ›Gridlock ›Vacunest
Flexible Support Systems
PCB support for all kind of applications!
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Guidence
›Highly accurate and programmable print pressure with closed loop feedback from 10 to 250N ›Down-stop adjustment ›Squeegee can swivel up to +/- 6 degrees ›Real Closed Loop Functionality due to two independent print heads with permanent compensation of pressure differences ›Compensates uneven Substrate surfaces ›Works like an pneumatic suspension system
Closed Loop Print Head
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Closed Loop Print Head Pressure Control
Pressure on stencil will be checked and adapted every 40 ms.
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Substrate with uneven surface structure Stencil / screen frame
Pressure value (squeegee pressure)
SET value REAL value Default value Software input Pneumatic cylinder in the squeegee head Stencil / screen
Closed Loop System
- No mechanical limitation of the squeegee
stroke
- The squeegee can follow the surface of
the substrate
- No product specific down stop set
necessary
- Squeegee pressure controlled every
40ms, if different from the set value directly adjusted during the print stroke
High Precise Squeegee Head System
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Substrate with uneven surface structure Stencil / screen frame
Pressure value (squeegee pressure)
SET value REAL value Default value Software input Pneumatic cylinder in the squeegee head Stencil / screen
High Precise Squeegee Head System
Closed Loop System
- No mechanical limitation of the squeegee
stroke
- The squeegee can follow the surface of
the substrate
- No product specific down stop set
necessary
- Squeegee pressure controlled every
40ms, if different from the set value directly adjusted during the print stroke
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Substrate with uneven surface structure Stencil / screen frame
Pressure value (squeegee pressure)
SET value REAL value Default value Software input Pneumatic cylinder in the squeegee head Stencil / screen
High Precise Squeegee Head System
Closed Loop System
- No mechanical limitation of the squeegee
stroke
- The squeegee can follow the surface of
the substrate
- No product specific down stop set
necessary
- Squeegee pressure controlled every
40ms, if different from the set value directly adjusted during the print stroke
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› Real Closed Loop functionality due to two independent print heads with permanent compensation of pressure differences › Compensates uneven substrate surfaces ›Tool free intelligent Quick Exchange Squeegee System
Closed Loop Print Head and iQUESS
iQUESS – For fastest product changeover
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›Tool free intelligent Quick Exchange Squeegee System ›Fast and easy operation from front side ›Upgradeable on most existing systems ›No additional cables or pneumatics required
iQUESS – Quick Exchange Squeegee System
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Optimized Squeegee Side Dams
›Special design automatically seals to stencil ›No manual adjustment required ›Minimize paste leakage ›Less waste ›Can be upgraded on nearly all EKRA squeegees
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Printing with Squeegees
›Less paste causes miss printed substrates ›To much paste causes bridging's
Stencil Squeegee Paste Pad Frame
Print direction
PCB
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Paste Height Control
›3 level’s selectable: ›Low level for interrupting production ›Second level to refill / reload paste ›Third level indicates excessive paste on stencil ›System measures in between the squeegees ›Paste can not influence the sensor ›Maintenance free ›Works for different type of paste, adhesive, etc.
This is a real USP – only with EKRA
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› Fully programmable for amount, frequency and placement of deposits › Automatic dispense depending on paste height › Available for 650g or 1200g paste cartridges › Single or dual cartridge capability available › Automatic paste shearing and cartridge sealing avoids drips after dispensing › Paste Dispenser “Straight out of the jar”
Reload paste while printing increases throughput
Automatic Dispenser
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Paste Dispenser “Straight out of the jar”
› New type paste dispenser › Dispensing paste out of the standard container › Usable for most jar types
Put used paste back into the jar
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Stencil Cleaning
›Clean stencil underside is required for excellent printing results ›During printing paste pollutes around the apertures ›Insufficient cleaning can cause bridging's, solder balls, failures
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SERIO Stencil Underside Cleaning System
›Standard cleaner, iROCS light, iROCS and iROCS advanced ›Easy wipe exchange ›Vacuum side channel blower for excellent cleaning results and low energy consumption ›Electronic gear including paper feed sensor to ensure constant transport ›Automatic sprinkler settings; just moistening as long the substrate is ›No pump to dispense cleaning agent
Environment friendly
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iROCS – Integrated Rapid Oscillating Cleaning System
› iROCS Light › Oscillating movement selectable › Faster cycle time (30% with two sweep cleaning) › iROCS › Oscillating movement selectable › Faster cycle time (30% with two sweep cleaning) › Wipe exchange for NON STOP operation!
