Meyer Burger welcomes the delegates to WRETC Are your ready for the - - PowerPoint PPT Presentation

Meyer Burger welcomes the delegates to WRETC Are your ready for the next solar wave ?

Passionate about PV

«We will shape the future energy mix by combining leading technology with the infinite power of the sun .» «We will further develop the photovoltaic, semiconductor and other high-end niche markets using both new and exisiting technologies.»

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From ingot to solar module to complete BIPV energy system

Meyer Burger, WRETC 2013

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PV will play a key role in a sustainable future mix

Potential : 2050 scenarii according to IEA

Meyer Burger, WRETC 2013

Learning curve

Source: ISE, MBT

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Cumulative installed capacity [GWp]

d [µm] = 400 300 200 100 50

ηcell [%] = 10 15 18 20 22 25

[€/Wp] 100 10 1

1980 1990 2000 2004

1 10-2 10-3 10-4 102 103 10-1 10

2007

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2012 2020

80% experience curve: cost reduction appr. 10% pa. But 2012: 60% in one year

• > 6 years in advance

60%

Meyer Burger, WRETC 2013

0.3 0.6 0.9 1.2 1.5 2010 2011 2012 2013 2014 2015 Modul prices Modul cost

Solar modules cost/price development

Source: PVinsights & Management estimates. Note: Average price for end-user for installed on-roof systems up to 10 kWp.

Difficult market environment for cell and module manufacturers

– Price decline in solar modules puts enormous pressure on module manufacturers – however, it is necessary to reach and keep grid parity – Cell and module manufacturers still cautious on undertaking any major investments – Cost-/price ratio disadvantage of solar modules expected to reverse

5 profit

US$/Wp

E E E E

Meyer Burger, WRETC 2013

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PV Industry Drivers

Cell & module efficiency, yield, uptime, TCO Performance ratio, longevity, BOS

LCOE = Total life cycle cost Total life cycle energy production

TCO = Total cost of ownership LCC = Life cycle cost OEE = Overall equipment effectiveness

VDMA 34160 : 2006-06; SEMI E35, SEMI:E 79

BOS = Balance of system PR = Performance ratio

Solar systems Mono- /Multi c-Si Ingot/Wafer slicing Solar cells Solar modules

$ Wafer $ Wp $ kg $ Wp $ kWh

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MES automation system

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Customer and global services (training, ramp up, maintenance) Customer and global services (feedback)

Meyer Burger, WRETC 2013

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Material Utilization Thin Wafer / Wire

Yield

>80% >95% >90% Line Utilization Yield Improvement WaferLine CellLine

High efficient cell technology 3 strategic initiatives

Disruptive wafering technology

Diamond coated, Ni plated

Combine best in class wafering

Meyer Burger, WRETC 2013

Heterojunction – more power per surface and more yield at high temperatures

Thin-film Low efficiency High harvesting factor in hot climates High BOS

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HJT Technology High efficiency High harvesting factor in hot climates Proven process steps Crystalline technology high efficiency Proven, reliable technology

Meyer Burger, WRETC 2013

Standard process MB-HJT process

CZ :18,5% MC: 16,8- 17% CZ: 18,5%- 19% MC: 17%-18% CZ n-type: 20~23%, potencially to reach even 24% in soon future

Selective Emitter process

Texture Doping / Diffusion PSG Etch Firing Test & Sort Print Rear Side AR Coating Print Front Side Texture a-Si Front/ Rear Side Test & Sort TCO / Metal Rear Contact Print Front Side Curing Edge Isolation Texture Doping / Diffusion PSG Etch Firing Test & Sort Print Rear Side AR Coating Print Front Side Edge Isolation Additional ??? 9

Reduced complexity with MB-Cell-Technologies

Additional ??? Additional ??? Additional ???

AlOx layer SiNx layer Laser openings Al Screen print Local Al-BSF

p-type wafer

Texture Emitter SiN layer FS Metallization Si material

Texture Doping / Diffusion PSG Etch Firing Test & Sort Print Rear Side AR Coating Print Front Side Edge Isolation

MB-iPerc upgrade

AlOx passivation layer SiNx Capping layer Laser contact opening Low temperature (< 250°C) processes Reduced complexity

Meyer Burger, WRETC 2013

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Smart Wire Connection 5% higher power output 10% higher energy yield

Rays descending on a bus bar tabbing (left) and on a round wire (right). The wire can be divided into three regions: Black arrows indicate the descending rays, green rays will reach the surface of the cell and red rays will not reach the surface. Source: Stefan Braun, University Konstanz

• Highly effective front side without shading by bus bars
• Higher sensitivity in regard of partial cell shading
• Higher light efficiency based on the better light trapping
• 80% less silver consumption
• Route to very thin wafers

Meyer Burger, WRETC 2013

PECVD PECVD SCREEN PRINT CHARACTERIZATION

Diamond wire wafering

• > thinner wafer -> lower costs

High efficiency

• > lower system cost (BOS)
• > independent of wafer thickness

Only 6 process steps

• > low COO

Temperature coefficient

• > higher energy yield

Bifacial -> higher energy yield TCO layer and wafer thickness suitable for SmartWire

• > 80% less silver,
• > higher energy yield
• > higher efficiency
• > longevity
• > microcrack resistent
• > less sand dust sensitive

Adapted test metrology

• > high cap cells
• > BB0
• > dragon back
• > PED (Chipping)

Single wafer tracking

HJT cell texture + surface preparation i/n Si i/p Si Front contact Back contact contacting test & sort WET PVD PVD

2 1 3 1 2 3 4 4

MB technology road map at a glance

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Meyer Burger, WRETC 2013

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Achievements – Temperature Coefficient

• 0,20 %/K on Cell level!
• 0,22 %/K on Module level!

Excellent Temperature Coefficient certified by Fraunhofer ISE CalLab and TÜV Rheinland!

Meyer Burger, WRETC 2013

DAMP HEAT 1000h IEC 2000h 5000h 8000h MB HJT

• 0.7%
• 1%
• 1%
• 8%

Even after 5000 hours of Damp Heat testing Meyer Burger HJT modules still stable without power losses. Fully compatible with IEC conditions (< 5% power loss) Even after 8000 hours damp heat still working with only 8% power loss Higher longevity

HJT – SmartWire Technology

Damp Heat Test

Damp Heat Testing up to 8000h (8 x IEC) !

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Meyer Burger, WRETC 2013

We think in material-Process flows & act on technologies

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1 GW-fab 160MW cluster

AlOx layer SiNx layer Laser openings Al Screen print Local Al-BSF

p-type wafer

Texture Emitter SiN layer FS Metallization Si material

Latest single technologies

Fab-level Material-Process flow Technology

Meyer Burger, WRETC 2013