Nanostructured molecular switch and memory Hyoyoung Lee US-Korea - - PowerPoint PPT Presentation

nanostructured molecular switch and memory hyoyoung lee
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Nanostructured molecular switch and memory Hyoyoung Lee US-Korea - - PowerPoint PPT Presentation

Nanostructured molecular switch and memory Hyoyoung Lee US-Korea NanoForum, 27-30Apr2009 The center of Smart molecular memory @ Dept. of Chem. , SKKU Why working on molecular memory? Tera-bit Molecular Memory Device Current Commercial Memory


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The center of Smart molecular memory @ Dept. of Chem. , SKKU

Nanostructured molecular switch and memory Hyoyoung Lee

US-Korea NanoForum, 27-30Apr2009

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Current Commercial Memory

  • Digital-Camera, mp3, Cellular phone, Hand-held PDA, Notebook

Tera-bit Molecular Memory Device ME, High Density

Why working on molecular memory?

  • 2009. 02. 04, 500G, $170
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Metal electrode Au SiO2/Si substrate

Molecular Memory

Random Access Memory (RAM)

  • Volatile Memory
  • Non-Volatile Memory

Molecular Computer D-, S-RAM Flash Memory

  • Highly density memory
  • Cheap (Low-end product)
  • Various and flexible

Possible applications of the molecular memory

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Technology Performance Evaluation for Molecular Monolayer Memory

2007 년 ITRS Roadmap

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What is the major drawback?

Tae-Wook Kim, Gunuk Wang, Hyoyoung Lee,and Takhee Lee*, Nanotechnology 18 (2007) 315204

Summary of results for the fabricated devices. (Note: working and non-working devices were defined by statistical analysis with Gaussian fitting on histograms) Operational reliability! What is the major issue for improving a reliability? That is directly related to......device yield!

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What are the major issues when using SAMs?

  • 1. Stability of SAMs, thin films of organic molecules
  • Compactness, robustness, and film thickness of the SAMs
  • Stability of SAMs having functional groups vs only alkane (di)thiol
  • 2. Bottom/top Electrodes (metal)
  • Surface roughness of bottom metal electrode (btm)
  • Penetration of metal particles into the SAMs (top)
  • Surface area contacted on metal electrode

Metal electrode Metal electrode SAMs, thin films of molecules

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Real world in small, tiny land!

The length of SAM molecules, film thickness of SAMs: ~2 nm

~2 nm

Surface roughness , RMS of bottom electrode: ~1.4 nm

~1.4 nm Vapor deposition

<0.5 nm (Btm) (Btm) Top

Unavoidable Penetration!

What is your suggestion to improve our device yield? What do you say about film thickness?

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C Cl Cl Cl Cl O I I I NH O O I OH S C Cl Cl Cl Cl O I I I NH O O I OH S

Gold RB-(CH2)2SH

Surface : Au(800Å)/Ti(50Å)/Si

Self-Assembled Monolayer of RB

SH N H H N S H H SH N H H N S H H S N H H N S H H C Cl Cl Cl Cl O I I I O O I NaO S N H H N S H H C Cl Cl Cl Cl O I I I O O I NaO

RB-TUA-AUT Gold

C Cl Cl Cl Cl O I I I ONa O O I NaO

H2N SAc

C Cl Cl Cl Cl O I I I O O I NaO NH SAc

Bi-layer

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Thickness of RB-(CH2)2SH, AUT-AUT and RB-AUT-AUT using Ellipsometer

SAMs Theoretical value/ Å Observed value/ Å RB-(CH2)2SH 17 20 AUT-AUT 34 35 RB-AUT-AUT 46 45

C Cl Cl Cl Cl O I I I NH O O I OH S

Gold

C Cl Cl Cl Cl O I I I NH O O I OH S

15 Å

SH N H H N S H H SH N H H N S H H S N H H N S H H C Cl Cl Cl Cl O I I I O O I NaO S N H H N S H H C Cl Cl Cl Cl O I I I O O I NaO

RB-AUT-AUT Gold RB-(CH2)2SH 34 Å 12 Å

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10

I-V curves by using CP-AFM

1. RB-(CH2)2SH film show ohmic behavior 2. AUT-AUT film show insulating behavior 3. RB monolayer on the bilayered AUT exhibit hysteresis.

RB-(CH2)2SH AUT-AUT RB-AUT-AUT

  • G. S. Bang, …H. Lee*, Langmuir (IF. 4.0) 23, 5195-5199 (2007)
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11

What do you say about…in device?

