UW-Madison College of Engineering Shared Research Facilities Jerry - - PowerPoint PPT Presentation

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UW-Madison College of Engineering Shared Research Facilities Jerry - - PowerPoint PPT Presentation

Jun 11, 2023 23 likes •274 views

UW-Madison College of Engineering Shared Research Facilities Jerry Hunter, Director Wisconsin Center for Applied Microelectronics (WCAM) Materials Science Center (MSC) Soft Materials Laboratory (SML) Meeting Organizers Desire Benefield,

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SLIDE 1

UW-Madison College of Engineering Shared Research Facilities

Jerry Hunter, Director

Wisconsin Center for Applied Microelectronics (WCAM) Materials Science Center (MSC) Soft Materials Laboratory (SML)

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SLIDE 2

Meeting Organizers

Jerry Hunter, Ph. D. Director CoE Shared Facilities Isabelle Girard, Ph. D. Director Office of Campus Research Cores Felix Lu, Ph. D. Electrical and Computer Engineering Co-Director AMIC Kate Salter Assistant Administrative Director MRSEC Julie Last, Ph. D. Instrument Manager UW-Materials Science Center Desirée Benefield, Ph. D. Facility Manager UW Cryo-EM Facility

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SLIDE 3

Agenda for Tutorials

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SLIDE 4

Union South

Level 2 Level 3

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SLIDE 5

Meeting Sponsors

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SLIDE 6

Demonstrations

  • Everyone that scheduled Demos should have a personalized

schedule

  • 45 minute demonstration, 15 min to get to next demo
  • Please adhere to your schedule
  • Demonstration location
  • Materials Science and Engineering

 SEM, TEM, AFM, APT, FIB, Nanoindentation, Raman, Mechanical Sample Preparation and XPS

  • Engineering Research Building

 RBS and XRD

  • Engineering Hall

 Ellipsometry

  • Engineering Centers Building

 Electron Beam Lithography

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SLIDE 7

Outline

  • Introduction to College of Engineering Shared Research

Facilities

  • Wisconsin Center for Applied Microelectronics (WCAM)
  • Materials Science Center
  • Soft Materials Laboratory
  • Overview of Analytical Techniques
  • Summary
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SLIDE 8

CoE Shared Facilities Overview

Wisconsin Center for Applied Microelectronics

  • Micro and nano-fabrication

facility

  • 10,000 sq. ft. cleanroom

with 60 instruments

Soft Materials Lab

  • Polymer characterization

laboratory

  • 30 major instruments

Materials Science Center

  • High end microscopy and

microanalysis facility

  • 30 major instruments

Director: Jerry Hunter

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SLIDE 9

Materials Science Center

Pictures

CoE Shared Research Facilities

Wisconsin Center for Applied Microelectronics Soft Materials Laboratory

AMIC members receive 20% discount

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SLIDE 10

Overview: FY17 Use

  • ~77,000 use hours from

45,000 activities

  • 180 Principle Investigators and

~700 users

  • 48 different departments

covering 8 colleges/schools

  • ~30 Companies
  • ~10 other institutions
  • 8 courses supported
  • 320 grants totaling $175M in

research supported

Research in the Physical Sciences

  • Materials structure/property

relationships

  • Structures, magnetism and electronics
  • Advanced materials for energy
  • Flexible electronics
  • Quantum devices
  • Power electronics
  • Organic/Inorganic interfaces

Research in the Biological Sciences

  • Hierarchical and active soft materials
  • Molecular virology
  • Plant pathology
  • Membrane trafficking pathways in

plants

Usage statistics (FY17)

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SLIDE 11

WCAM Fabrication Toolset

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SLIDE 12

WCAM Fabrication Toolset

  • Lithography

ꞏ Nikon NSR-2005i8A Stepper ꞏ Canon PLA-501 Contact Aligner ꞏ Suss MA6/BA6 double-sided aligner ꞏ Suss MJB-3 Contact Aligner ꞏ Suss MJB-3 Contact Aligner (with I.R. backside alignment) ꞏ Headway Photoresist Spinners ꞏ Solitec HMDS chamber ꞏ Elionix G100 Electron Beam Lithography ꞏ (3) Scanning Electron Microscopes with Nabity electron beam lithography

  • Packaging
  • WestBond 747677 Wedge Wire Bonder
  • K+S 4124 Ball Wire Bonder
  • Karl Suss RA-120 Wafer Scribe
  • (2) MicroAutomation 1006 Wafer Saw
  • MEI-720 Die Attacher
  • Indium Evaporator (die bonding)
  • YES vacuum oven
  • Package annealer
  • Deposition
  • Ebeam Evaporator (metals)
  • CVC-601 DC Sputterer (metals)
  • Denton Discovery 24 Sputterer (RF &

