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The Flat Panel Display Paradigm: Successful Implementation of Microelectronic Processes on Gigantic Wafers Dr. Zvi Yaniv Applied Nanotech, I nc. 3006 Longhorn Blvd., Suite 107 Austin, TX 78758 Phone 512-339-5020 x103 Fax 512-339-5021 Email


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SLIDE 1

The Flat Panel Display Paradigm: Successful Implementation of Microelectronic Processes on Gigantic Wafers

  • Dr. Zvi Yaniv

Applied Nanotech, I nc. 3006 Longhorn Blvd., Suite 107 Austin, TX 78758 Phone 512-339-5020 x103 Fax 512-339-5021 Email zyaniv@appliednanotech.net

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SLIDE 2

Flat Panel Displays (FPD) 2007

FPD

Active Matrix Liquid Crystal (AMLCD) Plasma (PDP) Active Matrix Organic Light Emitting Diodes (AMOLED) Field Emission (FED)

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SLIDE 3

Samsung PDP

Ken Werner (Nutmeg Consultants)

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SLIDE 4

Sharp AMLCD

Ken Werner (Nutmeg Consultants)

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SLIDE 5

LG Philips LTPS AMOLED 20.1”

Ken Werner (Nutmeg Consultants)

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SLIDE 6

Predictions…

Once FPDs have achieved comparable size and performance to CRTs, …

FALLING PRICE PREMIUM CRT FPD

?

UNIT PRICE 1990 2000 2010 YEAR American Electronics Association (1990)

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SLIDE 7

Predictions

…, their intrinsic advantages will result in penetration constrained only by their relative price premium versus CRTs

...AND INCREASING SCREEN SIZE...

MAXIMUM SCREEN SIZE (INCHES)

1990 2000 2010 YEAR American Electronics Association (1990)

50- 40- 30- 20- 10- 0-

FPD CRT

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SLIDE 8

Glasses I sotropic Liquids Gases Mesomorphic Glasses

——————

Plastic Crystals Liquid Crystals (Mesomorphic Fluids) Crystalline Solids

3-D Long Range Order Less Than 3-D Long Range Order No Long-Range Order O R D E R I N G

Definite Shape And Volume Definite Volume Only Complete Mobility MOBI LI TY

Solids, Liquids and Gases - It’s all About Order

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SLIDE 9

Liquid Crystal?!

Flat Panel Display Technology, Solid State Technology, 1994

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SLIDE 10

Twisted Nematic (TN) Structure

The molecules along the upper plate point in direction ‘a’ and those along the lower pate in direction ‘b’, thus forcing the liquid crystals into an

  • verall twisted state.
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SLIDE 11

Why LC Active Matrix Displays are Necessary?

Need of Time-Multiplexed Matrix

Addressing

For passive displays (such as LCDs)

time multiplexing has inherent limitations

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SLIDE 12

Principals of Operation of a TFT AMLCD

  • tp – scanning pulse length
  • liquid crystal resistivity ≈ 1012 Ω-cm
  • storage time ≈ 20 msec
  • polarity of the applied voltage must be

inverted periodically:

  • reversing the data voltage polarity in

each frame

  • reversing the data voltage polarity on

alternative rows

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SLIDE 13

Energy Band Diagram of Crystalline and Amorphous Silicon

ENERGY DENSITY OF STATES 1.1 eV DENSITY OF STATES ENERGY 1.75 eV

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SLIDE 14

Plasma Vapor Deposition

RF OR DC POWER ~ .1 WATT/CM2

HEATER PLASMA

GAS EXHAUST GAS FEED PRESSURE ~ 1 TORR

TEMP ~ 250 °C

MATERIAL α - Si (INTRINSIC) α - Si (p-TYPE) α - Si (n-TYPE) SiO2 Si3N4 FEED GAS SiH4, SiF4, H2 (+ B2H6) (+ PH3) SiH4 +N2O SiH4 + NH3

SUBSTRATE

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SLIDE 15

Cross-Section of TFT Pixel Array with Storage Capacitor

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SLIDE 16

Projected Limitations of α-Si TFT AMLCD’s Based

  • n Predicted Technological Improvements

2 4 6 8 10 5 10 15 20 25 30 35 40

Lithography Transistor Performance Gate Delay

Diagonal (in) Resolution (mm –1)

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SLIDE 17

AMLCD Process Flow

Active Plate Passive Plate Cell Display Completed Display

1 2 4 1 3 4 3 4 3 3 1 2 3 4

Functional In-Process Test Optical Pattern In-Process Inspection Panel Inspection Repair

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SLIDE 18

Pixel Layout Example (α-Si TFT)

