Overview of R&D Activities for H.E.P. at IN2P3 & DAPNIA Marc - - PowerPoint PPT Presentation

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Overview of R&D Activities for H.E.P. at IN2P3 & DAPNIA Marc - - PowerPoint PPT Presentation

Signal/noise in 1 pixel (small diode) Events 0.07 R&D for High energy physics experiments 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise Overview of R&D Activities for H.E.P. at IN2P3


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  • R&D for High energy physics experiments

Overview of R&D Activities for H.E.P. at IN2P3 & DAPNIA

Marc Winter (for IN2P3 & DAPNIA) contributors: R.Barbier, S.Katsanevas, V.Lepeltier, S.Marnieros, A.Savoy-Navarro, ...

OUTLINE

  • R&D for ILC detectors:

Vertex detector Tracking detectors Calorimetres

  • R&D for non-collider experiments:

Photosensitive detectors (GIS) Bolometres Distributed Intelligence High precision mirrors

  • Summary

12/05/06, –1–

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  • Part 1: R&D for ILC Experiments

Vertex Detector - Tracking Devices - Calorimeters All developments are part of EUDET (FP-6) Project > 100 physicists, engineers, PhD students, ... involved

12/05/06, –2–

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  • ILC: Goals of R&D for Vertexing & Tracking

⊲⊲ Accuracy = Key towards Understanding → 1–2 orders of mag. beyond LHC sensitivity

Overriding challenges for vertexing:

⊸ δ(IPrφ,z) = 5 ⊕ 10/p · sin3/2θ µm

(SLD : 8 ⊕ 33/p · sin3/2θ µm)

⊸ occupancy induced by beam background (O(103) e±/BX) ֒ → w.r.t. LHC:

1/5 Rb.pipe, 1/30 pixel size, 1/30 material budget

֒ → CCD: too slow & rad. soft Hybrid Pixels: not granular and thin enough

Overriding challenges for charged particle tracking:

⊸ momentum resolution: σ(1/pT) ∼ few 10−5 (GeV/c)−1 − → ֒ → 1 order of magnitude improvement w.r.t. existing set-ups ⊸ multi-track separation (e.g. inside jets)

and extrapolation to ECAL: essential for particle flow !

⊸ precise and efficient track reconstruction at small polar angles: ⋗ WW & ZZ production (esp. at V.H.E. → collimated jets) ⋗ luminosity determination (acolinearity of Bhabha-scattered e± to ∼ 0.01 mrad)

12/05/06, –3–

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  • ILC: Goals of R&D on Calorimetry

Goal: Reconstruct accurately ∼ all jet four-momenta (combining Vx det., tracker, calo. & muon syst. info) Need for highly accurate Energy/Particle flow:

σEjet Ejet 0.3

Ejet

֒ → w.r.t. LEP: twice better σEjet

w.r.t. LHC: 1/200 calorimeter granularity e.g.: separation of WW final states from ZZ final states in

e+e− → ννW +W −, ννZZ, where W, Z → 2 jets

Together with: Hermeticity → missing (E, p)

and Low material budget → ∆p/p, conversions

12/05/06, –4–

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  • ILC: CMOS Sensors to equip the Vertex Detector

⊲⊲ R&D for Vertex Detector : IPHC (Strasbourg), DAPNIA (Saclay), LPSC (Grenoble), LPCC (Clermont)

֒ → relies on ∼ 17 FTE: 3 physicists, 8 engineers, 2 Post-docs, 4 PhD

CMOS sensors expected to provide an attractive trade-off

between granularity, material budget, radiation tolerance, speed and power dissipation

Main R&D directions:

  • High r.o. speed, low noise, low power dissipation,

compact signal processing µcircuits integrated inside the sensor (System–on–Chip)

  • Optimal fabrication processes (epitaxy thickness,

doping profile, etc.)

  • Tolerance to non-ionising (and ionising) radiation
  • Room temperature operation : avoid active cooling
  • Thinning procedure : yield, minimal thickness, rigidity, ...

Collaboration with 10 labs (Germany, Italy, UK, Switzerland, USA)

12/05/06, –5–

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  • ILC Vx Detector : CMOS Sensor Achievements

∼ 15 (MIMOSA) prototypes designed, fabricated and characterised since 1999 Most chips tested on H.E. beams (SPS, DESY) → well established performances :

  • N ∼ 10 e− → S/N 20 – 30 → ǫdet 99.5 %
  • σsp ∼ 1.5 µm
  • Thinning to 50 µm → next : 35 µm
  • Toper. 40 ◦C
  • Rad. tolerance 1 MRad, 1012neq/cm2 → next : 1013neq/cm2
  • Architecture with integrated discri. validated ( ǫdet 99.3 % ; fake 10−3 ) → next : integrated ADC & ∅

