HUAWEI TECHNOLOGIES CO., LTD.
Enhancing Remote Healthiness Attestation for Constrained IoT Devices
- Y. Jia, B. Liu, W. Jiang, B. Wu, C. Wang
IEEE ICNP 2020 Madrid, Spain, October 13-16, 2020
for Constrained IoT Devices Y. Jia, B. Liu, W. Jiang, B. Wu, C. Wang - - PowerPoint PPT Presentation
Enhancing Remote Healthiness Attestation for Constrained IoT Devices Y. Jia, B. Liu, W. Jiang, B. Wu, C. Wang IEEE ICNP 2020 Madrid, Spain, October 13-16, 2020 HUAWEI TECHNOLOGIES CO., LTD. IoT Devices are keeping losing control IoT devices
HUAWEI TECHNOLOGIES CO., LTD.
IEEE ICNP 2020 Madrid, Spain, October 13-16, 2020
IoT devices remain vulnerable… Hackers are lunching DDoS with IoT devices…
Mirai attacks…
Peak 1.7 Tbps
IoT Devices
Constrained Resources… Market Shaping Hacking Hacker Unaffordable Security mechanisms IoT Hacked!
Started Power off
BOOTUP Trusted boot mechanism
Credentials
Endorsed by Trusted Module
STEP 1 STEP 2
Trusted Module Running IP Network Channel
Pull the Credentials With the Trusted Module endorsement Trusted Boot Remote attestation
symmetric crypto DICE asymmetric crypto DICE
① ②
Standardized by 2020 Standardized by 2018
Device Side Verifier Side
DICE Engine [SK*] Layer 0
[SK0]
Layer 1
[SK1]
Layer 2
[SK2]
Layer n
[SKn]
… …
Signed by SK* Certificate 0
PK0
Signed by SK0 Certificate 1
PK1
Signed by SK1 Certificate 2
PK2
Signed by SKn-1 Certificate n
PKn … … Hash(L0) Hash(L1) Hash(L2) Hash(Ln)
Signed by SK* Certificate 0
PK0
Signed by SK0 Certificate 1
PK1
Signed by SK1 Certificate 2
PK2
Signed by SKn-1 Certificate n
PKn … … Hash(L0) Hash(L1) Hash(L2) Hash(Ln)
Signed by SKCA Certificate IDevID
PK* DTLS Handshake [Authentication]
Database H0 | H1 | H2 | H3 | … | Hn BOOTUP Signed by SKCA Certificate ROOT
PKCA Prerequisites
The higher the layer is, the more functions and attacking surface there will be.
Bootup layer by layer
Design Key:
for the DICE Engine itself, and thus inaccessible by any other layers;
The validation is based on the certificate-chain
ID PSK* DICE UDS*
… …
Secret0=HMAC(UDS, H(L0))
Layer 0 Secret 0
Secret1=HMAC(Secret0, H(L1))
PSK=KDF(Secretn) Layer 1 Secret 1 Layer 2 Secret 2 Layer n Secret n Layer n-1 Secret n-1
Secret2=HMAC(Secret1, H(L2)) Secret3=HMAC(Secret2, H(L3)) Secretn=HMAC(Secretn-1, H(Ln))
Database H0 | H1 | H2 | H3 | … | Hn Database UDS DTLS Handshake [Authentication]
BOOTUP
ID Firmware Version PSK
Device Side Verifier Side
Key Points
The validation is based on the Hash-chain
The design principles are all the same as the Asymmetric crypto based DICE
The Algorithm is the same as the device boot up
Algorithm
Firmware Version
Consistency Validation
Credentials H323CD87LKUE7BGH…
Unconstrained IoT Devices(Powered) Constrained IoT Devices(Battery)
e.g. TEE Credentials 7LK5UE27B5GHFEG3Y… Steal the credential By access devices physical or remotely
NOTE:DICE DO NOT offer the capability of the secure storage
Impractical Possible Hardware Level Protection Software Level Protection
Replay…
The credential is static… Once stolen the replay attacks survives…
Direction 1:Replay attack resilience Direction 2:adaptive for the constrained IoT Devices Direction 3:Fine-grained firmware attestation
DICE
Main Consideration
Static Dynamic Convert the Credential from STATIC to DYNAMIC !
SEED Nonce Counter Timestamp
UDS
KEY0
… …
KEY0=HMAC(UDS, CNT) Secret0=HMAC(LUDS, H(L0))
Secret0 Layer 1 KEY1
KEY1=H(KEY0)
Secret1
Secret1=HMAC(KEY0, H(L1))
KEYn
Secretn=HMAC(KEYn-1*, H(Ln))
Secretn
BOOT
… …
PSK=H(D)
KEYn=H(KEYn-1)
CNT+1 Every time bootup
D = (Secret0, Secret1, Secret2, … , Secretn)
CNT
DTLS Handshake [Authentication]
Device Side Verifier Side
Algorithm
PSK* Database H0 | H1 | H2 | H3 | … | Hn Database UDS ID Firmware Version PSK
The Algorithm is the same as the device boot up
DICE Layer 0
D* D ID Firmware Version
Consistency Validation
Layer n KEYn
CNT
OTHER OPTIMIZATIONS
CHALLENGE 2:Computationally costly
CHALLENGE 1:Replay Attack
CHALLENGE 3:Coarse-grained attestation
UPDATE 2:Extreme constrained IoT
UPDATE 3:Hacked Layer Identification
have been hacked.
UPDATE 1:Resilient for Replay
been imitated by the replay attacks. DICE [Asymmetric]
DICE+
DICE [Symmetric]
HUAWEI TECHNOLOGIES CO., LTD.
IEEE ICNP 2020 Madrid, Spain, October 13-16, 2020