Virtual Manufacturing Empowers Digital Product Development Case - - PowerPoint PPT Presentation
Virtual Manufacturing Empowers Digital Product Development Case - - PowerPoint PPT Presentation
Virtual Manufacturing Empowers Digital Product Development Case Study E-Coat Simulation Klaus Wechsler Abstract Recent progress in simulation methods for the manufacturing industry has reduced the need for expensive test hardware which could be
Abstract
Recent progress in simulation methods for the manufacturing industry has reduced the need for expensive test hardware which could be gratis used in manufacturing. Using manufacturing simulation tools starting at the design stage helps to optimize product development and corresponding manufacturing systems. Whenever there is a need for an early design input in order to ensure quality and manufacturing costs - virtual manufacturing methods will have a profitable chance. For the case study E-Coat simulation STAR-CCM provides an improved workflow from CAD-data and meshing to E-coat deposition as well as modeling of fill and drain behaviors in vehicle paint shops. Simulation results provide the design engineer with answers to questions such as ´is the E-Coat providing corrosion protection in all the cavities´? or ´is there a corrosion risk based on air bubbles or paint ponds´? The combination of an implemented fast algorithm with the chance of describing customer developed material properties by Field Functions allows best fit to complex chemical material behavior. Customized material development is kept inside
- customers. Based on process knowledge we are also providing multiple simulation
support. An overview of future manufacturing simulation topics will be given.
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Virtual Manufacturing is a Consequence of Hardware Reduced Digital Product Development
Doing it in a physical way takes too long. Whenever there is a need for an early design input in order to ensure quality and manufacturing costs: Virtual Manufacturing methods will have a profitable chance. 3
The E-Coat Deposition Process Provides Corrosion Protection in all Cavities
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Overview of the E-Coat Simulation Steps
BIW-Meshing
( for ex. Wrapper, Boolean Unite)
E-Coat Dip-Tank
(Paint Thickness on surfaces and cavities)
Dipping in:
(Air Bubbles, Pressure Distribution)
Dipping Out
(Puddles, Drainage - Time, Pressure Distr.)
Data Freeze of Digital Product Development
Suggestions for Design Optimization
Goal: Corrosion protective E-Coat thickness, minimized air bubbles and puddles in all parts and cavities….)
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E-Coat Modeling: Deposition of charge carrying paint polymers.
Increasing resistance gives a chance for deposition inside cavities
Electrolyte BIW=Cathode Paint material:
..solids (pigments, resin/binder,.), solvent (de-ionized water) and co-solvents (glycol ether..) Conductivity is mainly based on the resin fraction but sensitive to carryover
- f conductive pre treatment materials
from previous dipping steps ..
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Electro Static Paint E-Coat
E-Coat Modeling: ..a small Chemical Plant..
Anode
- Anode:
Anolyte Circulation with influence
- n pH and film re-dissolution.
- Dip Tank:
Mixture of old (aged) and new material as well as recirculation from Rinse Tank. Needs permanent agitation and precise temperature control.
- Pretreatment:
Carryovers affect conductivity.
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Input Parameters of Standard Deposition Model Range of Values form calibration measurements cP: Coulomb efficiency
2-4· 10-5 kg/As
ρP: Paint layer density
1200-1800 kg/m³
rP: Paint layer resistivity
2-5· 106 Ω m
q0: Minimum Accumulated ´Activation Charge ´which
is necessary to start deposition in standard material) There is no deposition as long as q<q0 300-400 As/m²
σliquid: Bath (Electrolyte) conductivity
0.14-0.22 S/m
Equations of the STAR-CCM+ Standard Electro-Deposition Model
P PL PL min n P P PL
r dt dh dt dR j j ρ c dt dh
dt n j q with q q if q q if n j j
min
dt j q with q q if q q if j j
n n min
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ℎ
Paint layer thickness in m Paint layer resistance in Ω m2 Specific electric current in A/m2
ℎ
Paint layer thickness in m Paint layer resistance in Ω m2 Specific electric current in A/m2
( )
Electric Potential at top of paint layer in V
Example of Enhanced (Customized) Electro-Deposition Model Using Field Functions for Detailed Calibration Measurements 9
P PL PL min n P P PL
r dt dh dt dR j j ρ c dt dh
dt j J with J J if J J if j j
2 n 2 2 2 2 2 n min
Input Parameters of Enhanced Deposition Model: - Variable Coulomb Efficiency Cp
- Deposition Starts if J2 > J0
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Cp(t) = f( ( ), (t)) (fb, C2u, C1u, C0u = based on detailed calibration measurements) cP: Coulomb efficiency
(1-exp(- ))*(fb*exp(- /h0))+(-C2U*U²+C1U*U+C0U)
ρP: Paint layer density
1200-1800 kg/m³
rP: Paint layer resistivity
2-5· 106 Ω m
J0
2: Minimum Accumulated ´Activation Work ` (which is
necessary to start deposition. There is no deposition as long as J2 < J0
2
A2s/m4
σliquid: Bath (Electrolyte) conductivity
0.14-0.22 S/m
Calibration of E-Coat Simulation Parameters: (1) Using Existing Real Parts (if CAD Data are Available)
Where can these data be found:
- Sometimes paint shop regularly opens
parts for quality assurance
- Durability and other testing departments
might have opened parts
Calibration:
- Mesh real part and tank and adjust the
parameters of the deposition model until ´best parameter fit´ is reached.