Signal/Noise

20 40 60 80 100 120 140

hsn1

Entries 6067 Mean 41.07 RMS 23.57 Underflow Overflow 202 / ndf

2

χ 199.8 / 131 Constant 18.14 ± 930.5 MPV 0.188 ± 26.27 Sigma 0.1017 ± 6.521

Signal/Noise

20 40 60 80 100 120 140 Events 20 40 60 80 100 120 140 160 180

hsn1

Entries 6067 Mean 41.07 RMS 23.57 Underflow Overflow 202 / ndf

2

χ 199.8 / 131 Constant 18.14 ± 930.5 MPV 0.188 ± 26.27 Sigma 0.1017 ± 6.521 Signal/noise in 1 pixels

C)

  • Temp (
  • 20
  • 10

10 20 30 40 Efficency % 99 99.2 99.4 99.6 99.8 100 100.2

pitch 20 small diode chip 1 pitch 30 small diode chip 1 pitch 40 small diode chip 1 pitch 20 small diode chip 3 pitch 30 small diode chip 3 pitch 40 small diode chip 3

Efficency vs Temperature Small Diode

Pitch (microns)

15 20 25 30 35 40 45 Resolution (microns)

1 1.5 2 2.5 3 3.5

Mimosa 9: resolution vs pitch

MIMOSA sensors will equip : STAR Heavy Flavour Tagger: 1) 2008 (analog)

2) 2011 (digital)

EUDET beam telescope: 1) 2007 (analog)

2) 2008 (digital) and are further developed (rad.tol.) for CBM Vertex Detector (FAIR/GSI 2012)

Spin-off: bio-medical imaging (SUCIMA/FP5 ; GIS with Photonis-Dep)

12/05/06, –6–

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  • ILC: R&D for Tracking Devices

⊲⊲ R&D for Central (TPC, Si strips) and Intermediate tracking (Si strips)

R&D goals for µpattern gas detectors (DAPNIA - LAL : ∼ 5 FTE)

⊸ investigate potential of µMEGAS : minimise TPC dead zones, combine with µpads ⊸ investigate optimal gas mixture: avoid H (neutron bg) → new quencher (CF4) fast at low Edrift alleviated ⊥ diffusion ⊸ design highly integrated r.o. electronics with minimal Pdiss → material budget

R&D goals for Si-strip detectors (LPNHE - LAPP 10 FTE: 4 phys., 6 engineers)

≎ Sensor R&D: module thickness (ց), length (ր), pitch (ց), yield (ր) ≎ FEE R&D: low noise preAmp. shaping time (0.5 → 5 µs) analog sampling low Pdiss (pulsed powering) highly compact (integrated) FEE chip minimal mat. budget ≎ Development in Mechanics : mat. budget and integration related issues ≎ SiLC collaboration (coord. A.Savoy-Navarro) : > 20 labs (Europe, Asia, USA) ≎ New generation of Si strip detectors → synergy with evolution/trends of (S)LHC trackers

12/05/06, –7–

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  • ILC: Major R&D Achievements for TPC Read-Out

people involved at DAPNIA-IN2P3 ~ 5 FTE

d i a m e te r 5 0 c m le n g th 5 0 c m

B e r k e le y S a c l a y L A L - O r s a y

4 G e V /c π+ b e a m

θ ~ 0 ° ,φ ~ 0 ° , B = 1 T

spatial resolution 0= (52±1) µm

⊲⊲ TPC equipped with µMEGAS installed on KEK π− beam ⇛ ∼ 50 µm intrinsic accuracy achieved (resistive plate) TPC equipped with µMEGAS

coupled to Medipix r.o. pads

֒ → aim for resolution < 100 µm ⊲⊲ Cosmic rays observed !

12/05/06, –8–

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  • ILC: Major R&D Achievements in Si Strip Devices

1st FE chip prototype (UMC 0.180 µm)

made of 16 channels, fabricated and tested in 2005 ⇛ satisfactory results (noise, pick-up time, gain, a.s.o.)

2nd FE chip prototype (UMC 0.130 µm )

includes : 128 channels,

analog sampling, shared ADC, power cycling ֒ → sent for fabrication in March ’06 Illustration of strong involment of French laboratories in µcircuit designs ֒ → ... several r.o. chips for ILC, LHC, ... detectors designed by IN2P3-DAPNIA groups (∼ 40 – 50 designers)

12/05/06, –9–

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  • ILC: R&D for Calorimeters

R&D motivations :

  • Isolate and measure γ clusters in ECAL

→ high granularity, small Moliere radius, inside solenoid

  • isolate and measure neutral hadrons in HCAL

→ high granularity, inside solenoid ⊲⊲ Sophisticated energy- (particle-) flow algorithm required ∼ 10 % ∼ 22 % ∼ 63 %

