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Modeling of substrate behavior and design rule extraction for - - PowerPoint PPT Presentation

IMI Inkjet Development Conference 2018 Modeling of substrate behavior and design rule extraction for printing Jakko Nieuwenkamp Reden B.V. 1 IMI Europe Inkjet Development Conference Contents Introducing Reden Substrate


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IMI Inkjet Development Conference 2018

Jakko Nieuwenkamp Reden B.V.

Modeling of substrate behavior and design rule extraction for printing

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IMI Europe Inkjet Development Conference

Contents

  • Introducing Reden
  • Substrate handling

– Example 1 – Example 2 – Example 3

  • Analysing 3D printed structures
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Introducing Reden

DOMAINS

Thermal Mechanical Acoustic Fluid and gases Multi physics

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Substrate handling Example 1

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Goal: Optimize the design for paper transport and alignment. Steps: 1. Create and validate a model 2. Model reduction for easy optimization and evaluation (DoE) 3. Optimize the design

Paper sheet Transportation wheel Table Wheel skew

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Example 1 DoE

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Example 1 MrReves

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Substrate handling Example 2

Example process Step 1: Paper is transported with a relative high moisture content Step 2: Paper is dried Step 3: Ink is applied (increase in moisture level in two steps) Step 4: Final transport

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Substrate handling Example 3

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Analyzing 3D printed structures HYBMAN project

Goal:

Hyb-Man exploits the combination of additive manufacturing (also referred to as 3D printing) and 3D integration of electronic parts.

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Analyzing 3D printed structures HYBMAN project

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Photo courtesy of Neotech AMT

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Analyzing 3D printed structures Goals

Question: What’s makes the analyses of 3d printed structures complicated? Answer:

  • The printing process settings effect the material behavior significantly

– Anisotropic structural and thermal material behavior – Micro scale geometry influences the macro structure (multi scale)

  • Significant residual stresses and unwanted deformation can occur during the printing

process

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Analyzing 3D printed structures Goal

Goal:

Develop analyses methods that allow us to predict the performance of 3D printed objects with integrated electronics.

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Analyzing 3D printed structures 2 Step approach

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Printing path Process parameters Printed part Location dependent material behavior Processed geometry Residual stresses Loading Performance Stress Strain Temperature Building material

Product analyses

Process analyses

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Analyzing 3D printed structures Process analyses

Prediction of:

  • Thermal field
  • Residual stresses
  • Geometry on micro level
  • Material behavior on macro level

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Analyzing 3D printed structures Process analyses

Prediction of:

  • Thermal field
  • Residual stresses
  • Geometry on micro level
  • Material behavior on macro level

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Analyzing 3D printed structures Process analyses

Prediction of:

  • Thermal field
  • Residual stresses
  • Geometry on micro level
  • Material behavior on macro level

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Analyzing 3D printed structures Product analyses

Prediction of:

  • Thermal field
  • Stress/strain field
  • Failure

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Photos courtesy of Philips

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Analyzing 3D printed structures Product analyses

Prediction of:

  • Thermal field
  • Stress/strain field
  • Failure

18 Metal Heat Sink 0.5 Watt Heat Source ℎ𝑑𝑝𝑜𝑤 = 5 𝑋/𝑛2𝐿; 𝜗 = 0.8; 𝑈

𝑠𝑝𝑝𝑛 = 20 °𝐷

Symmetry plane

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Analyzing 3D printed structures Product analyses

Prediction of:

  • Thermal field
  • Stress/strain field
  • Failure

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Resulting stiffnesses

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IMI Europe Inkjet Development Conferences 2018

Jakko Nieuwenkamp j.Nieuwenkamp@reden.nl, www.reden.nl

Thank you for your attention?