Focused ion beam

  • Increasing the film thickness
  • Introducing H boning

to overcome the RMS of Au btm

  • Preventing the penetration of

Au NPs

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Current density-voltage (J-V)

  • Current density-voltage (J-V) characteristics of semi-log scale

Current density-voltage (J-V) characteristics; Normalized I-V curves between – 0.5 V and + 0.5 V (the inset) for the TUA-AUT device (black line) and the RB-TUA-AUT device (red line) in the nano via-hole with 170 nm diameter.

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Device yields depending on the length of molecules

S N H H N S H H C Cl Cl Cl Cl O I I I O O I NaO S N H H N S H H H S S C Cl Cl Cl Cl O I I I O O I NaO S S H

4.5 nm 3.8 nm 2.9 nm 1.9 nm

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High Reproducibility

Current density-voltage (J-V) characteristics for the RB-TUA-AUT device

  • G. S. Bang, …,…H Lee*, Small (IF 6.4), 4, 1399-1405 (2008).
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Molecular switch/memory

V i t i

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Possible molecules for molecular switches/memory

Fullerene, N-type

Fe

N N N N Zn

Porphyrin Ferrocene

What are other possible molecules for molecular switch/memory device?

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17

Synthesis of Ru(tpy)2 Derivatives

N N N RuCl3-3H2O N N N Ru Cl Cl Cl 1 equiv. RuCl3-3H2O 0.5 equiv. NH4PF6 NH4PF6 N N N H2C (CH2)nSAc N N N H2C (CH2)nSAc RU+2 N N N N N N R1(H2C)m (CH2)nR2

R1=R2=SAc, m=n=0 R1=SAc, R2=H, m=n=0 R1=R2=SAc, m=n=7 R1=SAc, R2=H, m=7, n=0 R1=R2=SAc, m=n=13 R1=SAc, R2=H, m=13, n=0

2PF6

  • Ru2+ ---> Co2+ , Fe2+ (got now)

Electron Donor (metal)-Acceptor (Ligand, tpy) e-

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N N N X Ru2+ N N N n S S S S S

  • r

Au (111) X = H, SAc, and S-AuNP n = 0, 7, and 13

Scheme of RuII complexes incorporated in an ordered n-alkanethiol SAM

  • n Au(111)

A voltage-driven molecular switch

SH SH N N N SAc Ru

2+

N N N SAc

AuNP i

Measurement system (STM) of the solid state

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19

71nm

A single AuNP

Bundles of AuNPs

1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 5 10 15 20 25

Count Tip bias voltage/V

I-V characteristics of a Au-NP/RuII(tpyS)2 incorporated 1-

  • ctanethiol (OT) SAM on Au(111), Dithiol

STM image at a constant tunneling current

  • f 20 pA with a tip bias of 1.2 V

Histograms of threshold voltage for current switch-on in the single Au-NP/RuII(tpyS)2 junctions

  • 3
  • 2
  • 1

1 2 3

  • 2.5
  • 2
  • 1.5
  • 1
  • 0.5

0.5 1 1.5 2 2.5

C u rre n t/n A

1 4 6 2 3 5

Current-voltage (I-V) characteristics

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E/V vs. SCE

  • 2.0
  • 1.5
  • 1.0
  • 0.5

0.0 0.5 1.0 1.5 2.0 Current/µA

  • 40
  • 20

20 40 60

Cyclic voltammogram for a 3 mM RuII(tpy)(tpyC13SAc) solution in acetonitrile using a glassy carbon electrode. Ru-centered redox reaction, +1.2 VSCE (RuII – e-RuIII) Ligand-centered redox reaction,

  • 1.2 VSCE (RuII(tpy)(tpy)]2+ + e-(RuII(tpy)(tpy)-]2+

The redox formal potentials can be converted to the vacuum levels; Hipps et al. [4.7 eV + (1.7)Eox(SCE)1/2] and Armstrong et al [4.7 eV + Ered(SCE)1/2] 1.Energy levels of the first metal-centered oxidation, 6.74 (Vox = 4.7 eV + (1.7) x 1.2 = 6.74 eV ) 2.Energy levels of the first ligand-centered reduction are 3.4 V (Vred = 4.7 eV - 1.2 = 3.4 eV) below the vacuum. πM LUMO, HOMO,

  • 3.4 eV
  • 6.74 eV

E0 π*

L

Redox formal potentials to the vacuum levels

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Proposed charging process into the ligand-centered LUMO of RuII terpyridine complexes

  • Typical I-V characteristics through molecular junctions of RuII(tpy)(tpyC7S) showed significant conductance

switching to a high conductance state approximately at 1.7 V.

