CRYO Path Forward April 6, 2020 Presented by: Gunther Haller - - PowerPoint PPT Presentation

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CRYO Path Forward April 6, 2020 Presented by: Gunther Haller - - PowerPoint PPT Presentation

CRYO Path Forward April 6, 2020 Presented by: Gunther Haller Director, Advanced Instrumentation for Research Division Technology Innovation Directorate Consortium agreed on a Downselect Process DUNE DocDB 6658 (12/17/2018) CRYOs role is


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SLIDE 1

CRYO Path Forward

April 6, 2020

Presented by: Gunther Haller Director, Advanced Instrumentation for Research Division Technology Innovation Directorate

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SLIDE 2

Consortium agreed on a Downselect Process DUNE DocDB 6658 (12/17/2018)

CRYO’s role is defined to be an “alternative” to baseline. NOT just a “risk mitigation”

  • “Testing Strategy and Decision Tree” treats 3-chip and CRYO completely

symmetrically

  • “DUNE will plan for systems tests of the baseline and alternative options in both

the CERN Cold Box and in the LArIAT cryostat with a small liquid argon TPC.”

  • Decision to be based on criteria defined by the consortium
  • Plan is for downselect to happen in February 2021
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SLIDE 3

CRYO Technical Status

Full all-in-one system functionality demonstrated in DUNE v1 (very first prototype)

  • Performance agreed with simulations in almost all aspects
  • Measured noise levels higher than simulated. However: Discrepancy due to system issues, such as test board layout.

○ New cold test board correcting layout noise issues is currently being fabricated at PCB factory

  • A couple of minor technical issues were fixed in nEXO version 1 (front-end optimized for nEXO)
  • Bench tests can start as soon as when PCB board is received

First nEXO version 1 received from foundry in February 2020 (development and fabrication funded by nEXO)

  • This version is optimized for nEXO
  • Stepping stone towards next 2nd prototype DUNE Cryo ASIC, might be final version.
  • Front-end in nEXO V1 optimized for nEXO low capacitance, but simulated noise is within 10% of DUNE-optimized version

nEXO V1 is suitable for system test at FNAL ICEBERG

  • In schedule for Summer 2020

2nd prototype optimized for DUNE (V2) is planned for system test on ProtoDUNE Cold Box (mainly cable driver and putting back DUNE amplifier, minor modification)

  • 2nd DUNE Cryo V2 ASIC expected back from fabrication August 2020
  • Cold Box test in schedule for late fall 2020/early winter 2021

CRYO will be ready by the down-select date Feb 2021

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SLIDE 4

Remaining work for the two options

3 ASIC type solution (amplifier, ADC, communication ASICs)

  • At least one more iteration is planned for each of the 3 ASICs
  • There is still a PCB to be implemented with all three types of ASIC mounted and tested: warm or cold
  • Functionality and performance of the three-ASIC system still needs to be shown
  • Initial tests from testing of LArASIC+ColdADC+FPGA (instead of COLDATA) on 40% APA reveal issues

Cryo ASIC

  • Just received nEXO V1 (also works for DUNE)
  • All three function blocks (amplifier, ADC, communication) has been shown to work in one ASIC
  • Noise performance to be tested (DUNE V1 had higher noise, but likely cause PCB, new PCB is in fabrication)
  • nEXO V1 ASIC (in bench testing this month) will be tested in ICEBERG
  • Demonstration of cold noise and system performance already before DUNE V2
  • Opportunity to demonstrate complete system performance in TPC environment planned for Summer 2020
  • The Feb-2020 review comment that 3-ASIC solution is further ahead is not an accurate assessment of the situation in our view, in fact the Cryo ASIC is

much closer to having a complete system running on a board

DUNE Cryo ASIC path forward is simpler, shorter, cheaper, and lower risk (which will be retired with ICEBERG test)

○ All three system blocks already working together (in one ASIC) ○ Iteration of only one ASIC (DUNE V2), versus 3 different types

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SLIDE 5

Considerations for future budget impact to DUNE project

Remaining cost for DUNE project will be lower for single ASIC solution

  • Prototyping and Production
  • Single ASIC effort for further iterations, ASIC costs, design and testing labor will be less than for

a 3-ASIC solution

  • Final board design and system testing will be less complex in the single ASIC system
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SLIDE 6

Sharing of Schematics: Will be solved

  • DUNE requested to have the schematic shared since DUNE pays for the design
  • SLAC’s honoring of its NDA with TSMC has up to now prevented sharing of

schematics

  • SLAC legal has been looking into how to mitigate this
  • We are confident to resolve this
  • Possibly need to execute simple NDA’s between SLAC and collaborators

○ Work in process

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SLIDE 7

Additional SLAC physicist to work on DUNE: Bill Wisniewski

  • Bill Wisniewski is planned to start working on DUNE
  • Concentrating on SLAC contribution on Cryo ASIC and related

instrumentation

  • Bill has substantial experience in HEP detector instrumentation (Extensive

project management experience, BaBar Technical Coordinator, LZ, etc)

  • Bill just came off the LBNF-DUNE detailee assignment at DOE Headquarters

March 30

  • Could not start before for obvious reasons
  • Very positive addition for DUNE in many ways
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SLIDE 8

Path Forward: Recognizing and help mitigating DUNE’s budget problems

DUNE plans to support testing of nEXO version 1 which was just received (main items)

  • Coordinated with Nuclear Physics to share development and testing
  • Bench test
  • ICEBERG test
  • Hawaii FEMB fabrication
  • WIB firmware (BNL, Penn,...)

To complete the remaining work required for the down-selection:

  • SLAC will internally support development, fabrication and bench test of Cryo DUNE V2,

tailored prototype in preparation for ProtoDUNE Cold Box test

  • No cost to DUNE to develop, fabricate, bench test optimized Cryo DUNE V2 prototype

ASIC

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SLIDE 9

Consortium agreed on a Downselect Process DUNE DocDB 6658 (12/17/2018)

There is no justification to modify the Downselect process that was agreed to by all parties

  • SLAC’s contribution relieves budget pressure
  • DOE and SLAC have invested substantial funds and the cost to go to

down-select is small compared to the investment

  • Engineers have put in substantial effort based on agreement
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SLIDE 10

Conclusion

  • Cryo ASIC development on track and large likelihood that Cryo DUNE V2, tailored to

DUNE, will meet requirements

  • Cryo schematics on path to be shared between collaborators
  • Clear potential benefits to DUNE of single integrated version ASIC: Lower future

project cost (only one type of ASIC to produce and test, board simpler, etc)

  • Addition of experienced physicist Bill Wisniewski on Cryo, just coming off being the

LBNF-DUNE detailee at DOE

  • All cost for development, fabrication, and bench testing of Cryo DUNE V2 will be

contributed by SLAC

All concerns have been addressed and it is vital that the agreed down-select process be followed with both solutions on equal footing