Si-W: outstanding performances

  • Typical design: 2.5 mm W layers alternated

with 1.5-2.5 mm Si pads (0.25 -1.cm2) → RMol ∼ 12-18 mm

  • BUT : 2000 m2 Si

and

107 electronics channels

⊲⊲ R&D on Si det., electronics, mechanics, cooling, cost reduction

≎ Labs: LLR-Palaiseau , LAL-Orsay , LPC-Clermont , IPN-Lyon ,

LPSC-Grenoble, LAPP-Annecy

≎ Manpower (FTE) : 13 phys.; 17 engineers; 5 PostDoc; 5 PhD ≎ Organisation: CALICE collab. (J.C.Brient) ⊂ 36 labs of 9 countries (>180 members)

12/05/06, –10–

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  • ILC: Major R&D Achievements in Calorimetry

Marc Anduze – SOCLE 2006 – 12/01/06

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12/05/06, –11–

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  • ILC: Major R&D Achievements in Calorimetry

Marc Anduze – SOCLE 2006 – 12/01/06

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12/05/06, –12–

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  • Part 2 : R&D for Non-Collider Experiments

⋖ Selected Topics ⋗

Photo-sensitive Detectors Bolometers Distributed Intelligence High Performance Mirrors

12/05/06, –13–

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  • Groupement d’Int´

erˆ et Scientifique Photonis - IN2P3/CEA

R&D photodetection

  • Photodetection is ubiquitous in astroparticle physics
  • but not only, see for instance LHCb
  • IN2P3/CNRS has formed a GIS (Groupement d’Interet Scientifique) with

PHOTONIS the second largest photodetector company (recently merged with DEP and BURLE) . CEA participates in the Scientific Council

  • R&D along the following axes
  • Large surface photodetectors, common electronics (AUGER, KM3,MEGATONNE)
  • Pixel detectors with high QE (HESS, biomedical)
  • Low radioactivity PM (NEMO,DCHOOZ)
  • Fast, high resolution,high sensitivity hybrid photodetectors (Biology, Night vision)
  • Hybrid detectors (Silicon SiPM, Gas photodetectors)
  • Permanent staff: 20 researchers and engineers from IN2P3/CEA 10 researchers

from PHOTONIS

  • Annual ressources 3-4 non-permanent contracts + investment budget

12/05/06, –14–

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  • GIS Photonis: Advanced Photo Multiplier Systems

Electronic R&D

Integrated readout : “digital PM (bits out)”

  • Charge measurement (12bits)
  • Time measurement (1ns)
  • Single photoelectron sensitivity

High counting rate capability (target 100 MHz) Large area pixellised PM :

  • 16 low cost PMs
  • Centralized ASIC for DAQ
  • Variable gain to have only one HV

Multichannel readout

  • Gain adjustment to compensate non uniformity
  • Subsequent versions of OPERA_ROC ASICs

12/05/06, –15–

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  • GIS with Photonis-Dep: EB-CMOS Imagers

2

Quartz window Photon

E

Photo-electron photocathode CMOS HV QE~10-20%

HV = 10 kV Gain~3000

  • Spatial resolution
  • Single photon sensitivity
  • U

ltra fast readout

  • System

O n chip capability

FW HM

  • L

V 0r V

L(m m)

V(kV)

Spatial resolution optimization

L : photocathode/CM OS sensor gap

V : accelerating potentiel

E : electric field

e : passivation layer thickness Back thinned M IM OSA CM OS sensor

W

  • rking point

Partner / Tasks

  • IPN

L : Tests and Applications

  • IPH

C : MIMO SA sensor

  • PHO

TON IS-D EP : Photo-Tube

Photoelectron penetration depth

photodetector U ltra fast single photon detection with very high spatial resolution for low light vision applications

R&D on EB-CMO S Im agers with the Supplier Photonis-DEP

12/05/06, –16–

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  • Bolometres for DM Detection

12/05/06, –17–

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  • Bolometres for EdelWeiss-II Expt

12/05/06, –18–

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  • Bolometres for CBM Polarisation Measurement

12/05/06, –19–

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  • Laboratoire des Mat´

eriaux Avanc´ es (LMA)

LMA ⇛ study, realisation & characterisation of thin films

  • btained via several consecutive - vacuum based - deposition processes (CVD, PVD) :

≎ optical applications: low-loss mirrors for gyrolasers & interferometers (Dual Ion Beam Sputtering) ≎ mechanical applications: rain-erosion resistance, corrosion resistance

Staff : ∼ 10 engineers, 2 technicians, 2 PhD students

Essential contributions to VIRGO gravitational wave experiment VIRGO ⇛ 6 main mirrors fabricated by LMA: ≎ 4 large mirrors : Ø = 350 mm, ∼ 100 mm thick, 20 kg ֒ → new tools to manipulate mirrors safely (& clean) between proc. steps ≎ Performances achieved fullfil VIRGO requirements

