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Geometry Optimization of an Electronics Cooling Case Aaron Godfrey, - - PowerPoint PPT Presentation
Geometry Optimization of an Electronics Cooling Case Aaron Godfrey, - - PowerPoint PPT Presentation
Optimate+ Case Study: Flow and Geometry Optimization of an Electronics Cooling Case Aaron Godfrey, Application Engineer 03/20/2013 Outline Problem Description Geometry Parameterization Mesh Settings Results Problem Statement
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Problem Statement – Electronics Cooling Optimization
Electronics equipment cooling (representative of customer projects) Each Ball Grid Array (BGA) to be fitted with one aluminum heat sink Maximum temperature on BGA chips of 85 C Minimize heat sink mass
BGA’s
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Optimate+ = STAR-CCM+ add-on available through user portal
– Creates all necessary scripting – Submits and monitors jobs – Collects the simulation data – Post-process the study
HEEDS = Software developed by our partner Red Cedar Technology that Optimate+ couples with
– Allows access to DOE, optimization, and post-processing capability
SHERPA = Adaptive global/local optimization algorithm from Red Cedar Technology
Terminology
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Geometry Parameterization – Casing
Casing CAD parameterization
– Exhaust Translation
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Geometry Parameterization – Heat Sinks
Heat sink CAD parameterization – Pin Height – Ellipse Major Radius – Ellipse Minor Radius – X Fill Percentage – Y Fill Percentage – Radii Ratio
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Pipeline Mesh Operations – New in 8.02
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Mesh
Polyhedral mesh with body fitted prism layers on all solid/fluid interfaces Conformal interfaces between all solid/solid, solid/fluid, and fluid/fluid contacts Mesh sizes ranged from 1.5M cells to 9M cells – this is entirely a function of heat sink design
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Optimization algorithm: SHERPA Objective Function: Min DeltaT, Min Mass with 3:1 weighting 183 Designs with 8 parallel runs on 8 cores each
– 64 cores for 4 days
Optimate+ Project Settings
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Results – Design Iterations
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Results – Objective and Performance History
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Results – Top 40 Designs
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Results – Parallel Plots
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Results – Parallel Plots
All Designs 100 Best Designs 50 Best Designs 25 Best Designs
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SHERPA identified Optimum:
– Exhaust Translation near minimum – Ellipse Major Radius at maximum – Ellipse Minor Radius at minimum – X Fill Percentage at maximum with some spread (expected) – Y Fill Percentage at minimum – Pin height at maximum – Radii Ratio towards maximum with significant spread
Results – Optimum Design
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Results – Temperature Isosurface
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Results – Boundary Heat Flux
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Results – Line Integral Convolution
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Results – Line Integral Convolution
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Results – Streamlines
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Possible Alternative Analysis
Complete multi-objective optimization using MO- SHERPA would allow for full resolution of Pareto front between two objectives Additional analysis of any of the three local optima found by SHERPA using the DOE capability inside Optimate+ could give more insight into trends and relationships Expanding design space where possible for parameters where the optimum value was at the min or max allowed
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Ruben Bons – CD-adapco, Electronics Sector Manager
Mike Dombroski – CD-adapco, Application Engineer and Developer of
Optimate(+) Matt Janeway – CD-adapco, Application Engineer Marcus Rademacher – Red Cedar Technology, Sr. Engineering Analyst
Recognition
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