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SLIDE 19

Example of Clean Room Layout

YELLOW ROOM Exp | Coater / Developer Exp | Coater / Developer Exp | Coater / Developer Exp | Coater / Developer Exp | Coater / Developer Exp | Coater / Developer WET ROOM Wet Etching Stations Resist Removal Stations Cleaning Stations CVD CVD CVD CVD CVD Sputtering Sputtering Sputtering Sputtering Dry Etcher Dry Etcher Dry Etcher Dry Etcher

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SLIDE 20

Cluster Tool Configuration

Transportation Robot Cassette Station

L D / U L LD/UL Process Chamber P r

  • c

e s s C h a m b e r Process Chamber Heating Chamber

Transportation Robot

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SLIDE 21

Block Diagram of TFT-LCD Module

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SLIDE 22

LSI Driver Connection to TCP (tape-carrier package) by ACF

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SLIDE 23

From GEN 1 to GEN 7

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SLIDE 24

Display Size & Pixel Density for Large Screen

Screen Size

40” 30” 24” 17” 15” 1M 2M 4M 5M

Pixel Contents 1024x768 1280x1024 1280x768 1920x1200 1280x768 XGA .8M pixels SXGA 1.5 M UXGA 1.9 M D-TV 1M/2M WUXGA 2.3M

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SLIDE 25

Yield Depend on Screen Size and Pixel Contents

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SLIDE 26

First Generation 7 α-Si

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SLIDE 27

Display Cost

0.26 0.14 0.18 0.42 TFT Plate Lighting Color Filter Plate Drive

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SLIDE 28

Comparison of Various Silicon Films

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SLIDE 29

Major Crystallization Methods

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SLIDE 30

Industry Transition to Polysilicon

High

Low

Electrical Performance (Mobility) Single Crystal Silicon —— x-Si Polysilicon* —— p-Si Microcrystalline Silicon —— m-Si Amorphous Silicon —— a-Si

Material Applications

Wafers Integrated Circuits (Semiconductors)

Thin Films Pixels + Integrated Circuits Pixels Only

* Crystallization converts a-Si or m-Si to p-Si

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SLIDE 31

Wide Viewing Technologies

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SLIDE 32

The Old Dream of Hang on the Wall TV is Here Today

Courtesy of Information Display Magazine

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SLIDE 33

The Old Dream of Hang on the Wall TV is Here Today

Courtesy of Information Display Magazine

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SLIDE 34

What is “Plasma”

Shigeo Mikoshiba, SID Seminars

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SLIDE 35

Where Does the Light Come From?

Shigeo Mikoshiba, SID Seminars

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SLIDE 36

Cross Section of Fundamental Color PDP Structure

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SLIDE 37

Sandblasting Method

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SLIDE 38

Barrier Ribs Made with the Sandblasting Method – Rib Pitch: 130 µm

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SLIDE 39

Negative Features of PDPs

Low luminance (400 cd/m2)

Low contrast ratio (20:1 in bright room) Low luminous efficiency (1.4 lm/W) High drive voltage

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SLIDE 40

OLED Displays

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SLIDE 41

OLEDs Need an “Active Matrix”

Shown is a simplified cross-sectional view of a full-color solution- processed OLED device structure.

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SLIDE 42

Ink Jet Processing?

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SLIDE 43

LTPS vs. α-Si as Materials for AMOLED TFTs

Much more sensitive Much less sensitive OLED Degradation Low High Current Stability Lower for large panel size Lower for small panel sizes Overall Cost High Low Yield Low High Equipment I nvestment High (External Driver) Low (Built-in Driver) Cost (modile) Low High Cost (array only) 4 or 5 masks 9 or 10 masks Number of Process Steps Better Worse TFT Uniformity NMOS PMOS and NMOS Type of TFT 0.5-1 50-200 Mobility (cm2/ V-sec) α-Si TFT LTPS TFT

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SLIDE 44

The Competing Powers for Large Area FPDs

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SLIDE 45

LCD vs Plasma vs OLEDs

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SLIDE 46

Target for ultra-high definition and wide screen display

  • F. Sato and M. Seki, I DW ’01, p.1153
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SLIDE 47

Cross-section of FED in operation

Phosphor Light Anode Glass Cathode Glass Insulating Grid Spacer Layer Electrons Grid Conducting Feedlines Black Matrix

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SLIDE 48

SCE Display

Schematic cross section of the construction in the SCE display.

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SLIDE 49

PdO fabrication process

Schematic diagram of the PdO fabrication process by using ink jet printing.

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SLIDE 50

SED demo

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SLIDE 51

Glass vs Silicon

Information Display Magazine, 11/05

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SLIDE 52

1995 Lithography Requirements

Minimum Feature Size: 2µm - 5µm Linewidth Control: +10% Layer-to-Layer Overlay: +0.5µm - +1µm Throughput: >10 x 106 mm2 per hour Typical Products: TVs, Computer Terminals,

CAD Workstations, Auto Dashboards, Image sensors & Scanners, Print Heads

MRS Technology Inc.

