Development of a QC method for assembly of heat conductive material - - PowerPoint PPT Presentation

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Development of a QC method for assembly of heat conductive material - - PowerPoint PPT Presentation

Development of a QC method for assembly of heat conductive material on new ATLAS pixel sensor module Yuji Onishi Yamanaka Lab Yuji Onishi 01 Year-End Presentation 2019/12/23(Mon) Yuji Onishi 2 5~10 times of LHC (250 fb -1 per year)


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SLIDE 1

Development of a QC method for assembly of heat conductive material

  • n new ATLAS pixel sensor module

Yuji Onishi Yamanaka Lab

Yuji Onishi

01

Year-End Presentation 2019/12/23(Mon)

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SLIDE 2

Yuji Onishi

2

  • LHC will be upgraded to HL-LHC

  • Large Hadron Collider
  • proton - proton collision in √s = 13 TeV.
  • Luminosity ~ 1034cm-2s-1
  • Integrated luminosity ~ 200 fb-1 (until 2018, run2)

  • High Luminosity LHC
  • Luminosity 


5~10 times of LHC
 (250 fb-1 per year)

  • Integrated luminosity


3000 fb-1 12 year after upgraded

introduction

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SLIDE 3

Yuji Onishi

3

  • ATLAS inner pixel detector will be upgraded for HL-LHC

introduction

Pixel detector For HL-LHC, we will upgrade the pixel detector. To upgrade, we have to do

  • mass production
  • QA/QC ( Quality Assurance/Quality Control )
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SLIDE 4

Yuji Onishi

4

  • in production of new pixel sensor module
  • Cooling Cell (carbon) will be loaded
  • Because front-end ASIC generate heat (10~20W).
  • Connected to Cooling pipe

introduction

ASIC ASIC sensor silicon FPC Cooling Cell

Thermal glue

Cooling pipe

  • with bad glueing,


we can not cool the sensor enough. we must detect those “thermal bad” module.

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SLIDE 5

Yuji Onishi

5

  • how to detect “thermal bad”
  • candidate methods
  • leakage current
  • surface temperature gradient


  • by comparing health module and intentional bad module, we

can know the behaviour of thermal bad.
 


  • Now I am evaluating the sensitivity of these methods

introduction

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SLIDE 6

Yuji Onishi

6

  • procedure
  • prepare temperature monitor system 

  • Now going on measuring the leakage current and surface

temperature with health FE-I4 module


  • same measurement with intentional bad thermal conduction
  • exam)

  • use module which is intentionally failed to glue,

  • bad contact between Cell and cooling pipe

introduction

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SLIDE 7

Yuji Onishi

7

  • Temperature monitor
  • measure the NTC resistance
  • NTC means thermistor which has negative 


temperature coefficient

  • calibrate by using 


Steinhart-Hart equation

Temperature monitor system

A,B,C is coefficient,
 T is temperature, R is NTC resistance

In calibration, I put 8 NTCs and digital thermometer into the climate chamber. calibration looks good.
 (NTC6&7 is not important)

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SLIDE 8

Yuji Onishi

8

  • setup to measure the leakage current & surface temperature

measuring setup

  • attach NTCs on surface of sensor module with thermal paste.
  • read the resistance of module NTCs with multimeter.


( 2 NTCs already implemented on module flex)

  • with cables connected (HV, LV, LAN)

digital thermometer & humidity sensor

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SLIDE 9

Yuji Onishi

9

  • setup to measure the leakage current & surface temperature

measuring setup

  • purpose :
  • to know behaviour of below values at several temperature
  • leakage current
  • surface temperature

  • To do so,
  • I measure these values 


changing climate chamber temperature
 w/ and w/o ASIC working. NTC0 NTC1 NTC2 NTC3 NTC4 Sensor module

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SLIDE 10

Yuji Onishi

10

  • setup to measure the leakage current & surface temperature

measuring setup

  • To confirm temperature readout,


check NTC temperature without ASIC operation

  • NTC 0~4 is on module surface.
  • NTC5 is on readout PCB board
  • NTC 6,7 is on air.

It looks good to measure surface temperature NTC0~4 is almost same temperature

it means all NTC measure the temperature of same silicon plate

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SLIDE 11

Yuji Onishi

11

  • Now going on measuring leakage current & surface temperature

measurement

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SLIDE 12

Yuji Onishi

12

  • I am working on development the method how to detect “thermal

bad”

  • I am trying two candidate way
  • leakage current & surface temperature gradient

  • I prepared 


Temperature monitor system & measurement setup


  • I am going on measuring leakage current & surface temperature

Summary

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SLIDE 13

Yuji Onishi

13

Prospects

  • I will continue to measure the leakage current and surface

temperature with health module


  • same measurement with intentional bad thermal conduction
  • exam)

  • use module which is intentionally failed to glue,

  • make bad thermal contact between Cell and cooling pipe
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SLIDE 14

Back up

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SLIDE 15

Yuji Onishi

15

  • circuit

(for humidity) NTC reference resister ~10kΩ 4.6kΩ

monitor system

ADC 5V GND