XiaMen city plus Innovation Never Forget Why We Started, Focus on - - PowerPoint PPT Presentation

xiamen city plus innovation never forget why we started
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XiaMen city plus Innovation Never Forget Why We Started, Focus on - - PowerPoint PPT Presentation

XiaMen city plus Innovation Never Forget Why We Started, Focus on Innovation and Move Forward Founder /CEO Mr. Li JinHua Graduated from The University of Sheffield in UK , Major in Electronic Information Control and System Engineer XMinnov IOT


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XiaMen city plus Innovation Never Forget Why We Started, Focus on Innovation and Move Forward

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Graduated from The

University of Sheffield in UK, Major in Electronic

Information Control and System Engineer

Founder/CEO Mr. Li JinHua

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XMinnov IOT Industrial Park

Material Division FPC/PCB Division RFID Division High Temperature Resistant, EMC Ferrite, Adhesive/Glue FPC,LED & LED Backlight, Solar Panel Material NFC/RFID finished products such as security tag & RFID/NFC pocket reader Find Id Div. Sensor Div. Power Supply Unit

2012 2007 2007 2006 2013 2017

Wottop Div. Location Service for retailers

2017

Mould & Injection Div. Wire Cable Div.

2018 2018

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Stock Code: 430525

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Summary

Worker: 800+ / Engineers: 150 + / Sales Team: 50+ Current Factory Area: 2400*5floors*3building +12000(old factory)= 48000 Sqm Current Office Area: 2400Sqm*6floors = 14400 Sqm

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.

Requirement Sealed Sample & SPEC Releasing Sample Preparation Measure & Verify Simulation Analyze & Design

General Development Workflow

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RF Anechoic Chamber x2 sets

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Professional Team

Digital Circuit Design Engineer 5+

Analog Circuit Design Engineer 28+

Layout Engineer 15+

RF Design Engineer 14+

Firmware Engineer 5+

PC/Android/iOS Software Engineer 8+

Equipment/Device Engineer 4+

Molding Engineer 11+

Structure Design Engineer 4+

Process Optimization Engineer 4+

Tooling Engineer 6+

Qualifying/Test Engineer 10+

Maintenance Engineer 15+

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In House Complete Production Line

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Exposure Technology – Sheet by sheet/ Roll To Roll Conduct Raw Material Photosensitive dry film Pattern Film Exposure Roll to Roll Antenna Etching

PCB/FPC Board Production

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SMT Production

Screen Printing Chip/IC assembly Transfer Reflow Soldering

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Flip Chip Assembly Reinforce Inserting Machine Roll to roll Lamination

Roll to Roll Production

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Mould and injection Dept.

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Assembly Production Line

Wave soldering/波峰焊 Assembly lines/流水线

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Most Advantage

 In-house One Stop Production  Short Lead Time & Delivery Time In 2 hours  Fast Response To The Customization  Flexible Adjustment On Each Equipment  Different Antenna Solution  Customer Quality Control & Encoding Solution

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Advantage 1: Different options for your needs

  • Copper
  • Aluminum
  • Printing
  • Etching
  • Coating
  • Flip-chip
  • COB
  • SMT
  • Lamination
  • Insertion
  • Die-Cutting
  • Customized QC flow
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木材制品

Strong Adhesive with good performance in high temperature. Break On Removal design. Heating will generate more Viscous

Advantage 2: Patented Adhesive

High Temperature Glue/Tape

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Advantage 3: Patented Anti-Tamper/Check on Open

  • Rich Experience in Anti-

Tamper design

  • NXP NTAG213TT
  • SiliconCraft 43NT/43N1F
  • ST
  • Ustar ISO15693 TT
  • Fudan 21TT
  • Physical Damage to Label
  • Trigger Tamper Event

www.rfidtagworld.com

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Advantage 4: Customized Encoding/Pre-Program

  • Serial No/1D/2D Bar-code
  • Pre-Program/Personalization
  • Association & Related

Electronic Report

www.rfidtagworld.com

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Neat regular shape

Smooth line

Patented Exposure Technology VS Printing Technology

Advantage 5: High Performance Circuit Accuracy Irregular shapes under 40 times microscope

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Advantage 6: Extendable Facility & Capacity

  • All new expansion for the new equipment will take less than 2 weeks
  • All equipment & production line accept customization & fast produce with MOQ<10,000pcs
  • RFID Tag/Antenna Production Capacity 0.5m*2pcs*5m*(60m*24h)=7200sqm ≈

7200*500pcs/sqm=3.6mil tag /day

  • 2000 square meters FPC/day (250/500mm sheet by sheet)
  • Wave soldering/波峰焊 5line * 11hours * 4000pcs = 200,000pcs/day
  • Flip-chip Capacity = 8units * 5000 * 24hours = 960,000 pcs/day
  • Converting/Lamination Capacity 0.25m*10m*(60m*24h)*10unit=36,000sqm/ *500pcs/sqm ≈

18mil tags/day

  • Die-cut Capacity 5000*5columns*24h *10units = 6mil tags /day
  • Encoding/QC controller 50unit*5000*24h = 6mil tags/day
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What is our target development?

Focus On Security & Customization

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Electronic Material

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High Precision FPC/PCB

RF antenna Capacitive touch screen Capacitive touch screen Medical Device Board LED Light PCB COF Module Board

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Customized PSU

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Portable RFID Reader

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Application Case

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Customized RFID/NFC Tag

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Customized QC & Personalization Device

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Wine Promotion Cabinet

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Assets RTLS & Consumer Analysis

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Hotel Check In/Out Device

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Focusing On

  • Customization
  • Anti-Counterfeiting
  • Security
  • Brand Protection
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Thank You!