Production Test Effectiveness of Combined Automated Inspection and - - PowerPoint PPT Presentation

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Production Test Effectiveness of Combined Automated Inspection and - - PowerPoint PPT Presentation

Production Test Effectiveness of Combined Automated Inspection and ICT Strategies Amit Verma and Charles Robinson Steve Butkovich 1 Automated Inspection Systems and In-Circuit Test What Place do they have in the process? What


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Production Test Effectiveness

  • f Combined Automated

Inspection and ICT Strategies

Amit Verma and Charles Robinson Steve Butkovich

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Automated Inspection Systems and In-Circuit Test

  • What Place do they have in the process?
  • What limitations exist?
  • Use Models for Automated Inspection
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3

Confusion of Terms

  • test

– verb (t) A procedure for critical evaluation; a means of determining the presence, quality, or truth of something; a trial

  • inspect

– verb (t) To look carefully at or over; view closely and critically: to inspect every part.

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Automated Inspection

  • More Closely Related to the Assembly

Process than the test process

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Automated Inspection Systems

  • An Important Part of Test Strategy

– Premise – Much more effective than human inspection models *80% Effective *What About Those hidden Joints? – Test Access is Going Away

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Inspection Standards

  • Human Operator Standards

– JEDEC 001 – IPC 610

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Inspection Standards

  • Automated Inspection

– Establish a Median Value from a “Known Good Board” – Arbitrary Variation depends on programmer – Inspection methods and limits are inscrutable

  • IPC 7-32 Committee

– Establish Parameters Based on IPC Standards when available

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Technological Limitations

  • Analytical Capability

– Verifiable Results – Fooled Easily – High False Failure / True Failure Ratio

  • Image Capability

– Lack of Repeatability – BGA Opens

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Defects vs. Process Indicators

  • 907 Total Indications
  • All are Defects that

must be Repaired

? Insufficient solder ? Excessive solder ? Voids ? Missing bypass caps ? Misalignment

Functional Test AXI ICT 335 22 550

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Does Rework Mean Quality?

  • Rework Reduces Product Quality

– Scrap a PCA before reworking the 4th time – Particularly for BGA Packages

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DEFECT

  • “A non-conformance that can cause a

measurable failure during the product life that must be repaired prior to shipment.”

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PROCESS INDICATOR

  • “An undesirable outcome of the

manufacturing process that should be minimized by taking corrective actions on the manufacturing floor using continuous improvement methods, but does not require repair prior to shipment.”

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Is Your Defect My Process Indicator?

  • Class 1 – General Electronic Products

– Computers, Consumer Products

  • Class 2 – Dedicated Service Electronic Products

– Communication Equipment, Business Equipment

  • Class 3 – High Performance Electronic Products

– Medical, Avionics

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Usage Models

Screen Print Reflow Solder Placement OPT ICT

Functional Test

AXI AOI Functional Test

SPEED RESOLUTION CLEARANCE

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Statistical Sampling

  • For Slow Inspection Methods Use the Inspection

Systems to Maintain the Assembly Process

DPMO Percent Defective Fraction defective: p 0.0001 0.001 0.01 5000 10000 15000 20000 100 0.01000% 0.0001 39996 400 4 8 4 3 2 200 0.02000% 0.0002 79984 16 8 6 4 300 0.03000% 0.0003 119964 24 12 8 6 500 0.05000% 0.0005 199900 1999 20 40 20 14 10 1000 0.10000% 0.001 399600 3996 40 80 40 27 20 10000 1.00000% 0.01 3960000 39600 396 100000 10.00000% 0.1 36000000 360000 3600 500000 50.00000% 0.5 100000000 1000000 10000 600000 60.00000% 0.6 96000000 960000 9600 1000000 100.00000% 1 Joints inspected per assembly

  • No. of consecutive

assemblies to be inspected n values for 95% confidence level

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Production Test Effectiveness

  • Defect Coverage with Constrained Resources

PTE = (% Total Defects Found) X (Relative Throughput) TE = (% Total Defects Found)

Test Effectiveness