scintillator CAL for Linear Collider Tohru Takeshita (Shinshu) for - - PowerPoint PPT Presentation

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scintillator CAL for Linear Collider Tohru Takeshita (Shinshu) for - - PowerPoint PPT Presentation

Nov 11, 2022 279 likes •562 views

LC physics requires a fine granular CAL. Scintillator strip detector make it possible with good timing resolution. Shinshu University scintillator CAL for Linear Collider Tohru Takeshita (Shinshu) for CALICE-ASIA scintillator strip for

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SLIDE 1

scintillator CAL for Linear Collider

Tohru Takeshita (Shinshu) for CALICE-ASIA LC physics requires a fine granular CAL. Scintillator strip detector make it possible with good timing resolution.

Shinshu University

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SLIDE 2

scintillator strip

n scintillator is robust, reliable and stable

for calorimeter sensor

n to meet PFA requirement which is fine

granularity

n perpendicular strips make it possible, n while keeping the number of readout

channel rather reduced (than pad/pixel type)

n with novel silicon-photo-detector n issue: uniformity, light yield and

dynamic range as a calorimeter

45x5x2mm3 2.45x1.9x0.85mm3

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SLIDE 3

strip uniformity

n measured in lab. by beta rays n in front of the sensor, too much direct lights

45mm 5mm light yield

present design naked

with reflector Tsuzuki

key : air gap and reflector

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SLIDE 4

strip uniformity

n Geant4 simulation (not optimized)

slc : parameter of reflection Tsuzuki direct light

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SLIDE 5

uniformity & yield

n we need reflector &

air gap

n if we spatter Al on the

scintillator surface

Al spattering present des

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SLIDE 6

light yield

n measured by beta rays n different thickness 1 ~ 2 mm n well separated from noise

Hamasaki

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SLIDE 7

light yield and max.

n ECAL will have Bhabha events which

generate maximum shower energy

n simulation of 250GeV electrons

1700 MIP energy / sc-strip (5x45mm2)

dE /strip (GeV)

500 1000 1500 2000 50 100 150 200 250 300

strip scintillator energy deposit (MIP)

Emax(MIP)

Emax(MIP)

Egamma(GeV)

if 7p.e./MIP ~10000 pixel

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SLIDE 8

dynamic range of PPD

Incident Photon Intensity [photoelectrons on MPPC] 2000 4000 6000 8000 10000 MPPC output [p.e.] 500 1000 1500 2000 2500 3000 3500 4000

10000pix_75.084V 4400pix_69.522V 1600pix_67.031V
  • ld_1600pix_72.117V

Comparison of RC

n Pixelated PD response is limited by its number

  • f pixels in

n to measure BhaBha EM shower n max. pixel needed ~ 10000, when a mip ~7 p.e. n slow saturation is seen due to time structure

  • f arrival photons

n metal register n 10kpix./1mm2

10k 1.6k 10um

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SLIDE 9

design of a layer

n PPD has dead volume in the

scintillator area

n to avoid it, surface mounted PPD

should collect lights, how ?

simulation

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SLIDE 10

wedge shape strip meas.

tapered wedge wedge present

normal sensor location

by S.Ieki(Tokyo)

n by beta rays n normal n tapered wedge n wedge

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SLIDE 11

1.5mm

wedge strip simulation

n optimize PPD location and size

width direction[mm] distance form end of wedge width direction[mm] distance form end of wedge

simulation simulation

wider PPD square PPD

strip center strip center

x x x x

0.25mmx4mm PPD 1mmx1mm PPD

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SLIDE 12

combined layer

n current status n strip: 5mm x 45mm x 2mm

thick

n 144 ch./layer of 18cm

x18cm

n front end electronics

embedded

n 4 SPIROCs (4x36ch) n EBU (Ecal Base Unit)

144 strips on a EBU terminal EBU 180 mm 180 mm middle EBU 180x180mm2board

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SLIDE 13

SPIROC2B

n 36ch/ASIC chip made

by Omega

n bias V control n 12bit ADC with dual

gains

n auto-trigger mode n external trigger and

validation bit

n 12bit TDC with < 1ns

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SLIDE 14

LED calib.

n LED lights go through a

hole for each strip

n 92% success

ADC cont

200 250 300 350 400 450 500 550 600

Entries

20 40 60 80 100

ChipID==132&&ChannelNumber==18&&Trigger==13

h1 Entries 7000 Mean 304.6 RMS 37.62 / ndf 2
  • 57.12 / 48
Prob 0.1724 ampliGaus0 3.0 ± 78.1 meanGaus0 0.3 ± 264 sigmaGaus 0.127 ± 5.738 ampliGaus1 3.50 ± 99.18 distanceGaus 0.2 ± 19.2 ampliGaus2 3.24 ± 98.84

ChipID==132&&ChannelNumber==18&&Trigger==13

Forward layer result @DESY

can be carried out at lab.