30% faster than standard cleaning
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›Cassette system for cleaning wipe, the fastest and easiest way to exchange the cleaning wipe ›One cassette in use ›Second cassette outside for preparation ›Storage for two cassettes; no separate table needed when exchanging cassettes ›Cassette exchange during automatic operation within 20 seconds
- > no stop of production required
iROCS Advanced
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SERIO Stencil Underside Cleaning System
›Fast & superior stencil underside cleaning ›Environment friendly usage of consumables ›Constant wipe feed ›Wipe exchange w/o machine stop ›Exchange wipe w/o stencil movement
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SIMPLEX – Stencil Mounting
Semi Automatic Optical Target Semi Automatic Mechanical Hard Stop Full Automatic Stencil Loader
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›For fastest product change overs
- 1. Call print program
- 2. Slide in the stencil all the way to the optical target or
hard stop
- 3. Put Past on the Stencil
- 4. Mount Squeegees
- 5. Close the cover
- 6. Run in PCB
- 7. Systems verifies the fiducials
›Start the automatic run
Fastest Product Change Over
Fastest and easiest way to mount stencils
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Machine set-up
› Wrong set up of tools, squeegees, stencils or materials cause problems Cost Loose of Image Injury of life Damage to property RECALL
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Process Control using DMC Code
›Recognition and analysis of DMC on PCBs and / or stencils ›DMC can be linked with the SPC file for product traceability ›No additional equipment is required in front of the Printer
Traceability
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Set Up Verification – Barcode & DMC Code
›Set up control for easy printer configuration ›Use mobile scanner for setup of tools and consumables ›Up to 10 different objects selectable ›Process verification for stencils, squeegees, paste and PCB support ›All data stored within the print recipe
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Set up verification / SIMPLEX
›The system guides the operator through the set-up procedure ›All recipe required components must be scanned ›Full flexible solution, programmable ›Easy to use and process safe
Set up verification avoids wrong operation
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›Storage of squeegees directly on the machine ›Fast and easy access to ›Support blocks ›Paste ›Wipes ›iPAG glue cartridges ›Upgradeable of existing systems
Quick Set-Up S10 Storage System
Tools & materials where they are needed
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Alignment and Inspection
›Precise alignment of PCB to stencil is essential for highest printing accuracy ›EKRAs unique camera with EVA”EKRA Vision Alignment” technology ensures best results ›Special illuminations give best in class results for fiducial recognition ›Special camera systems with red, white or blue illumination ›Extraordinary camera including polarizing filter complete the camera variety
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Camera Field of View
›4 different FoV are available ›High resolution camera, very small FoV (6µm) ›High speed camera, large FoV (21µm) ›Inspection speed depends on the FoV
12 x 9
20 x 16
22 x 22
SMALL MEDIUM LARGE 8 x 6 High-Res
Cameras for every purpose
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SIMPLEX – Fiducials
›Product image will be scanned automatically by the machine ›Define / select up to 5 fiducials with your fingertips ›Auto detection of shape and size ›Learn the fiducial
Fiducial set-up in less than 30 seconds
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EVA™ EKRA Vision System
CCD Camera Stencil Substrate Light Source 2 (Spot) Lower Diffused Light Source Reflector Cube Lens Illumination Cube Light Source 1 (Spot) CCD Camera Upper Diffused Light Source (Optional) Lens
›EVA™ is using 2 cameras and 2 different types of illumination › LED spot light source and LED diffused light source ›Fast inspection up to 3 pictures (2D) per second possible ›2½ D Inspection with short cut and bridging detection
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EVA™ & 2½ D Post Print Inspection System
CCD Camera
Diffused light
Diffused light is ON and spot light is OFF. Substrate Pad Solder paste
(Appears bright as light is reflected into the camera)
Solder paste (Appears dark as light is deflected away from camera) Substrate Pad CCD Camera Diffused light is OFF and spot light is ON
Light scattered away due to solder balls deflecting light Pad surface reflects light back to camera
Diffused light: Solder paste appears bright, due to LED light reflection Spot light: Solder paste appears dark, due to light deflection
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EVA™ 2½ D Post Print Inspection System
CCD camera Diffused light Diffused light ON and spot light OFF PCB Pad
Solder Paste appears bright due to reflection. No solder area reflects different, more dark.