( coating of such large mirrors was a world first ) :

⋄ absorption and scattering < 5 ppm ⋄ flatness 8 nm (RMS) over 150 mm ⋄ finess inequality between Fabry-Perrot cavities < 1 % Next : introduce know-how in LIGO gravitational wave experiment

12/05/06, –20–

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  • Distributed Intelligence and Far-Off Remote Control

Experiments such as AUGER, OPERA, ANTARES, ... need(ed) specific developments aiming to

run reliably long-lived (large) experiments located in hardly accessible experimental sites

֒ → enlarges substantially the traditional know-how of numerous H.E.P. labs :

distant running & monitoring → autonomy & reliability, stability of data taking conditions, ...

Example of AUGER: 1600 Cerenkov stations and 24 fluorescence telescope

distributed over 3000 km2 in remote countryside

≎ Complete autonomy of local stations connected to each detector:

  • solar panel/battery powering
  • hertzian transmission of acquired data
  • 15 ns timing via GPS
  • DAQ & monitoring based on local micro-processor/controler

≎ Very low power (10 W / station) ≎ Running in hostile (and new) environment (desert, heat, humidity, animals ...) ≎ Very high reliability (life time ∼ 20 years) ≎ Low cost : 100 USD / station ⇛ 160 000 USD / experiment

⊲⊲⊲ Most of these issues addressed (successfuly) by the French componant of the collaboration

IN2P3: IPNO, LAL, LPNHE, APC INSU : LAOB Industry : Photonis

12/05/06, –21–

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  • Expertise in Distributed Intelligence : OPERA DAQ Board

O P E R A D A Q

D is tr ib u te d In te lig e n c e n e tw o r k : E a c h d e te c to r ( fr o m th e P M T to th e R P C ) m o d u le is a n E T H E R N E T n o d e O v e r 1 0 0 0 e th e r n e t n o d e s … . E v e n t b u ild in g th r o u g h S w itc h e s + P C s D is tr ib u tio n o f s y n c h r o n is a tio n le v e ls ( G P S ) S im ila r s y s te m s in A N T A R E S a n d A U G E R

1000 cartes CAMEROP+Mezzanine RPC Controller Board Carte PCI-GPS

OPERA-ROC LAL chips

IPNL

12/05/06, –22–

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  • SUMMARY

Very active, leading & internationaly recognised R&D community on det. R&D for ILC (> 100 phys. & engineers): ≎ Si-W Calo. ≎ CMOS sensors for Vertexing ≎ Si strip tracking sub-det. ≎ TPC (µMEGAS r.o.) ≎ R&D well integrated in world wide effort (driving force: several coordination resp.): CALICE, SiLC, ECFA-ILC, ...

and supported by E.U. programme : EUDET (FP6)

≎ R&D encompasses wide panel of applications: subatomic phys. → imaging & dosimetry R&D for non-collider experiments covers wide range of high-tech. expertise : ≎ Photo-sensitive detectors (⊂ GIS with Photonis-Dep) ≎ Bolometres (various types) ≎ Distributed Intelligence ≎ High performance mirrors (LMA) ≎ Several others missing (ex: Cryogenics)

12/05/06, –23–

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  • SUMMARY

Very active, leading & internationaly recognised R&D community on det. R&D for ILC (> 100 phys. & engineers): ≎ Si-W Calo. ≎ CMOS sensors for Vertexing ≎ Si strip tracking sub-det. ≎ TPC (µMEGAS r.o.) ≎ R&D well integrated in world wide effort (driving force: several coordination resp.): CALICE, SiLC, ECFA-ILC, ...

and supported by E.U. programme : EUDET (FP6)

≎ R&D encompasses wide panel of applications: subatomic phys. → imaging & dosimetry R&D for non-collider experiments covers wide range of high-tech. expertise : ≎ Photo-sensitive detectors (⊂ GIS with Photonis-Dep) ≎ Bolometres (various types) ≎ Distributed Intelligence ≎ High performance mirrors (LMA) ≎ Several others missing (ex: Cryogenics) Conclusion: Very lively R&D at IN2P3 & DAPNIA for future Particle and Astroparticle Phys. projects Expertise and investment of both institutions are essential for many leading international projects

and have numerous spin-offs in other research fields as well as in social applications

⊲⊲⊲ WORRIES :

1) R&D teams get funding more and more conditioned by spin-offs & applications

  • utside of IN2P3-DAPNIA fundamental research domain

R&D ⇛

R&D

2) High-level instrumentation research positions less and less attractive : carreer/expertise recognition, research freedom, engineer salary, ... ⇛ difficulties to transmit accumulated expertise to next generations, ...

12/05/06, –23-a–