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SLIDE 53

Coating Technology

Spin Coating Roller Coating Spray Coating Slot Coating

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SLIDE 54

Lithography Systems

Contact / Proximity Aligners Mirror Projection Aligners Step-and-Repeat Aligners

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SLIDE 55

Schematic of a Scanning Projection Aligner & Schematic of a Stitching Aligner

Flat Panel Display Technology, Solid State Technology, 1994

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SLIDE 56

Stepping Aligners

Available Systems are ‘Adapted’ IC Steppers Advantages

Multiple Suppliers Resolution, Overlay: Sub-Micron Available High Defect Limited Yield Use Standard IC Masks Available from Multiple Suppliers High Throughput for Small Displays

Problems

Limitations of Projection Optics Constrain Display Size No Migration Path to Large Displays

MRS Technology Inc.

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SLIDE 57

The Stitching Aligner

  • The Job: Make a display of any arbitrary size by stitching

together multiple subfields. Analogous to making a brick wall

  • ut of individual bricks.
  • Problem #1: Doing it
  • The ‘mortar joints’ between the ‘bricks’ must be invisible!
  • Many kinds of ‘bricks’ are used!
  • Problem #2: Doing it Fast!
  • Many exposures, mask changes needed to pattern a single display

layer

  • Slow = Expensive = Prototype Displays
  • Fast = Inexpensive = Production Displays
  • Problem #3: Doing it Easily
  • Multiple subfield stitching jobs are complex
  • Need to know what you get is what you want

MRS Technology Inc.

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SLIDE 58

Cross Pollinations from FPDs to MCMs to Large Si Wafers

Same as above Smart weapons Encryption Radar Command & control Avionics Rugged displays Defense CPU Memory DSP ASIC’s Smaller computers Hand-held devices Global positioning Image processing Array processors Computer screens Video telephones HDTV Avionics Information display Major Applications / Commercial Manufacturing equip Assembly equipment Test equipment Materials Manufacturing equip Assembly equipment Test equipment Materials Manufacturing equip Material handling Test / inspection Materials Critical Elements / Technologies Substrate specs Process materials Substrate specs Process materials Substrate specs Process materials Materials Mechanical interface Material handling Contamination control CIM Mechanical interface Material handling Contamination control CIM Mechanical interface Material handling Contamination control CIM Equipment Large area process Large area process Large area process Critical Segments 400mm MCM FPD Areas of Emphasis

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SLIDE 59

Organic Electronics for Flat-Panel Displays

Passive Matrix and Active Matrix OLED Displays

Organic Light-Emitting Diodes

OTFT Active Matrix Displays

  • n Plastic

Organic Thin-Film Transistors OTFT LCDs on Plastic Organic light-emitting (OLEDs) and organic thin-film transistors (OTFTs) are complementary technologies displays. Either technology can stand alone, but they complement one another when used together.

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SLIDE 60

Electronic Ink

An electrical field is applied across a microcapsule to control the motion

  • f contrasting particles and achieve white, black and gray optical states.
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SLIDE 61

Organic AMOLED

Recently, active matrix displays on ultra-thin foil have been fabricated using solution- processed organic TFTs based on a bottom-gate device architecture. The illustration shows cross sections of such a TFT and of a vertical interconnect (via).

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SLIDE 62

Flexible Displays?... What for?

A flexible AMOLED could enable a multipurpose communications device, such as this “pen communicator” concept from UDC.

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SLIDE 63

Flexible Displays

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SLIDE 64

Latest News

A Bridgestone employee displays ‘Quick Response Liquid Display’ (QR- LPD) featuring its nanotechnology already in use for making tires at the company’s laboratory in Tokyo 27 December 2004. The Japanese government plans to set itself national goals in 10 critical technology fields to strengthen the country’s global competitiveness, a report said.

(AFP / File / Yoshikazu Tsuno)

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SLIDE 65

Why Plastic Substrates May Be Needed

Glass is a Wonderful Technology…

  • Unbelievable advances over the last few decades
  • Large established infrastructure
  • Massive impact on our daily lives
  • Continuing performance improvements

…but

  • Very capital intensive
  • Volatile supply & demand
  • Complex packaging / interconnections
  • Lengthy turnaround / cycle times
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SLIDE 66

Conventional Electronics Manufacturing vs. “Printing”

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SLIDE 67

Plastic Electronics Will Enter a Range

  • f Markets…

P E R F O R M A N C E TI ME 2005 2010 2015 e-paper (portable e-readers, signage) Basic Logic (disposable electronics e-film for X-ray sensors Performance Logic (standard RFI D) LCD TV (light, thin, robust, conformal OLED TV (light, thin, robust…)

Flexible Backplanes

$2Bn Industry Revenues $10Bn Industry Revenues