PCB Pad CCD camera Diffused light OFF and spot light ON Deflection, due to round solder balls surface Pad surface reflects light back to the camera
Solder paste appears dark, due to deflection No solder area reflects different, more bright.
› In case of solder paste height deviation and missing paste the reflection of the paste changes. › This change will be identified by the vision system and a volumetric view of the solder paste will be achieved.
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2½D-Post Print Inspection System
Step 1: ›Define the inspection region by touch and drag a frame ›Teach in of the stencil apertures (master) independent from any aperture geometry.
Tech in from stencil – no gerber data
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2½D-Post Print Inspection System
Step 2: ›„Learning“ of the solder paste by using the „Auto paste teach in“ function (all available light settings will be adjusted automatically). ›The grey scale analysis defines a characteristically reflection behaviour for this paste. ›This „Paste profile“ will be stored automatically in the program data.
Automatic setting of histograms
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2½D-Post Print Inspection System
›Paste coverage and bridging will be detected at the same time
2 ½D inspection, see more than just coverage
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2½D-Post Print Inspection System
›Stencil inspection detects for paste clogging. ›Auto trigger of stencil cleaning ›Independent stencil / PCB inspection
2 ½D inspection, excellent price performance ratio
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SPI Closed Loop that can do more.
›Take the full advantage of your SPI ›Minimize print offset due to board variations ›Optimizing stencil cleaning ›Realized with industry partners › KohYoung › Parmi › Pemtron › TRI › Viscom ›…
EKRA offers an open platform for every SPI
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Closed-Loop Print Offset Correction
›Less deviation across the PCB ›Increased repeatability ›Larger process window ›Minimizes print direction offset ›Higher first pass yield
Automatic correction for ideal process conditions
Offset Y OK Offset X correction corrected manually disturb offset
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Closed-Loop Dynamic Stencil Cleaning
›SPI triggers for stencil cleaning ›Increased quality @ less cleaning cycles ›More stable process ›Cleaning before defects occur ›Increases throughput
Automatic stencil cleaning for highest throughput
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Closed Loop Printer SPI
3000 3250 3500 3750 4000 4250 4500 4750 5000 5250 5500 2 4 6 8 10 12 14 Throughput per day Cleaning ech x PCB
Troughput optimized by cleaning cycles, assumed 15seconds for Print & Handling
15
Optimized quality and increased throughput using Closed Loop solutions
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Double Side SMT Reflow Process
›Tall or heavy components can twist or fall off during second reflow cycle ›Adding adhesive and glue the components down
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Adding paste at THT device holes
›Add paste directly after printing to increase the fill grade of THT device holes
No need for additional step stencils
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›Apply glue or paste directly after printing ›Add paste on deposits where more solder is needed i.e. ›THT, power components, shields ›iPAG with temperature control for a better repeatable process ›distance control for contact-free application
- f solder-paste
›Single or Twin iPAG configurations possible
Single / Twin iPAG, Heating, contact-free, interchangeable
iPAG – Paste and Glue Dispenser
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›Jet dispensing for glue application ›Dot size down to 0,5 mm* possible
(*depending on materials)