193 194 195 196

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SLIDE 15

source test at lob.

n by Sr90 e-source, with auto-trig. mode

稲吉 信州 Source Test

129 130

MPPC への InPut DAC を変更

反応しない イカレタ信号 肩 分離は難

90Sr

good for mass test

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SLIDE 16

beam test

n at DESY n two EBU types: M & T n synchronized DAQ with n AHCAL (SPIROC) n SiECAL (SKYROC) n

Middle EBU Terminal EBU

AHCal layer Sc layer

beam

Si layer Sc layer

beam

slide-17
SLIDE 17 MIP deposit energy (ADC cont) 300 400 500 600 700 800 Entries 20 40 60 80 100 120 140 160 180 MIP distribution ChipID_196 Ch_35 7.66 ± MPV = 322.17 = 0.8774 2
  • reduced
MIP distribution

e-MIP calib.

n 3GeV electrons n auto-trigger mode +

external validation mode

n pedestal subtracted well n success 98% & 96%

ADC counts

300 400 500 600 700 800 900

Entries

200 400 600 800 1000 1200

0.5 mip threshold 8 p.e. No signal. strange signal (noisy) is difficult to separate. But get the MPV.

ch5 forward backward

100 200 300 400 500 600 20 40 60 80 100 120 140 160 180 200 Run_208 ChipID_196 Ch_14 2.38 ± ADC/MIP = 131.7 = 1.15 Entry = 5323 2
  • calibrated well

193 194 195 196 225 228 227 226

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SLIDE 18

TDC results

TDC_Dif

Entries 481 Mean 285.3 RMS 355.5

  • 4000
  • 3000
  • 2000
  • 1000

1000 2000 3000 4000 10 20 30 40 50

TDC_Dif

Entries 481 Mean 285.3 RMS 355.5

TDC_Chip225 Entries 481 Mean 1620 RMS 577.7 TDC_Chip225 Entries 481 Mean 1620 RMS 577.7 TDC_Chip194 Entries 481 Mean 1334 RMS 450 TDC_Chip194 Entries 481 Mean 1334 RMS 450

Max.TDC_Dif: 1739

TDC_dif

R488-Layer1Ch2&Layer2Ch32coincidence

の ありの で： １層だけみれば、形はほぼ同じ。 １層と２層の差を見れば、形は色々あります 上二つの図では： による、 の 差の が違う

＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊

difg. L1 L2

n timing

information for each channel

n difference ~0 n resolution ~2ns/

ch.

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SLIDE 19

strip uniformity with SSA

n with simple SSA, we have

5mm x 5mm resolution

n almost consistent with lab.

stand alone test

Section0 Section8

Position scan with beam MPPCs

Section Point

2 4 6 8 10

N_P.E.

2 4 6 8 10 12

Chip194Ch23 Chip194Ch24 Chip194Ch25 Chip194Ch26

Uniformity

Section Point

2 4 6 8 10

N_P.E.

2 4 6 8 10 12

Chip226Ch23 Chip226Ch24 Chip226Ch25 Chip226Ch26

Uniformity

Section Section Np.e. Np.e.

Scintillator

Forward layer Np.e. Backward layer Np.e.

Scintillator

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SLIDE 20

0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1

X Axis

20 40 60 80 100 120 140 160 180

Y Axis

20 40 60 80 100 120 140 160 180 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1

X Axis

20 40 60 80 100 120 140 160 180

Y Axis

20 40 60 80 100 120 140 160 180

shower event

n simple SSA applied

EBU layers covered by sheet Tungsten plates

3Wplates 7Wplates

Cell Energy

  • forward layer

backward layer

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SLIDE 21

combined with AHCAL

n diagonal settings in

AHCAL

n similar but finer

correlation

1 5 9 9 1 8 7 21 18 12 8 1 1 7 7 5 7 1 105 34 12 3 6 3 6989 255 24 4 3 17 4 4473 10 1 10 6 6 16 3 1 1 1 10 7 12 3 3 2 2 7 2 5 8 6 1 1 13 1

X Axis

50 100 150 200 250 300 350

Y Axis

50 100 150 200 250 300 350 100 200 300 400 500 600 HitRateDisplay_HBU_with_twoLayers

High Threshold High Threshold H it M ap o f H BU High Threshold High Threshold

6 17 5 3 1 2 1 5 16102937272528152317 4 4 3 1 7 3 10 7 19213958666162152217 3 5 2 3 1 5 12395463 134 197 171 12226502212 6 2 1 2 183762 104 124 240 394 350 28055924012 2 1 5 1 2 2046 112 204 254 450 720 653 53683 1634514 6 4 1 2 2 32 105 218 471 584 591 707 622 36365 128391513 2 6 1 2 42 169 423 793 1022 710 405 390 2993566342114 2 4 4 4 37 145 356 693 876 541 324 319 25342622613 3 1 1 2 2 1781 199 372 559 308 1179861161410 2 3 1 2 1386 187 325 475 253918775231513 3 5 3 3 175685 166 234 123574431131711 7 1 2 1 4 2232579365242820 8 10 3 4 4 3 1 1 6 1316233913101110 4 7 2 1 2 2 1 9 11112843291110 8 3 1 5 2 2 2 1 3 5 3 2 2 2 2 1 3 2 7 9 10 5 3 2 5 3 3 1 1 2 1 3 3 1010 3 6 2 1 3 2 2 2 1 1 1