DC)

  • PlasmaTherm 74 PECVD (dielectrics)
  • Telemark Ebeam Evaporator (dielectrics)
  • Angstrom Ebeam Evaporator (metals)
  • Plasma Etch
  • PlasmaTherm 74 RIE/PECVD (deposition

and etch of oxide, nitride on Si)

  • STS ICP Multiplex (Deep Silicon Etcher)
  • Unaxis 790 RIE (general purpose)
  • PlasmaTherm SLR 770 ECR (compound

semiconductors)

  • PlasmaTherm 770 ICP (metals)
  • PlasmaTherm 790-2 ICP (general

purpose)

  • YES Asher
  • Samco UV Ozone cleaner
  • SPTS Xetch E1 XeF2 vapor etch
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SLIDE 13

WCAM Fabrication Toolset

  • Assembly
  • EVG Wafer-Wafer Bonder
  • EVG Wafer-Wafer Bond Aligner
  • Tousimis Critical Point Dryer
  • Obducat NIL-25 Nano-imprinter
  • 400C Oven for polymers
  • Cooke polyimide vacuum oven
  • Wet Chemical
  • (2) General Purpose Wet Benches
  • HF Wet Bench
  • Piranha Wet Bench
  • Metal Etch Wet Bench
  • Nitride Strip Wet Bench
  • KOH / TMAH Wet Etch Bench
  • (3) Solvent Wet Benches
  • Spin Rinse-dryers
  • Thermal Processing
  • 4 stack MRL Phoenix Oxidation Tubes

 wet/dry oxides

  • 4 stack MRL Phoenix Oxidation Tubes

 diffusion/anneals

  • 4 Stack Tystar Furnace

 LPCVD Nitride  LPCVD Polysilicon  LTO oxide  Thermal oxide

  • AG 610 RTA (contact anneal – compound semi)
  • Pre-furnace clean wet bench
  • Metrology Equipment
  • Tencor Flexus 2320 Film Stress Measurement
  • Rudolph Ellipsometer
  • Filmetrics Optical Film Thickness
  • (2)Tencor Alpha Step 200 Profilometers
  • KLA-Tencor P7 Stylus Profilometer
  • Wild M420 Stereo Microscope
  • Several Inspection Microscopes
  • Wafer mapping four-point probe

Dan Christensen Hal Gilles Ed Gonzales Quinn Leonard Hal Gilles Dan Christensen, WCAM manager Kurt Kupcho

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SLIDE 14

MSC/SML Imaging and Analysis Toolset

  • Microscopy
  • Zeiss Auriga 1540 XB Cross Beam (FIB

+ SEM) with Nabity electron beam lithography

  • FEI Helios G4 UX Plasma FIB/FESEM
  • (2) Leo 1530 SEMs with EDS (1) with

EBSD and Nabity electron beam lithography

  • Leo 1550 VP SEM with EDS and Nabity

electron beam lithography

  • Philips CM200UT TEM
  • FEI Tecnai T-12 TEM
  • FEI Tecnai TF30 cryo-TEM
  • NanoMEGAS ASTAR TEM orientation

imaging system

  • FEI Titan aberration corrected (S)TEM
  • Cameca 3000 X Si Atom Probe

Microscope

  • Bruker MultiMode 8 AFM
  • Bruker Bioscope Catalyst AFM
  • Andor spinning disc Confocal

microscope

  • Soft Materials Characterization
  • Q1000 Modulated Differential Scanning

Calorimetry

  • Perkin Elmer DSC 8000
  • Q500 Thermo Gravimetric Analysis
  • ARES LS2 Rheometer
  • RSA III Dynamic Mechanical Analyzer
  • Viscotek GPCmax Gel Permeation

Chromatograph

  • Waters Gel Permeation Chromatograph
  • Waters e2695 HPLC
  • OCA 15/20 Contact Angle measurement

tool

  • (2) Rudolph Auto EIII Ellipsometers
  • Thermo Scientific DXRxi Raman Imaging

Microscope

  • Zetasizer Nano ZSP with Multi Purpose

Titrator MPT-2

  • Biolin Scientific Q-Sense E4 Quartz crystal

microbalance

  • Woollam IR-VASE Ellipsometer
  • Woollam VASE+AR Ellipsometer
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SLIDE 15

MSC/SML Imaging and Analysis Toolset

  • Spectroscopy
  • Thermo K-Alpha XPS
  • Zygo 6300 White light profilometer
  • Horiba Aramis Confocal MicroRaman
  • Horiba fluorolog spectrofluorometer
  • Nicolet NicPlan IR Microscope with