›Camera inspection of applied glue dots ›4 times faster then other dispense solution in printers › 20 dots in 6 seconds › 20 dots including inspection in 30 seconds
iPAG Jet - the first jet dispenser within a printing system
iPAG – Jet
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›Test Equipment: CeTaQ-Cm Controller ›Dispense 25 times each 24 Dots on CeTaQ MLP09 Plate ›Dot size 0,5mm ›Glue Type: Heraeus PD 205-A
iPAG – Jet Repeatability
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iPAG – Advantages
›Fully programmable in dot size and position ›Individual parameters for each dot ›Inspection of applied dots ›Laser distance control or stand off ›SIMPLEX Programming ›Various nozzle diameters to adapt various paste / glue types ›Up to 1000 dots per recipe programmable
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Next generation Components, the 03015 and beyond
› printed 03015 structure in comparison with a human hair
Component size, Metric code Component size, Imperial code Lenght in mm Width in mm 0201 0,2 0,10 03015 0,3 0,15 0402 01005 0,4 0,2 0603 0201 0,6 0,3 1005 0402 1,0 0,5 1608 0603 1,6 0,8
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03015 – A NEW COMPONENT SIZE 300µm by 150µm
›Yes we can! SERIO is ready for 03015 or 0201 ›Conditions: Printer with high accuracy alignment system 12,5µm@6s and linear measurement scales at the camera axis ›Stencil: stencil thickness 40 – 50µm, nano coated or plasma treated ›Printing: Use normal print parameters ›Paste: Type 5 is recommended, Type 4.5 is only limited suitable
SERIO 4000 – ready for the future!
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›ASYS Group / EKRA Company Overview ›EKRA SERIO Printing Process ›EKRA SERIO Printing Solutions ›EKRA Quality Assurance ›Q & A
Agenda
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Portfolio - from Manual to High Performance Inline
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SERIO Portfolio - from Manual to High Performance Inline
SERIO – Define what you need!
SERIO 4000 E2 XM SERIO 5000 SERIO 8000 X5 Professional
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SERIO – define your performance!
SERIO 4000 SERIES
11 - 7 sec
SERIO 5000 SERIES
7 sec 5 sec
X5 Professional
Performance “in-line”
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XM
› Side clamping or vacuum print table › Pneumatic print head PCB size XM 50 x 50 / 350 x 400 mm PCB thickness 0,5 – 6 mm PCB weight <20kg Cycle time Manual Stencil frame size XM 300 x 300 – 590 x 590 Alignment accuracy Manual Weight XM 85kg
XM – simply start
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E2 / E2XL
› Side clamping or vacuum print table › Screen print head › MOPS – Manual Optical Positioning System › For further options ask your EKRA specialist PCB size E2 / E2XL 370 x 450 / 550 x 610 mm PCB thickness 0,8 – 6 mm PCB weight <20kg Cycle time Semi Automatic Stencil frame size E2 / E2XL 300 x 300 – 620 x 740 / 740 x 920 Alignment accuracy ± 10µm Weight E2 / E2XL 550 / 650 kg
E2 – easy to use, high accuracy
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SERIO 4000 – Back To Back
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system ›Optional “Mobile Package” with 20µm and enhanced print head PCB size 510 x 360 mm PCB thickness 0,2* – 4 mm PCB weight 0,1 – 2 kg Cycle time 11-7 sec Stencil frame size 738 x 738mm Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 1100 kg
SERIO 4000 BtB– Reduce to the Max
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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SERIO 4000 Back To Back
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SERIO 4000 Back to Back
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SERIO 4000
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system PCB size 510 x 510 mm PCB thickness 0,2* – 6 mm PCB weight 0,1 – 2 kg Cycle time 11 sec Stencil frame size 450 x 450 – 800 x 900 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 1200 kg
SERIO 4000 – SCALE IT UP!
