SLIDE 11 DRAM FIT Model Availability /MTTF Model
TCO Model
DIMM FITS_CE Total extra servers Component MTTF for replacement ECC technique System configuration DIMM FITS_DUE HW and SW repair options and their MTTR DIMM FITS_NDE Fits per mode(transient, permanent, physical location) #devices/DIMM DC configuration Device width/size DRAM Grade Factor Model for proactive replacement Maintenance model for replacement
#DC servers Energy Model Server Performance Model Server Energy DIMM Cost Model DIMM cost Device size DRAM frequency
Published Data
ECC technique #devices/DIMM Device width DRAM brand DRAM technology Server configuration (#cores,Interleaving type, #channels, DIMMs/channel) Performance Degradation (PD) #threads for Online Service #threads for Offline Service
Published Data
#threads for Online Service #threads for Offline Service DRAM SDC Derating Model DIMM Derated FITS_NDE Server Configuration
System Reliability (MTTF_SDC) TCO
#threads for Online Service #threads for Offline Service Utilization Profile per day for the online service Thermal Model Non DRAM component Reference MTTF #threads for Online Service #threads for Offline Service Component Temperature ECC technique Server configuration (#cores, Interleaving type, #channels, DIMMs/channel) ECC technique Server configuration (#cores,Interleaving type, #channels, DIMMs/channel) Reference ECC technique Component Reference Temperature Average Utilization
Published Data
NDE Derating Factor DIMM FITS_SDC Server configuration (#cores,Interleaving type, #channels, DIMMs/channel) Target Reliability
Proposed framework (AMPRA tool)
MICRO 48, Waikiki, Hawaii 11