Nicolet Magna 550 Fourier Transform Infrared spectrometer

  • PE spectrum 19 – UV/VIS/NIR

spectrometer

  • Mechanical Test
  • Hysitron TI 950 TriboIndenter

Nanoindenter

  • Hysitron PI 95 in-situ TEM Picoindenter
  • X-ray Analysis
  • Rigaku Small Angle X-ray scattering
  • Panalytical Empryrean XRD
  • Bruker D8 Discover – XRD
  • Panalytical X’Pert Pro MRD -- XRD
  • Sample Preparation
  • Leica EM UC7 Cryo Ultramicrotome
  • FEI Vitrobot cryo vitrifier
  • Fischione 1040 NanoMill
  • Fischione 1050 TEM Mill
  • Fischione 1010 Low Angle Ion Mill

Rick Noll, SEM & FIB Manager Julie Last, SPM & light microscopy Manager John Jacobs, Surface Science Manager Don Savage, X-Ray systems manager Alex Kvit, TEM Manager Anna Kiyanova SML manager Mike Efremov SML

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SLIDE 16

MSC/SML Imaging and Analysis Toolset

Hysitron TriboIndenter Cameca Atom Probe Zeiss Auriga SEM/FIB Bruker D8 Discover XRD Aramis Confocal Raman Leo 1530 FESEM FEI Titan aberration corrected (S)TEM Thermo k-alpha XPS Advanced Rheometric Expansion System

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SLIDE 17

Summary

  • Centers support research campus wide and outside users
  • Over $3M in new instrumentation added since Jan 2016
  • Nanoscale Fabrication Center (currently WCAM)

 Elionix G100 Electron beam Lithography

  • Nanoscale Imaging and Analysis Center (currently MSC)

 NanoMEGAS ASTAR TEM orientation imaging  FEI Helios G4 Plasma FIB/FESEM  Panalytical Empyrean XRD  Glow Discharge Optical Emission Spectrometer (GDOES)  Phase contrast microscope with temperature stage

  • Soft Materials Characterization Lab (currently SML)

 Perkin Elmer DSC 8000 Differential Scanning Calorimeter  Waters e2695 High Performance Liquid Chromatography

  • Over 100 instruments available for nanoscale fabrication and

characterization of polymers, biological and “hard” materials

  • Centers are available for use by both internal and external users
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SLIDE 18

Analytical Methods Introduction

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SLIDE 19

Analytical Methods

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SLIDE 20

Theoretical detection limits

  • How many silicon atoms in a cm3?

((2.33 g/cm3)/ (28.09 g/mol)) * 6.023x1023 atoms/mol = 4.98 x 1022 atoms/cm3

  • How many silicon atoms in a nm3?

4.98 x 1022 atoms/cm3 * (1e-7nm/cm)3 = 4.98x1022 atoms/cm3 * 1e-21nm3/cm3 = 50 silicon atoms in nm3

  • What is the minimum detectable concentration in 1

nm3 (best case)?

– Must be one atom in the volume – 1/50 = 0.02 = 2% – In practice no technique can detect 100% of atoms in a volume, so actual detection limits will always be worse than the theoretical

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SLIDE 21

Excitation followed by detection

  • Nearly all these methods are a result of

excitation/bombardment of a specimen with

  • Photons (x-rays, visible light, etc.)
  • Electrons
  • Ions
  • Followed by detection of
  • Photons
  • Electrons
  • Ions
  • Which measure some physical/chemical characteristic
  • Topography, elemental and chemical identification, surface

morphology, density, thickness, phase, etc.

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SLIDE 22

Analytical Methods compared

Courtesy of EAG

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SLIDE 23

Microanalysis Techniques Tutorials

  • Measurement of

crystallographic orientation and strain

  • Measurement of mechanical

properties of nanoscale materials

XRD Nanoindentation

  • Quantitative analysis of near

surface (5nm) and bonding information

XPS

  • Standardless quantitative

depth profiling for stoichiometry

RBS

  • Fast and high Depth resolution

depth profiling with ppm detection limits

GDOES E-beam Litho

  • nm scale patterning of

materials

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SLIDE 24

Imaging Techniques Tutorials

  • High (sub nm) resolution

measurement of topography

SPM

  • Sub-nm lateral resolution,
  • rientation and elemental

identification

TEM

  • nm lateral resolution with

elemental identification,

  • rientation, simple

sample preparation

SEM

  • High resolution imaging

with material addition and subtraction

FIB

Atomic identification with atomic lateral resolution

Atom Probe

  • ~1um resolution imaging

with chemical bonding

Raman

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SLIDE 25

Analytical Methods