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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SERIO 4000 Compact
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system PCB size 510 x 510 mm PCB thickness 0,2* – 6 mm PCB weight 0,1 – 2 kg Cycle time 11 sec Stencil frame size 450 x 450 – 800 x 900 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 1200 kg › Preparation option upgrade › iROCS light - Oscillating cleaning system
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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SERIO 4000 Volume
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system › iROCS light - Oscillating cleaning system › Vacuum option for print nest ›Paste height detection with 3 levels PCB size 510 x 510 mm PCB thickness 0,2* – 6 mm PCB weight 0,1 – 2 kg Cycle time 9 sec Stencil frame size 450 x 450 – 800 x 900 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 1200 kg
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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SERIO 4000 Speed
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeege exchange system ›Vacuum option for print nest ›Paste height detection with 3 levels
› iROCS – Non stop operation
PCB size 510 x 510 mm PCB thickness 0,2* – 6 mm PCB weight 0,1 – 2 kg Cycle time 7 sec Stencil frame size 450 x 450 – 800 x 900 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 1200 kg
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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SERIO 4000 Dual Lane
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeege exchange system
› Special Dual Lane configuration
PCB size 400 x 253 mm PCB thickness 0,2* – 6 mm PCB weight 0,1 – 2 kg Fixed Rails: 1 and 3 or 1 and 4 Stencil frame size 450 x 450 – 800 x 900 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 1200 kg
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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Further benefit*
›Supply of the bypass lane through the 1. printer During e.g. maintenance of the 2. printer – 1. printer is able to keep up production
* Only with ASYS Group complete solution Power supply* and control*
STOP
Power supply* and control*
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SERIO 4000 Multistep
aa
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- Special developed system to print extra-large / long boars
- i.e. LED application
- Offers better print accuracy than printing the PCB at once
- SERIO 4000 Multistep can process PCB from 100mm x 50mm up to 610 x 508mm single step
- SERIO 4000 Multistep can process PCB from 611mm x 50 up to 1200 x 300mm in double step
- SERIO 4000 Multistep can process PCB from 1200mm x 80mm up to 1500 x 200mm in triple step
- There is no other system like this on the Market
- Stencil design rules are available at EKRA
- Special system based on the SERIO 4000 technology
- but it is not possible to upgradeable a normal SERIO 4000 to Multistep
SERIO 4000 Multistep
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SERIO 5000 and SERIO 5000 Volume
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system › iROCS light - Oscillating cleaning system › Vacuum option for print nest › Paste height detection with 3 levels PCB size 510 x 510 mm PCB thickness 0,2* – 6 mm PCB weight 0,1 – 2 kg Cycle time 7 sec Stencil frame size 450 x 450 – 800 x 900 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 20µm@6Sigma Weight 1200 kg
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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X5 Professional
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system › Print repeatability 20µm@6sigma
› iROCS – Non stop operation
PCB size 508 x 508 mm* PCB thickness 0,2** – 6 mm PCB weight 0,1 – 2 kg Cycle time 8 – 6*sec *(with HSP 3x508mm) Stencil frame size 450 x 450 – 740 x 740 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 20µm@6Sigma Weight ca.1185 - 1250kg › iROCS & iROCS Advanced › 2 ½ D Plus or Super inspection › Paste height detection with 3 levels › Vacuum option for print nest › Hybrid & Optilign applications › Dual iPAG / iPAG Jet