X Axis

20 40 60 80 100 120 140 160 180

Y Axis

20 40 60 80 100 120 140 160 180 200 400 600 800 100 HitRateDisplay_EBU_with_twoLayers

High Threshold High Threshold High Threshold

18cm 18cm 18cm 18cm

H it M ap o f EBU

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SLIDE 22

summary & outlook

n fine segmented scintillator strip ECAL is under

developing with good timing resolution

n strip has become homogeneous enough,

without dead space by PPD

n 1mm thick scintillator is under consideration n embedded FEE is developing with LED &

source calibration capability in lab. by auto- trigger

n power pulsing test n combined DAQ with silicon ECAL/AHCAL

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SLIDE 23

a Dream

n a calorimeter with

homogeneous structure

n tungsten absorbers and

scintillator sensors

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SLIDE 24

ILD ECAL

n need long slav

construction and test

EBU

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SLIDE 25

Thinner EBU can reduce thickness of ECAL ▶ Developed by AHCAL group 1.8 mm ▶ 1.2-1.3 mm req. ASIC package Total Compress 0.6 mm, ex Ball grid array w/ naked ASIC

Further optimization (1) :thickness of EBU

Ecal Base board Unit (EBU)

Small radius of magnet ▶ Lowcost

25

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SLIDE 26
  • calib. results

n ADC/MIP constants are

systematically shifted

n reasons are under

investigation

50 100 150 200 250 300 10 20 30 40 50

chip193 chip194 chip195 chip196

Reject Dead and Noisy

Preliminary #136Chs,mean=115.6,RMS=26.5

scfactor_forward

Forward layer ADC/MIP

50 100 150 200 250 300 10 20 30 40 50

chip225 chip226 chip227 chip228

Reject Dead and Noisy

Preliminary #118Chs,mean=159.7,RMS=29.7

scfactor_backward

Backward layer ADC/MIP

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SLIDE 27

analog memory cells

n 16 analog memory cells/ch n they are difgerent with pedestals

c0

Entries 4876 Mean 276 RMS 4.72

230 240 250 260 270 280 290 300 310 320 50 100 150 200 250 300 350 400

c0

Entries 4876 Mean 276 RMS 4.72 ADCData {ChipID==195&&ChannelNumber==2&&MemoryCell==0} c1 Entries 4534 Mean 278.4 RMS 5.014 c1 Entries 4534 Mean 278.4 RMS 5.014

c2

Entries 4467 Mean 263.1 RMS 6.135

c2

Entries 4467 Mean 263.1 RMS 6.135

c3

Entries 4043 Mean 255.8 RMS 6.398

c3

Entries 4043 Mean 255.8 RMS 6.398 c4 Entries 3843 Mean 254.7 RMS 6.351 c4 Entries 3843 Mean 254.7 RMS 6.351

c5

Entries 3229 Mean 262 RMS 5.833

c5

Entries 3229 Mean 262 RMS 5.833

c6

Entries 2815 Mean 275.8 RMS 5.163

c6

Entries 2815 Mean 275.8 RMS 5.163

c7

Entries 2164 Mean 272.2 RMS 4.986

c7

Entries 2164 Mean 272.2 RMS 4.986

c8

Entries 1688 Mean 272.4 RMS 5.069

c8

Entries 1688 Mean 272.4 RMS 5.069

c9

Entries 1161 Mean 265.6 RMS 6.181

c9

Entries 1161 Mean 265.6 RMS 6.181

c10

Entries 784 Mean 266.5 RMS 6.038

c10

Entries 784 Mean 266.5 RMS 6.038

c0

Entries 7000 Mean 273.4 RMS 7.215

230 240 250 260 270 280 290 300 310 320 100 200 300 400 500 600

c0

Entries 7000 Mean 273.4 RMS 7.215 ADCData {ChipID==195&&ChannelNumber==2&&MemoryCell==0}

c1

Entries 7000 Mean 270.1 RMS 8.763

c1

Entries 7000 Mean 270.1 RMS 8.763

c3

Entries 7000 Mean 266.6 RMS 10.2

c3

Entries 7000 Mean 266.6 RMS 10.2 c4 Entries 7000 Mean 271.8 RMS 9.013 c4 Entries 7000 Mean 271.8 RMS 9.013

c5

Entries 7000 Mean 266.8 RMS 7.83

c5

Entries 7000 Mean 266.8 RMS 7.83 c6 Entries 7000 Mean 266.4 RMS 7.754 c6 Entries 7000 Mean 266.4 RMS 7.754 c7 Entries 7000 Mean 274.7 RMS 9.198 c7 Entries 7000 Mean 274.7 RMS 9.198 c8 Entries 7000 Mean 275.3 RMS 9.863 c8 Entries 7000 Mean 275.3 RMS 9.863

c2

Entries 7000 Mean 273.1 RMS 19.78

c2

Entries 7000 Mean 273.1 RMS 19.78

Run185_Channel2 Run159_Channel2