  • The threshold voltage of switch-on is comparable to the first redox formal potential of the terpyridine ligand

supported on gold.

πM LUMO, HOMO,

  • 3.4 eV
  • 6.74 eV

E0 π*

L

e-

  • 5.6 eV

Negative Bias

  • 5.1 eV

Vbias = ∆r Sample Tip

1.7 V

  • 3
  • 2
  • 1

1 2 3

  • 2.5
  • 2
  • 1.5
  • 1
  • 0.5

0.5 1 1.5 2 2.5

C u rre n t/n A

1 4 6 2 3 5

Current-voltage (I-V) characteristics

  • K. Seo, … H. Lee*, J. Am. Chem. Soc. (IF 7.9), 130(8), 2553-2559, 2008

Electron Tunneling through an Alkyl Chain-Tethered Metal Complex Molecular Switch Junction

  • K. Seo, … H. Lee*, Chem. of Mater., submitted, 2009

1st understanding of the charging Process of the molecules at the solid state Molecular Electron Transport on Structural Phase Transition in a Large Area Junction

  • K. Seo, H. Lee*, ACS Nano., accepted, 2009
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Fabrication of Molecular Monolayer Non-Volatile Memory (MMMVM)

단분자막

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Write-multiple read-erase-multiple read (WRER) cycles

  • J. Lee, …H. Lee*,

will be submitted to Adv, Func. Mater, , 200

1st Molecular Monolayer Non-Volatile Memory (MMMVM) w/ voltage-driven

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SEM image of an In2O3 nanowire FET Schematic diagram of the In2O3 nanowire FET device

Intrinsic Properties of Ru complexes and memory w/NW

  • 1. M. Jung …H Lee* and J. Kim*, Quantum interference in radial heterostructure nanowires,

Nano Letters, 8, 3189, 2008

  • 2. M Jung, H Lee*…, Short-channel effect and single-electron transport in individual indium
  • xide Nanowires, Nanotechnology, 18, 435403, 2007.
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25 IDS-VG characteristics of the In2O3 nanowire FET device IDS-VG characteristics of the In2O3 nanowire FET device modified with Ru SAM

Electron Transport through Individual Indium Oxide Nanowire

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26 Reversible switching operations in the write, read, erase and read voltage cycles; writing, reading and erasing voltages (VG pulses for 1 s) are −15 V, −6 V and 15 V, respectively. IDS versus retention time for the In2O3 nanowire FET in an ON current state (red line) and an OFF current state (black line).

I, Choi, …H Lee*, Charge Storage Effect on In2O3 Nanowires with Ruthenium Complex Molecules, Applied physics express, 2, 015001, 2009

Electron Transport through Individual Indium Oxide Nanowire

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27

Decal Transfer µ-Contact Printing Nanoinprinting Light Stamp

PDMS

substrate

Mold Resist Substrate Imprint(press mold) Remove mold Pattern transfer (reactive ion etching)

substrate

UV PDMS UV

substrate substrate

Electrode patterning w/soft Lithography

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Nano-Imprint Lithography: Stamp Design

Unit cell size : 1180X1180um2 Main pattern : line width/line space 40/75, 50/75

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600nm

0.0 0.50 1.0 1.5 0.0 50.0 100.0

X[µm] Z[nm]

Dimension : 1180*1180um2 Pad Size : 50um2

  • 1. Stamp or Mold (on a quartz)

AFM morphology of quartz mold

50 (Width)/75 (Space) nm

SEM image

Nano-Imprint Lithography: Stamp

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Nano-Imprint Lithography: Stamp Design II

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  • 1. PMMA coating

Si substrate PMMA Resist

Fabrication Process for Bottom Layer

  • 2. Resin coating
  • 3. Stamping (UV)

STAMP

  • 4. Detaching
  • 5. Residual layer removing (RIE)
  • 6. Metal deposition (Ti/Au)
  • 7. Lift off

Si Au

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Pictures in Etching Process

  • 1. After Imprinting

After Lift-Off

  • 2. After RIE

Positive Negative

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Fabrication Process for Top Layer

Si substrate PMMA Resist Resist Resist Resist STAMP

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60 nm (width)/130 nm (space)

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50 nm electrode PSS Amino C60 PEDOT

Au bare Au + OTS Au + SAMs + LBL

Patent : Korea 2008-0072940, US pat. Pending

Selective nano-patterning using Layer-by-Layer

Will be submitted to XXXX. 2009

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Selective Patterning of LBL Nanolines SEM Analysis

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Selective Patterning of LBL Nanolines

Will be submitted soon

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Thank you very much for your attention