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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X5 Professional Large
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system
› iROCS – Non stop operation
PCB size 660 x 550 mm PCB thickness 0,2* – 6 mm PCB weight <10kg Cycle time 12 sec Stencil frame size 450 x 450 – 740 x 740 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 1200 kg
› iROCS – Non stop operation
› iROCS › 2 ½ D Plus or Super inspection › Paste height detection with 3 levels › Vacuum option for print nest › Hybrid & Optilign applications › Dual iPAG / iPAG Jet
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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SERIO 8000
›XXL Print Format ›Closed loop head › EVA ™ - EKRA vision alignment system › Up to 400N print force PCB size 1000 x 610 mm PCB thickness 0,5 – 6 mm PCB weight <10kg Cycle time 15 sec Stencil frame size 450 x 450 – 1700 x 1270 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight
app.1200 kg
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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SERIO 8000
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X5 Professional Dual Lane
› SIMPLEX user interface › Closed loop head › EVA ™ - EKRA vision alignment system › iQUESS – intelligent squeegee exchange system
› iROCS – Non stop operation
PCB size 2 tracks á 420 x 300 mm PCB thickness 0,2* – 6 mm PCB weight 0,1 – 2 kg Fixed Rail 1 and 3 or 1 and 4 Stencil frame size 450 x 450 – 740 x 740 Alignment repeatability Print repeatability ± 12,5µm@6Sigma ± 25µm@6Sigma Weight 790 kg each › iROCS & iROCS Advanced › 2 ½ D Plus or Super inspection › Paste height detection with 3 levels › Vacuum option for print nest › Dual iPAG / iPAG Jet
*requires a vacuum print nest for PCB 0,2 – 0,5mm ** depending on installed options
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Overview of Inline Printing System
SERIO 4000 SERIO 5000 X5-Professional SERIO 8000
X-Axis
Servo Motor Servo Motor Servo Motor Servo Motor
Y-Axis
Servo Motor Servo Motor Servo Motor Servo Motor
Hoist Z-Axis
Servo Motor Servo Motor Servo Motor Servo Motor
X-Axis
Scale 1µm Scale 1µm Scale 1µm Scale 1µm
Y-Axis
Scale 1µm Scale 1µm Scale 1µm Scale 1µm Stepper Motor 1µm resolution Stepper Motor with linear scale 1µm resolution Stepper Motor with linear scale 1µm resolution Servo Motor 0,25µm resolution ± 12,5 µm @ 6 Sigma ± 25 µm @ 6 Sigma ± 12,5 µm @ 6 Sigma ± 20 µm @ 6 Sigma ± 12,5 µm @ 6 Sigma ± 20 µm @ 6 Sigma ± 12,5 µm @ 6 Sigma ± 25 µm @ 6 Sigma availabe availabe availabe
- n request
availabe availabe availabe
- n request
na na availabe standard is heavy duty transport 11s 7s 7s 15s 7s with speet transport na 5 sec- HSP Transport na up to 1,6 picrures / sec up to 1,6 picrures / sec up to 3 pictrures / sec up to 2 pictrures / sec Single iPAG Jet Single iPAG Jet Single op Twin iPAG / iPAG Jet Single iPAG Jet iROCs light and iROCs iROCs iROCs and iROCs Advanced iROCs 508 x 508 (610x508 optional) 508 x 508 508 x 508 1000 x 610
alignment repeatability (MFU): print repeatability(PFU):
Item
Camera positioning Print table adjustment Camera gentry Stencil Cleaner
- max. PCB Size
Disc Transport High Speet Transports Mulitclamp: Hybrid Transport: Inspection iPAG: Cycle Time
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Unique Feature‘s of EKRA Printers
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›ASYS Group / EKRA Company Overview ›EKRA SERIO Printing Process ›EKRA SERIO Printing Solutions ›EKRA Quality Assurance ›Q & A
Agenda
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›Dimensional deviations or tolerances of mechanical parts can have an impact on printing results ›Assembly deviations or tolerances can have an impact on printing result ›This deviations have to be eliminated in order to achieve constant printing results ›EKRA method to eliminate this deviations is printer calibration using calibration stencil & board
Calibrating the Printer. Why?