- Use conductivity and paint layer density
from direct measurement/supplier.
E-Coat Thickness (µm)
Provides a fast pragmatic calibration with focus to final (corrosion relevant) thickness
x = measurement x x x Inner: x = 18 µm Outside: x = 25 µm Hidden: x = 8 µm
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Calibration of E-Coat Simulation Parameters: (2) Using Calibration Tubes Fixed to an Existing Part
Preparation:
- Tubes are fixed to a part being coated
- Tubes are opened and measured inside
Calibration:
- CAD model of tubes should be added
to CAD model of part being simulated at a similar position.
- adjust the parameters of the deposition
model until ´best fit´ of tubes is reached.
Provides a pragmatic calibration with standardized test geometry
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x = measurement
Calibration of E-Coat Simulation Parameters: (3) Lab Measurements with Test Box and Plain sheets
Box is closed
- n bottom
and side. Top is above electrolyte level
100V 200V
Calibration of E-Coat Simulation Parameters: (3) Lab Measurements with Test Box (Medium Throw Power)
Measurement Measurement
100V 200V
Calibration of E-Coat Simulation Parameters (3) Lab Measurements with Test Box (Good Throw Power)
Measurement Measurement
Application of STAR-CCM+ E-Coat Simulation: Thickness Building over Time
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Page 16 Video
Application of STAR-CCM+ E-Coat Simulation: Visualization of Thickness in Cavities
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Application of STAR-CCM+ E-coat Simulation: Example of Good Throw Power
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Application of STAR-CCM+ E-coat Simulation: Example of Medium Throw Power
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Application of STAR-CCM+ E-coat Simulation: Example of Poor Throw Power
Good Poor Medium 20
Application of STAR-CCM+ E-coat Simulation: Comparison of different Throw Power Capabilities
Good Poor Medium 21
Application of STAR-CCM+ E-coat Simulation: Comparison of different Throw Power Capabilities
Geometrical Variation will be necessary
Holes have influence on E-Coat thickness
Bigger Diameter or more holes improve corrosion protection
Application of STAR-CCM+ E-coat Simulation: Evaluation of Gemetrical Variation (for better Corrosion Protection)
Simulation of Dipping in: (1sec=1h on 32 CPU, 8 Cores/CPU)
Remaining Air Bubbles Avoid E-Coat Film Building
(Red = Trapped Air Bubbles) Video
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Simulation of Dipping in (1sec=1h on 32 CPU, 8 Cores/CPU)
Remaining Air Bubbles Avoid E-Coat Film Building 24
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Simulation of Dipping in: (1sec=1h on 32 CPU, 8 Cores/CPU)
Visualization of Trapped Air
Video
Simulation of Dipping in (1sec=1h on 32 CPU, 8 Cores/CPU)
Remaining Air Bubbles Avoid E-Coat Film Building 26
Simulation of Dipping in: Positioning of additional Bleeding Holes
Final Position in E-coating should be without air bubbles. Simulation gives information for positioning of bleeding holes.
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Simulation of Dipping in:
Quick optimization check by adding holes and continuing simulation
(Red = Trapped Air Bubbles)
28 Holes added at t = 25s
Simulation of Dipping out:
(Remaining Ponds Contaminate Next Dipping Process Step)
Video (Blue = Trapped Dipping Liquid)
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Simulation of Dipping out:(1sec=1h on 32 CPU, 8 Cores/CPU)
(Remaining Ponds Contaminate Next Dipping Process Step) 30
Simulation of Dipping out: (1sec=1h on 32 CPU, 8 Cores/CPU)
Calculation of Drainage Time 31
Video
Simulation of Dipping out:
Quick optimization check by adding holes and continuing simulation:
(Blue = Residual ponds)
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Simulation of Dipping out:
Quick optimization check by adding holes and continuing simulation:
(Blue = Residual ponds)