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Calibration Stencil
›Highly accurate calibration stencil ›Up to 360 apertures used for calibration ›Test pattern for optical & visual Inspection
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Calibration Plate
›Calibration plate with fiducials & test pattern ›Test pattern for optical and visual inspection It is important to have the calibration stencil and calibration plate manufactured by the same supplier
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Before Calibration Procedure Starts
›Place support blocks ›Insert calibration plate ›Insert calibration stencil ›Put paste on stencil
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Printing result before Calibration
›In the majority of cases, if printer is not calibrated, printing will show a printing offset Printed deposits and printed layouts
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›Select fiducial 1 & fiducial 2 on calibration board ›Camera starts scanning the complete calibration board ›Offset of each printed deposit according to the stencil position is calculated ›Software is automatically correcting the positions in x, y and theta
Calibration Procedure
D
X=20mm Y=20mm D= 2mm
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Print Test after Calibration
› Visual Inspection using printer camera
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›Visual Inspection using high resolution microscope
Print Test after Calibration
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Conclusion
›Calibration is a necessary requirement to achieve good printing results ›Calibration is a easy possibility to verify printing accuracy ›Calibration is performed on each system prior delivery ›Calibration is very fast and recommended at least during regular maintenance ›Calibration does not necessarily require EKRA Service personnel
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What is a Machine Capability Test?
During the measuring process, it is important to prevent any disturbing influences such as vibrations, temperature fluctuations, light fluctuations, etc. ›The machine capability test proves if the machine meets one or more of the specified criteria. ›In case of EKRA printing systems the most important specified criteria is alignment repeatability. ›To measure the alignment repeatability an external measurement system is used. ›The accuracy of the external measurement system is benchmarking the accuracy of the tested system. ›It is a short-term study. ›50 measuring results are statistically evaluated. ›This evaluation defines the quality of the machine.
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› Machine capability test is performed for each EKRA printing system prior delivery. › Machine capability test procedure was jointly developed with CeTaq.
Test unit equipped with 2 HR cameras
Physical resolution: 8µm/pixel Detection limit (Sub Pixel): < 1/8 pixel (<1µm)
To perform the machine capability test, the unit is mounted instead of the stencil
Machine Capability Test
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measuring alignment in print position using fiducial 3+4 Show measurement and add to dataset snap off / Lift down Run out PCB Print position alignment Recognition of fiducials 1 + 2 by EVA PCB loading
PCB 2 4 3 1 PCB 2 4 3 1 PCB 2 4 3 1 PCB 2 4 3 1 PCB 2 4 3 1 PCB 2 4 3 1 PCB 2 4 3 1
0,0015 0,002 0,0013 0,0018
How is the Machine Capability Test performed ?
›Repeat measurement cycle at least 50 times
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›Test protocol supplied with each single system
Example of the EKRA capability test protocol
Result of Machine Capability Test
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›ASYS Group / EKRA Company Overview ›EKRA SERIO Printing Process ›EKRA SERIO Printing Solutions ›EKRA Quality Assurance ›Q & A
Agenda
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SERIO Print Systems Designed to Meet the Highest Industry Requirements
›Unbeatable performance at lowest energy consumption ›All print responsible movements are servo controlled ›Highest repeatability and throughput, proven with 01005 technology ›Unique product-engineering and design ›Innovative, award winning SIMPLEX Software (NPI AWARD, 2011) ›Low self heating, low heat load to environment ›Limitless flexible, many options to customize / upgrade your system
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Vielen herzlichen Dank Thank you very much Muchas gracias बहुत बहुत धनॎयवाद Köszönöm szépen Děkuju mnohokrát Mulțumesc mult 非常感謝 Terima kasih banyak Thank you for your attention!
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Welcome
SERIO Printing Systems
04-2016
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Common USP
›ASYS Group financial strength ›ASYS Group Network ›World Wide Service / Sales Organization ›Leading supplier in the solar industry ›1
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SERIO Inline Systems USP
›U-shape Belt ›ESD conform ›Not edge shape sensitive ›Simplex ›Fast – easy operation ›NPI in 2 Min ›Self-explaining ›3 Level Paste Height detection ›Never to less paste ›Control refil (man / auto) ›Stop when over loaded ›Dispenser ›Reloade past automatically ›iQUESS ›Tool less + easy squeegee exchange ›iROCS oscillating stencil leaning ›Fast and ferfectly cleaned stencil ›Moistening on substrate length
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SERIO 4000 / 5000 USP
›Cost effective ›Solide ›Auto stencil load ›1
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